A magnetic element includes a first magnetic column, a second magnetic column, a first winding wound around the first magnetic column, and a second winding wound around the second magnetic column. The first winding includes a first horizontal winding, a second horizontal winding, a first vertical winding, and a second vertical winding. The second winding includes a third horizontal winding, a fourth horizontal winding, a third vertical winding, and a fourth vertical winding. The first vertical winding and the third vertical winding are disposed on or in a first circuit board and a second circuit board respectively, the second vertical winding and the fourth vertical winding are disposed on or in a third circuit board. The first circuit board, the first magnetic column, the third circuit board, the second magnetic column, and the second circuit board are sequentially bonded to form a pre-package.

A method of manufacturing a multilayer board includes forming conductor patterns on four or more insulating base material layers, forming a multilayer body by stacking the insulating base material layers in a state in which the conductor patterns face each other with prepreg layers therebetween, and heat-pressing the multilayer body. In a state before the step of heat-pressing, among the prepreg layers, a thickness of an outermost prepreg layer is larger than a thickness of a prepreg layer other than the outermost prepreg layer.

A package on a die having a low resistive substrate, wherein the package comprises an inductor on low-k dielectric and a capacitor on high-k dielectric. The stacked arrangement having different dielectric materials may provide an inductor having a high Q-factor while still having a high capacitance density. In addition, moving the inductor from the die to the package and fabricating the high density capacitor on the package reduces the silicon area required permitting smaller RF/analog blocks on the chip.

Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.

An inductor component comprising a base body including first and second magnetic layers laminated in order along a first direction; and an inductor wire between the first and second magnetic layers and on a plane that is orthogonal to the first direction. The first magnetic layer is in a reverse direction to the first direction of the inductor wire, the second magnetic layer is in the first direction of the inductor wire and in a direction that is orthogonal to the first direction, and when a main surface of the second magnetic layer is viewed from a direction which is orthogonal to the main surface of the second magnetic layer in the first direction, the second magnetic layer includes a dark region corresponding to the inductor wire and a bright region whose brightness is higher than that of the dark region.

To improve magnetic characteristics of a coil component having a structure in which an interlayer insulating film is provided between a spiral coil pattern and a magnetic element body. A coil component 1 includes: an interlayer insulating film 41 covering coil patterns CP1 to CP3 from one side in the axial direction of the coil patterns; a magnetic element body M1 filled in the inner diameter areas of the coil patterns CP1 to CP3; and a magnetic element body M2 covering the coil patterns CP1 to CP3 from the one side in the axial direction through the interlayer insulating film 41. The interlayer insulating film 41 has a protruding part 41A radially protruding to the inner diameter area, and the protruding part 41A is curved to the other side in the axial direction. Since the protruding part 41A is curved in the axial direction, the entrance of a magnetic path passing through the inner diameter area is made wider than when the protruding part 41A linearly protrudes to the inner diameter area. This suppresses deterioration in magnetic characteristics due to the presence of the protruding part 41A.

A magnetic inlay includes a magnetic matrix and a plurality of electrically conductive vertical through connections extending vertically through the magnetic matrix. Further, a component carrier including the magnetic inlay and a method of manufacturing said magnetic inlay are described.

A component carrier includes a stack with at least one electrically insulating layer structure, a structured electrically conductive layer assembled to the stack, where a part of the structured electrically conductive layer is configured as an inductive element, and a magnetic matrix embedded in the stack. The magnetic matrix at least partially surrounds the inductive element. Further, a manufacturing method is described.

A coil-embedded ceramic substrate includes a plurality of ceramic layers including multi-turn coil patterns provided thereon. At least one ceramic layer of the plurality of ceramic layers includes thereon a multi-turn coil pattern and dummy patterns not electrically connected to the multi-turn coil pattern. The multi-turn coil pattern winds around and extends parallel or substantially parallel to sides of the ceramic layer. The dummy patterns are each parallel or substantially parallel to corresponding ones of the sides of the ceramic layer as an extension of portion of the coil pattern in an extending direction.

A magnetic wiring circuit board includes an insulating layer; a wire disposed on a one-side surface in a thickness direction of the insulating layer and having a one-side surface in the thickness direction disposed to face the one-side surface in the thickness direction of the insulting layer at spaced intervals thereto, an other-side surface in the thickness direction in contact with the one-side surface in the thickness direction of the insulating layer, and side surfaces each connecting an end edge of the one-side surface in the thickness direction to an end edge of the other-side surface in the thickness direction; and a magnetic layer containing a magnetic particle having a shape of an aspect ratio of 2 or more and embedding the wire.