A module includes a substrate, metal layers and insulating layers laminated on the substrate, a bottom winding made of a metal directly contacting a first metal layer or a second metal layer, a first insulating layer on the bottom winding, a core on the first insulating layer, a second insulating layer on the core, a top winding made of the metal that is located on the core and a portion of the second insulating layer and that directly contacts the first metal layer or the second metal layer, and a third insulating layer on the top winding, electronic components that are located on the third insulating layer, where primary and secondary windings of the transformer are defined by portions of the bottom winding and the top winding and are located on opposite sides of the core from each other.

Devices and methods including a though-hole inductor for an electronic package are shown herein. Examples of the through-hole inductor include a substrate including at least one substrate layer. Each substrate layer including a dielectric layer having a first surface and a second surface. An aperture included in the dielectric layer is located from the first surface to the second surface. The aperture includes an aperture wall from the first surface to the second surface. A conductive layer is deposited on the first surface, second surface, and the aperture wall. At least one coil is cut from the conductive layer and located on the aperture wall.

An electronic component includes an element provided with a recess, a mounting conductor disposed in the recess, and an internal conductor disposed inside the element and connected to the mounting conductor. A first region includes a first surface. A second region includes a third surface connecting a second surface and the first surface. The second surface and the third surface overlap with the first surface as viewed in a direction in which the first surface and the second surface face each other. The internal conductor is connected to the second region away from a connection portion between the first surface and the third surface.

An inductor includes a magnetic body, and a conductor embedded in the magnetic body. The conductor includes a first conductor, and a second conductor covering a periphery of the first conductor.

A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers on top of one another and that has a coil built thereinto, and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed by electrically connecting a plurality of coil conductors. A first main surface of the multilayer body is a mounting surface. A stacking direction of the multilayer body is parallel to the mounting surface. The multilayer coil component includes first and second connection conductors. The first and second connection conductors overlap the coil conductors in a plan view from the stacking direction and are located closer to the mounting surface than a center axis of the coil. Distances between adjacent coil conductors are not constant in a side view from a direction perpendicular to the stacking direction.

The present disclosure relates to semiconductor structures and, more particularly, to dummy fill structures and methods of manufacture. The structure includes: a passive device formed in interlevel dielectric material; and a plurality of metal dummy fill structures composed of at least one main branch and two extending legs from at least one side of the main branch, the at least two extending legs being positioned and structured to suppress eddy currents of the passive device.

An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.

A coil electronic component includes a body comprising a magnetic material, an insulating substrate comprising a support portion disposed inside the body, and a tip extending from the support portion and exposed from an external surface of the body, a coil portion disposed on the support portion, and a lead-out portion extending from one end of the coil portion, disposed on the tip, and exposed from the external surface of the body. The lead-out portion has a slit exposed from the external surface of the body.

A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers in a length direction and that has a built-in coil, and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed by a plurality of coil conductors stacked in the length direction being electrically connected to each other. The first and second outer electrodes respectively cover parts of first and second end surfaces and parts of a first main surface. Two coil conductors are stacked in order to form one turn of the coil. Adjacent land portions of coil conductors in the stacking direction are connected to each other through via conductors. In a plan view from a width direction, the land portions are disposed in an upper half of the multilayer body on the opposite side from the first main surface.

A coil component includes a body embedding a support substrate, an external electrode disposed on one surface of the body, and a coil portion disposed on the support substrate and including a lead-out pattern having one surface exposed to one end surface of the body abutting the one surface of the body. A connection electrode penetrates the lead-out pattern, extends to the external electrode, and has one surface exposed to the one end surface of the body. An intermetallic compound is disposed between the connection electrode and the lead-out pattern. The connection electrode includes a base resin, a plurality of metal particles disposed in the base resin, and a conductive connection portion surrounding the plurality of metal particles and in contact with the intermetallic compound.