A transformer includes a core portion having a magnetic property and having a through hole formed therein, and a first coil portion formed with a first circuit board on which circuit patterns are printed on one surface thereof, having a shape enclosing a part of the core portion while penetrating the through hole of the core portion, and formed to be bent so that both side end portions of the first circuit board are connected to each other.

Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.

Various examples of systems and methods for a coupled inductor winding structure for common-mode noise reduction is described herein. The coupled inductor structure can include a magnetic core including a first leg, a second leg, and a center leg; and a planar winding structure. The planar winding structures can include a first inductor winding for a forward path of a first phase of a power converter; a second inductor winding for a forward path of a second phase of the power converter; a third and fourth inductor winding for a return path. The third inductor winding having at least one turn interleaved within the number of first leg turns of the first inductor winding and configured to achieve unity coupling. The fourth inductor winding having at least one turn interleaved within the number of second leg turns of the second inductor winding and configured to achieve unity coupling.

A planar transformer, a power conversion circuit, and an adapter, is provided to improve noise suppression performance. The planar transformer includes a magnetic core and a printed circuit board (PCB) winding board, where the PCB winding board includes a primary winding, a secondary winding, a shielding winding, and a compensation winding. In embodiments of this disclosure, the shielding winding and the compensation winding that has a plurality of turns of coils are disposed between the primary winding and the secondary winding of the planar transformer. The shielding winding can shield electric field coupling between the primary winding and the secondary winding, thereby suppressing a noise current between the primary winding and the secondary winding. Common mode noise generated by the compensation winding cancels common mode noise flowing to the secondary winding or the primary winding, to minimize common mode noise of an entire system.

Embodiments of planar transformer winding assemblies are provided herein. For example, a transformer winding assembly comprises a primary winding configured to connect to an upper surface of a flexible substrate comprising a plurality of conjoined annular rings, the primary winding runs along the plurality of conjoined annular rings in a first configuration and a secondary winding configured to connect to a lower surface of the flexible substrate, the secondary winding runs along the plurality of conjoined annular rings in a second configuration different from the first configuration.

A transformer includes a magnetic core set and 2N pairs of windings. The magnetic core set includes a first magnetic core, a second magnetic core, a first magnetic column, and a second magnetic column. Each of the pairs of windings includes a high-voltage side winding and a low-voltage side winding. Each of the pairs of the windings surrounds one of the first and the second magnetic columns. The surrounding direction of the high-voltage side windings surrounding the first magnetic core is opposite to the surrounding direction of the high-voltage side windings surrounding the second magnetic core.

The semiconductor device of the present invention includes an insulating layer, a high voltage coil and a low voltage coil which are disposed in the insulating layer at an interval in the vertical direction, a low potential portion which is provided in a low voltage region disposed around a high voltage region for the high voltage coil in planar view and is connected with potential lower than the high voltage coil, and an electric field shield portion which is disposed between the high voltage coil and the low voltage region and includes an electrically floated metal member.

A planar electrical transformer for a DC/DC converter comprises first and second stacked structures. Each stacked structure comprises a set of primary winding layers comprising first and second pairs of layers, and a set of secondary winding layers comprising first and second pairs of layers. The set of secondary winding layers is arranged between the first pair of layers of the set of primary winding layers and the second pair of layers of the set of primary winding layers. The first stacked structure and the second stacked structure are arranged such that a layer of the set of primary winding layers of the first structure faces a layer of the set of primary winding layers of the second structure across an air gap.

A protective enclosure for electrical components includes potting material encasing the electrical components. A case covers the potting material. At least one clastic component extends over the case for applying a compressive load to the potting material.

A resonant converter includes a circuit board, a primary-side circuit, a secondary-side circuit, and a planar transformer. The planar transformer includes a through hole, an iron core, a wiring, and a first via. The primary-side and the secondary-side circuits are disposed on the circuit board, and the primary-side or the secondary-side circuit includes a power component. The power component is embedded in any one of sub-layer boards of the circuit board, and the planar transformer is electrically connected to the primary-side and the secondary-side circuits. The through hole penetrates through the circuit board, and the iron core includes a core column penetrating through the through hole. The wring is formed around the through hole to be as a winding of the planar transformer. The first via is formed on the circuit board and is used to electrically connect the power component and the winding disposed on the sub-layer board.