The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components and a continuous core that is formed by distributing the encapsulant material uniformly around the substrate unit to define a consistent cross-sectional area for the magnetic path. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the encapsulant material is molded to seals air gaps to the substrate unit.

The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components, an upper core bonded on a first exterior surface of the substrate, and a lower core bonded on a second exterior surface opposed to the first side of the substrate. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the transformer includes encapsulant material that is dispensed over and between the components of the transformer to seal air gaps.

A two-card assembly includes: a first printed wiring board; a second printed wiring board; a first stiffener secured to the first printed wiring board, the first stiffener interposed between the first printed wiring board and the second printed wiring board; a second stiffener secured to the second printed wiring board, the second stiffener interposed between the first stiffener and second printed wiring board; a transformer mounting plate interposed between the first stiffener and the second stiffener; and a planar transformer secured to the transformer mounting plate. The transformer mounting plate dissipates heat from the planar transformer.

An Isolating Transmission Line Transformer (ITLT) for use in a data communications system is provided, the transformer comprising: a substantially planar substrate formed of electrically insulative material having opposed first and second surfaces; a first port formed of two separate terminals provided at one part of the substrate; a second port formed of two separate terminals provided at a second part of the substrate; a first conductor connected in series to the first port and arranged as a single loop; a second conductor which is electrically isolated from the first conductor and connected in series to the second port, the second conductor being arranged as a single loop in a substantially opposite orientation to the first conductor; wherein the first and second ports and at least part of the first and second conductors are provided on the substrate surface(s); and a core arranged between the first and second ports to cover the majority of the first and second conductors.

A transformer is provided, which includes a magnetic core, a primary coil module including a coil support arranged in the magnetic core and a primary coil formed on the coil support, an upper secondary coil module including an upper insulation molded body arranged on an upper portion of the primary coil module and an upper plate coil buried in the upper insulation molded body and arranged to face the primary coil, and a lower secondary coil module including a lower insulation molded body arranged on a lower portion of the primary coil module and a lower plate coil buried in the lower insulation molded body and arranged to face the primary coil.

An electromagnetic induction device, and a power supply apparatus and a display apparatus having the same are disclosed, the electromagnetic induction device comprising: a substrate layer comprising at least one substrate configured to be laid one upon another and a thin-film coil pattern, which is formed on at least one of both surfaces of the substrate and through which an electric current of a signal flows, the at least one substrate having an opening provided at an inner area of the thin-film coil pattern; a core configured to have a shape corresponding to a circulation path of magnetic flux generated by change in an electric current flowing in the thin-film coil pattern, and arranged to penetrate the inner area of the thin-film coil pattern through the opening of the substrate layer; and a heat dissipation layer disposed on one surface of the substrate, the heat dissipation layer configured to dissipate heat from at least one of the substrate layer and the core.

The disclosed configuration addresses the problem of heat dissipation in a thin flat-plate structure.

Disclosed example planar transformers include: a magnetic core; a first primary winding board secured to the magnetic core; a first secondary winding board secured to the magnetic core, wherein each of the first primary winding board and the first secondary winding board comprise: a first printed winding on a first layer of a circuit board; first and second mounting tabs on the first layer of the circuit board or a third layer of the circuit board, and coupled to the first printed winding; a second printed winding on a second layer of the circuit board; and third and fourth mounting tabs on the second layer of the circuit board or a fourth layer of the circuit board, and coupled to the second printed winding; and a first spacer to position the first primary winding board a predetermined distance from the first secondary winding board.

Coil patterns are provided in first and second outer surface layers and an inner layer of the board. First and second heat-dissipation patterns are provided in the second outer surface layer. A first thermal inter-layer connection member connects the coil pattern of the first outer surface layer and the first heat-dissipation pattern. A second thermal inter-layer connection member connects the coil pattern of the inner layer and the second heat-dissipation pattern. The coil pattern provided in the second outer surface layer and the first and second heat-dissipation patterns are separated from each other. An area of the second heat-dissipation pattern is larger than an area of the first heat-dissipation pattern.

The present disclosure relates to planar transformers including a plurality of circuit layers that are configured to reduce termination losses on at least one of the plurality of circuit layers. The plurality of circuit layers are stacked together in a first direction and include at least first and second circuit layers. The first and second circuit layers each include an electrically conductive trace forming at least one winding having a first termination portion and a second termination portion that are separated by a gap. The gaps of the first and second circuit layers are offset relative to each other in a second direction different from the first direction. The plurality of circuit layers may further include a third circuit layer, which includes an electrically conductive trace having a grounded portion that is disposed adjacent to at least one of the gaps of the first and second circuit layers.

The disclosure includes a planar transformer including a magnetic core, where a hole is formed on a surface of the magnetic core, and a PCB winding, where the PCB winding includes a first winding and a second winding. The first winding is disposed around at least a part of the magnetic core, a part of the first winding is disposed on the surface of the magnetic core, the magnetic core and the part of the first winding disposed on the surface of the magnetic core are disposed in a stacked manner, a part of the first winding is located in the hole, and the second winding is disposed on the magnetic core, where the first winding is one of a primary winding and a secondary winding, and the second winding is the other of the primary winding and the secondary winding. In this disclosure, power density of the planar transformer can be increased.