A coil electronic component includes a support substrate having a through-hole. First and second coil patterns are disposed on a first surface and a second surface of the support substrate opposing each other, respectively, and each surround the through-hole and are coiled. An encapsulant encapsulates at least portions of the support substrate and the first and second coil patterns, and external electrodes are disposed externally of the encapsulant and are each connected to a respective lead-out pattern connected to a respective one of the first and second coil patterns. A groove penetrates the first surface of the support substrate in a region of the first surface in which the first coil pattern is not disposed, and the second coil pattern is disposed in a region of the second surface of the support substrate that overlaps along a thickness direction with the groove penetrating the first surface.

In one aspect, a method includes forming a metal layer on a substrate, wherein the metal layer comprises a first coil, forming a planarized insulator layer on the metal layer, forming at least one via in the planarized insulator layer, depositing a magnetoresistance (MR) element on the planarized insulator layer, and forming a second coil extending above the MR element. The at least one via electrically connects to the metal layer on one end and to MR element on the other end.

Coil structures and methods of forming are provided. The coil structure includes a substrate. A plurality of coils is disposed over the substrate, each coil comprising a conductive element that forms a continuous spiral having a hexagonal shape in a plan view of the coil structure. The plurality of coils is arranged in a honeycomb pattern, and each conductive element is electrically connected to an external electrical circuit.

A method of providing a single structure multiple mode antenna is described. The antenna is preferably constructed having a first inductor coil that is electrically connected in series with a second inductor coil. The antenna is constructed having a plurality of electrical connections positioned along the first and second inductor coils. A plurality of terminals is connected to the electrical connections that facilitate numerous electrical connections and enables the antenna to be selectively tuned to various frequencies and frequency bands.

Disclosed is a method of manufacturing a coil module that receives or transmits electric power or signals wireless by using an electromagnetic field. The method includes preparing a substrate, forming a coil on the substrate, and forming a magnetic part covering at least a portion of the coil while directly contacting a surface of the coil, and that acts as an electromagnetic booster that enhances an intensity of the electromagnetic field generated on the surface of the coil, and the magnetic part is formed through at least one of electroless plating, electro-plating, deposition, and printing.

A coil electronic component includes a magnetic body in which internal coil parts are embedded, and a metal shielding sheet disposed on at least one of an upper portion and a lower portion of the magnetic body in a thickness direction, in which permeability of the metal shielding sheet is 100 times or higher than permeability of magnetic metal powder contained in the magnetic body.

An inductor structure and a manufacturing method for the same are provided. The inductor structure includes conductive layers and conductive elements. The conductive layers overlap in a vertical direction. Each of the conductive elements is coupled between two conductive layers of the conductive layers.

Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.

A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers in a length direction and that has a built-in coil, and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed by a plurality of coil conductors stacked in the length direction being electrically connected to each other. The first and second outer electrodes respectively cover at least parts of first and second end surfaces. A stacking direction and a coil axis direction are parallel to the first main surface. A length of a region in which the coil conductors are arranged in the stacking direction is from 85% to 95% of a length of the multilayer body. A distance between coil conductors adjacent to each other in the stacking direction lies in a range from 12 μm to 40 μm.

An inductor includes a first metallization layer multi-turn trace. The inductor also includes a second metallization layer multi-turn trace coupled to the first metallization layer multi-turn trace through at least one first via. The inductor further includes a plurality of discrete third metallization layer trace segments coupled to the second metallization layer multi-turn trace through a plurality of second vias.