A planar electrical assembly includes a substrate, in particular formed from sheets of prepreg. The substrate includes, incorporated into the mass of the substrate, at least one primary electrically conductive winding, in a first layer of the substrate, forming at least part of a primary circuit for an electrical transformer. At least one secondary electrically conductive winding is provided in a second layer of the substrate superimposed on the first layer and forming at least part of a secondary circuit for the electrical transformer.

The present disclosure provides a printed circuit board (PCB) based planar winding structure for a main power transformer and/or an auxiliary power need. The PCB-based planar winding structure can confine electric field through magnetic core potential control and thus create partial discharge (PD) free design for medium voltage (MV) applications. Meanwhile, the winding structure can be formed in the PCB manufacturing process to create a more modular and reliable structure, thereby enhancing manufacturability. Techniques, such as termination treatment, primary and secondary winding arrangements, etc., can be used to control the electrical stress in the medium voltage applications.

A modular stacked magnetic component is provided. The modular stacked magnetic component is for a DC-DC converter with N phases, and N is an odd number greater than 1. In the N phases, an nth phase is 360/N degrees leading an (n+1)th phase, n is a positive integer less than N, and an Nth phase is 360/N degrees leading a first phase. The modular stacked magnetic component includes N magnetic cores, a magnetic cover, and N windings. The N magnetic cores are stacked vertically in sequence. The magnetic cover is stacked on the top of the N magnetic cores. The N windings are connected to the N phases of the DC-DC converter respectively, and each winding is wound on winding columns of a corresponding magnetic core to form an integrated transformer and inductor. Any two adjacent windings have opposite current directions.

This isolation transformer includes: an isolation layer; a transformer having a first coil and a second coil; and a capacitor having a first capacitor electrode and a second capacitor electrode disposed between the first coil and the second coil. The isolation layer includes a first isolation film in which the first coil is embedded, a second isolation film on the upper surface of the first isolation film, a protective film on the upper surface of the second isolation film, a third isolation film on the upper surface of the protective film, a fourth isolation film on the upper surface of the third isolation film, and a fifth isolation film on the upper surface of the fourth isolation film. The second capacitor electrode is formed between the third isolation film and the fourth isolation film. The second coil is formed between the fourth isolation film and the fifth isolation film.

A transformer with leakage inductance. In some embodiments, a system includes: a transformer including: a core, including: a central limb, a first outer limb, and a second outer limb; a first winding; and a second winding, wherein a first turn of the first winding encircles the central limb and the first outer limb.

The disclosure provides a magnetic element and a power supply module. The magnetic element includes a first and second magnetic column, a first winding formed by sequentially connecting a first upper metal part, a first left metal part, a first middle metal part and a first right metal part, and a second winding formed by sequentially connecting a second middle metal part, a second left metal part, a first lower metal part and a second right metal part sequentially connected. The first left/middle/right metal parts and the second left/middle/right metal parts are formed on a first substrate having a first upper and lower groove in which the first and second magnetic columns are disposed respectively. The magnetic element and the power supply module in the application use circuit boards having symmetric groove structures, the process is simple, thereby facilitating panel production mode, easy for automation, and lowering cost.

An inductor device includes a first trace, a second trace, a third trace, a fourth trace, and a double ring inductor. The first trace is disposed in a first area, and located on a first layer. The second trace is disposed in the first area, coupled to the first trace, and located on a second layer. The third trace is disposed in a second area, and located on the first layer. The fourth trace is disposed in the second area, coupled to the third trace, and located on the second layer. The double ring inductor is disposed on the first layer, located at outer side of the first trace and the third trace, and coupled to the first trace and the third trace.

A winding assembly, such as a transformer or an inductor, includes a spring clip and a retaining clip for mechanically coupling the winding assembly to a printed circuit board (PCB) or a printed wiring board (PWB). The clips provide structural rigidity to the winding assembly, allowing the winding assembly to remain functional during high shock events. Further, the clips compress a thermal pad positioned beneath the winding assembly, providing sufficient heat transfer surface area for transferring heat away from the winding assembly.

A power module for a switching circuit is provided. The power module includes a substrate, power devices, a magnetic component, a metallic coating, and a heat spreader. The magnetic component includes a magnetic core, a primary winding, and a secondary winding. The metallic coating is covered on the substrate. The metallic coating includes a first portion and a second portion, the first portion is covered on the side edge surface of the substrate, the second portion is covered on a portion of the top surface of the substrate, and the second portion is connected to the first portion. The heat spreader is disposed on top of the plurality of power devices. The heat spreader has at least one supporting terminal connected to the top surface of the substrate, and one of the at least one supporting terminals is connected to the metallic coating.

An inductive device with flux paths through a substrate may be made by depositing a malleable magnetically permeable material into a hole in the substrate and curing the malleable magnetically permeable material to form a substantially solid magnetic plug. Deposition of the malleable magnetically permeable material may comprise stencil-printing followed by use of a flexible runner. A uniform extension of the plug above an outer surface of the substrate may be provided by a spacer on the outer surface. The spacer may, e.g., be a conductive layer and/or a non-conductive material on the surface. Magnetic plates spanning two or more plugs may form a closed magnetic flux path. A plug may be surrounded by a winding on a layer of the substrate. Extension of the plug above an outer surface of the substrate may ensure the integrity of an essentially gap-free connection between the end of the magnetic plug and a mating surfaces of a magnetic plate. The plug may be reduced for co-planarity with the substrate surface, or to form a recess below the substrate surface, e.g. to form controlled gaps in the permeable medium.