The present disclosure is related to a power module power structure and an assembling method thereof. The power module structure includes a first printed-circuit-board (PCB) assembly, a second PCB assembly, and a conductive connection component. The first PCB assembly includes a first circuit board, a power switch and a magnetic component. The first circuit board includes a first side, a second side and a through hole. The power switch is disposed on the first circuit board. The magnetic component includes a first magnetic core and a second magnetic core fastened on the first circuit board through the through hole. The second PCB assembly includes a second circuit board having a third side, a fourth side and at least one opening. The second magnetic core is exposed through the opening. The conductive connection component is disposed and electrically connected between the first PCB assembly and the second PCB assembly.

An electronic structure comprises: a circuit board, wherein a plurality of electronic devices and a transformer are disposed on the circuit board, the transformer comprises a first coil, a second coil, and a magnetic body, wherein a molding body encapsulates at least one portion of the outer surface of the first coil, at least one portion of the outer surface of the second coil, and the plurality of electronic devices for electrically isolating the plurality of electronic devices from the transformer.

A transformer structure may include a first coil having one or more turns, and a second coil having one or more turns. A turn of the one or more turns of the first coil may overlap a turn of the one or more turns of the second coil in a lateral direction substantially along the turn of the first coil and in a vertical direction substantially along the turn of the first coil. In some implementations, the transformer structure may be integrated in a semiconductor device.

A transformer of the symmetric-asymmetric type includes comprising a primary inductive circuit and a secondary inductive circuit formed in a same plane by respective interleaved and stacked metal tracks. A first crossing region includes a pair of connection plates facing one another, with each connection plate having a rectangular shape that is wider than the metal tracks, and diagonally connected to tracks of the secondary inductive circuit.

A packaged electronic device includes first conductive leads and second conductive leads at least partially exposed to an exterior of a package structure, and a multilevel lamination structure in the package structure. The multilevel lamination structure includes a first patterned conductive feature having multiple turns in a first level to form a first winding coupled to at least one of the first conductive leads in a first circuit, a second patterned conductive feature having multiple turns in a different level to form a second winding coupled to at least one of the second conductive leads in a second circuit isolated from the first circuit, and a conductive shield trace having multiple turns in a second level spaced apart from and between the first patterned conductive feature and the second patterned conductive feature, the conductive shield trace coupled in the first circuit.

An inductor device includes a first coil and a second coil. The first coil is wound into a plurality of first circles, and the second coil is wound into a plurality of second circles. At least two of the second circles are interlaced with at least two of the first circles on a first side. The at least two of the second circles are disposed adjacent to each other on the first side. At least one of the first circles is only interlaced with at least one of the second circles on a second side. At least another one of the first circles is only interlaced with at least another one of the second circles on the second side.

An electronic device includes a magnetic element, a first circuit module and a second circuit module. The magnetic component includes a magnetic core set and a winding, and the winding includes a first winding and a second winding, and the winding is assembled on the magnetic core set. The first circuit module is connected to the first winding of the magnetic element. The second circuit module is connected to the second winding of the magnetic element. The first circuit module or/and the second circuit module has/have an overlap portion with the winding on a vertical projection area of a first plane, and the first plane is the first plane is a horizontal plane at which the winding is located.

An embedded magnetic component transformer device includes primary, secondary, and auxiliary windings that are defined by conductive vias connected by conductive traces. The conductive traces and vias of the auxiliary winding are arranged between the conductive traces and vias of respective first and second portions of the primary winding, so that the auxiliary winding is provided substantially in the center of the width of the PCB. Power connections are provided at respective opposing edges of the device, and surface mounted transistors are provided close to the primary winding portions between the auxiliary winding and the edge of the device. The device provides an efficient utilization of the surface conductive traces such that large areas of the surface remain for other functions, such as ground plates. The thermal properties of the device are balanced by distributing the transistors and the power connections.

A magnetic device includes a magnetic core assembly and a winding assembly. The magnetic core assembly includes a first magnetic cover, a second magnetic cover and a plurality of magnetic legs. The second magnetic cover has a perforation. The plurality of magnetic legs are disposed between the first magnetic cover and the second magnetic cover. A middle region is defined by the plurality of magnetic legs, the first magnetic cover and the second magnetic cover. The middle region is in communication with the perforation. The middle region includes a plurality of communication portions. The winding assembly includes at least one coupled winding pair. In addition, two coupled windings of each coupled winding pair are respectively transferred through two different communication portions, and portions of the two coupled windings of each coupled winding pair are penetrated through the perforation of the second magnetic cover.

A power module and a power device having the power module are disclosed. The power device includes a main board. The power module is inserted in the main board and includes a PCB, a magnetic element, a primary winding circuit and at least one secondary winding circuit. The magnetic element is provided on the PCB and includes a core structure, a primary winding and at least one secondary winding. The core structure has a first side and a second side opposite to each other, and a third side and a fourth side opposite to each other. The primary winding circuit is provided on the PCB and positioned in the vicinity of the first or second side of the core structure. The secondary winding circuit is provided on the PCB and positioned in the vicinity of the third or fourth side of the core structure.