Patent classifications
H01F2027/2819
INSULATION TYPE STEP-DOWN CONVERTER
An insulation type step-down converter includes first, second, third, and fourth secondary-side coils, and first, second, third, and fourth rectifier elements. The first, second, third, and fourth rectifier elements is capable of performing rectification such that electric currents flow alternately only in one of the first and second secondary-side coils and one of the third and fourth secondary-side coils, and electric currents flowing simultaneously in one of the first and second secondary-side coils and one of the third and fourth secondary-side coils are opposite in direction to each other so as to cancel out a magnetic flux passing through the middle leg each time when electric current flowing in the primary-side coil is changed in direction. Provided is an insulation type step-down converter which can minimize an increase in heat generated by the primary-side coil even at a large step-down ratio of a step-down transformer without raising manufacturing costs.
INTEGRATED MAGNETIC AND COMPOSITE SUBSTRATE WITH INCORPORATED COMPONENTS
A magnetic device assembly is provided for maximizing the size of the magnetic components for a predetermined power converter module by co-locating and sharing input, output, and auxiliary terminals between the substrates for the power converter and the magnetic components. Wherein complete power module is the result of constructing the separate constituent parts which include an integrated magnetic substrate, magnetic elements mounted therein, a power converter substrate, associated incorporated components located top and bottom on the power converter substrate, a composite mechanical footprint as defined by the mechanical extents of the integrated magnetic substrate and power converter substrate, and a composite electrical pinout as defined by the input-output pins which are coincident to and co-located as those of the integrated magnetic and power converter substrates.
Printed circuit board having a layer structure
The invention relates to a printed circuit board having a layer structure, which accommodates a plurality of electric circuits. The electric circuits are separated from each other by an insulating barrier layer having a minimum thickness (Di) and a minimum distance (D0) between conductive components of the electric circuits.
Integrated transformer
An integrated transformer includes a first and second inductors. The first inductor includes a first and second windings. The second inductor includes a third and fourth windings. The first, second, third and fourth windings have a first, second, third and fourth outer turn, respectively. At least one segment of the first (or second) outer turn substantially overlaps at least one segment of the third (or fourth) outer turn. The first and second outer turns are connected through a first segment and a first trace that cross each other, and the third and fourth outer turns are connected through a second trace and a second segment that cross each other. The first trace and the second segment are on the first metal layer, and the first segment and the second trace are on the second metal layer different from the first metal layer.
Transformer and power supply device including the same
A transformer includes a magnetic core, a first coil unit and a second coil unit. The first coil unit is disposed within the magnetic core and includes a laminated board having layers laminated therein and conductive patterns. Respective ones of the conductive patterns are disposed on the laminated layers. The second coil unit includes a conductive wire spaced apart from the conductive patterns of the laminated board by an insulating distance. The conductive wire includes a triple-insulated wire surrounded by three sheets of insulating paper to maintain the insulating distance from the conductive patterns.
Printed circuit board and power supply device
In the printed circuit board 100 in the power supply device, cover layers C1 and C2 are formed on a surface other than the connection areas 95A′ and 95B′ within a coil pattern EC, which corresponds to a surface-shaped exposure area exposed to the outside so that the size of the surface-shaped exposure area to which the conductive pattern E is exposed is adjusted, so that an effect, which restrains a conductor from being damaged, especially at a time of carrying the printed circuit board 100 while maintaining a heat radiating property of the conductor, is achieved.
Power module
The present disclosure is related to a power module includes a first printed circuit board (PCB), a second PCB, a magnetic component and a connecting component. A secondary side switch set and a winding are disposed on the first PCB, respectively. A primary side switch set is disposed on the second PCB adjacent to the first PCB. A magnetic component includes an upper magnetic cover disposed on the first side of the first PCB; a lower magnetic cover disposed between the first PCB and the second PCB; and a lateral column located between the two magnetic covers. The lateral column passes through the first PCB, and is fastened with the two magnetic covers. The magnetic component and the winding collaboratively form a transformer. The connecting component is disposed between the two PCBs to connect the corresponding potential points of the two PCBs.
POWER TRANSFORMER OF THE SYMMETRIC-ASYMMETRIC TYPE WITH A FULLY-BALANCED TOPOLOGY
A transformer of the symmetric-asymmetric type includes comprising a primary inductive circuit and a secondary inductive circuit formed in a same plane by respective interleaved and stacked metal tracks. A first crossing region includes a pair of connection plates facing one another, with each connection plate having a rectangular shape that is wider than the metal tracks, and diagonally connected to tracks of the secondary inductive circuit.
MILLIMETER WAVE TRANSMITTER DESIGN
An on-chip transformer circuit is disclosed. The on-chip transformer circuit comprises a primary winding circuit comprising at least one turn of a primary conductive winding arranged as a first N-sided polygon in a first dielectric layer of a substrate; and a secondary winding circuit comprising at least one turn of a secondary conductive winding arranged as a second N-sided polygon in a second, different, dielectric layer of the substrate. In some embodiments, the primary winding circuit and the secondary winding circuit are arranged to overlap one another at predetermined locations along the primary conductive winding and the secondary conductive winding, wherein the predetermined locations comprise a number of locations less than all locations along the primary conductive winding and the secondary conductive winding.
POWER CONVERSION DEVICE, MULTILAYER BOARD INCLUDED IN THE SAME, AND VEHICLE HAVING POWER CONVERSION DEVICE MOUNTED THEREIN
A power conversion device includes a multilayer board including conductive layers that form a primary-side coil and a secondary-side coil of a transformer; and a circuit board electrically connected to the multilayer board, having a first conversion circuit formed therein or thereon. The multilayer board includes a transformer region in which the transformer is formed; a core member disposed in the transformer region and around the primary-side coil and secondary-side coil are wound; a circuit formed region which is adjacent to the transformer region and a second conversion circuit is formed, the second conversion circuit being electrically connected to the primary-side coil or the secondary-side coil; and a terminal portion which is electrically connected to the secondary-side coil or the primary-side coil. The first conversion circuit is electrically connected to the transformer via the terminal portion. One of the coils has a smaller number of turns than the other coil.