New types of circuit elements for integrated circuits include structures wherein a thickness dimension is much greater than a width dimension and is more closely spaced than the width dimension in order to attain a tight coupling condition. The structure is suitable to form inductors, capacitors, transmission lines and low impedance power distribution networks in integrated circuits. The width dimension is on the same order of magnitude as skin depth. Embodiments include a spiral winding disposed in a silicon substrate formed of a deep, narrow, conductor-covered spiral ridge separated by a narrow spiral trench. Other embodiments include a wide, thin conductor formed in or on a flexible insulative ribbon and wound with turns adjacent one another, or a conductor in or on a flexible insulative sheet folded into layers with windings adjacent one another Further, a method of manufacture includes directional etching of the deep, narrow spiral trench to form a winding in silicon.

The present invention includes a method of a low cost, reliable novel broadband inductor that can be used with a capacitor to form a broadband filter.

A network of Intermediate Device Structure (IDS) members communicatively coupled, mounted to elevated structure/s within urban settings, each configured to operate by a processor/controller with resident code, and in real time receive sensed environmental inputs from each IDS' vicinity, remote data/instruction/s processing the inputs with resident code parameters generating outputs that are configured to mitigate/avert intermittent environmental events harmful/hazardous to humans.

Disclosed is apparatus including a vertical spiral inductor. The vertical spiral inductor may include a plurality of dielectric layers formed on a substrate, a plurality of conductive layers, each of the plurality of conductive layers disposed on each of the plurality of dielectric layers, a plurality of insulating layers, each of the plurality of insulating layers disposed on each of the plurality of conductive layers, wherein each of the plurality of insulating layers separates each of the plurality of dielectric layers. A first spiral coil is arranged in a first plane perpendicular to the substrate, where the first spiral coil is formed of first portions of the plurality of conductive layers and a first set of vias of a plurality of vias, configured to connect the first portions of the plurality of conductive layers.

A multilayer coil component includes an element body and a plurality of coil conductors. The element body includes a plurality of metal magnetic particles and resin existing between the plurality of metal magnetic particles. The plurality of coil conductors is disposed in the element body, the plurality of coil conductors being separated from each other in a predetermined direction and electrically connected to each other. The plurality of metal magnetic particles included in the element body includes a plurality of metal magnetic particles having a particle size equal to or greater than one third of a distance between the coil conductors adjacent to each other in the predetermined direction and equal to or less than a half of the distance. Between the coil conductors adjacent to each other in the predetermined direction, the metal magnetic particles having the particle size are distributed along the predetermined direction.

In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

An inductor in which the external electrode is constituted by a conductive resin layer formed on a surface of a core effectively prevents peeling between the core and the external electrode. The inductor includes a core containing magnetic particles and a resin, a conductor embedded in the core, a conductive resin layer disposed on a surface of the core so as to be in contact with an end portion of the conductor exposed from the core, and a plating layer formed on the conductive resin layer. The plating layer is formed so as to extend to the surface of the core beyond a range in which the conductive resin layer is disposed.

A coil component includes a support substrate, a coil portion including a first conductive layer being in contact with one surface of the support substrate, and a second conductive layer disposed on the first conductive layer to be spaced apart from the one surface of the support substrate, and a body including the support substrate and the coil portion embedded in the body. One side of the first conductive layer is closer to a center of the second conductive layer in a width direction of the coil portion than one side of the second conductive layer.

A coil component includes a body having one surface and the other surface opposing each other and including a magnetic metal powder particle and an insulating resin; a coil portion embedded in the body and having end portions respectively exposed from end surfaces of the body; first and second external electrodes arranged to be spaced apart from each other on the one surface and extending to the end surfaces to be connected to the end portions, respectively; and an external insulating layer disposed between each of the first and second external electrodes and the one surface of the body. A magnetic metal powder particle exposed on the wall surface of the body, among the magnetic metal powder particle, has a plating prevention film disposed on at least a portion of a surface of the exposed magnetic metal powder particle and including metal ions of the magnetic metal powder particle.

The present disclosure provides a magnetic element and a method for manufacturing same. The method includes: forming a first metal wiring layer on a surface of at least one segment of a magnetic core; forming a first metal protection layer on the first metal wiring layer; removing a portion of the first metal protection layer with a direct writing technique to expose a portion of the first metal wiring layer; and etching the exposed first metal wiring layer in such a manner that the first metal wiring layer forms at least one first pattern to function as a winding, where at least one turn of the first pattern surrounds the magnetic core. The magnetic element and the method for manufacturing the magnetic element provided in the present disclosure can improve space utilization of the magnetic element.