H01F41/12

REACTOR, METHOD FOR MANUFACTURING REACTOR, AND REACTOR COIL COVERING
20230215621 · 2023-07-06 · ·

There are provided a reactor, a reactor coil covering, and a method for manufacturing a reactor, which are capable of preventing peeling off of an insulation coat with which an outer peripheral surface of a winding is covered. A reactor includes a core, a coil disposed on an outer periphery of the core, and a resin mold portion partially covering and integrating the core and the coil. A winding of the coil has an outer peripheral surface covered with an insulation coat. At least one part of a surface of the coil is covered with a protective membrane to cover a boundary between adjacent turns of the coil.

Multilayer coil component
11551845 · 2023-01-10 · ·

A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers and including a coil built therein, and first and second outer electrodes electrically connected to the coil. The coil is formed by electrically connecting a plurality of coil conductors stacked together with the insulating layers. The multilayer coil component further includes, inside the multilayer body, first and second connecting conductors. The first connecting conductor connects between a portion of the first outer electrode covering the first end face, and a coil conductor facing the portion. The second connecting conductor connects between a portion of the second outer electrode covering the second end face, and a coil conductor facing the portion. Concerning the length direction, the first and second connecting conductors each have a length from about 2.5% to about 7.5% of the length of the multilayer body.

Multilayer coil component
11551845 · 2023-01-10 · ·

A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers and including a coil built therein, and first and second outer electrodes electrically connected to the coil. The coil is formed by electrically connecting a plurality of coil conductors stacked together with the insulating layers. The multilayer coil component further includes, inside the multilayer body, first and second connecting conductors. The first connecting conductor connects between a portion of the first outer electrode covering the first end face, and a coil conductor facing the portion. The second connecting conductor connects between a portion of the second outer electrode covering the second end face, and a coil conductor facing the portion. Concerning the length direction, the first and second connecting conductors each have a length from about 2.5% to about 7.5% of the length of the multilayer body.

Shielded magnetic device and the method to make the same
11551857 · 2023-01-10 · ·

At least one shielding layer made of conductive material is formed on a body of a magnetic device to prevent magnetic fields from leaking to the outside of the magnetic device so as to reduce EMI and the size of the magnetic device.

Shielded magnetic device and the method to make the same
11551857 · 2023-01-10 · ·

At least one shielding layer made of conductive material is formed on a body of a magnetic device to prevent magnetic fields from leaking to the outside of the magnetic device so as to reduce EMI and the size of the magnetic device.

Coil array component

A coil array component including an element assembly that includes a filler and a resin material, a first coil portion and a second coil portion that are embedded in the element assembly and that are composed of a first coil conductor and a second coil conductor, respectively, and four outer electrodes electrically connected to the first coil portion and the second coil portion. Also, the first coil conductor and the second coil conductor are covered with a glass layer.

Coil electronic component

A coil electronic component includes an insulating substrate, a coil portion disposed on at least one surface of the insulating substrate, a body in which the insulating substrate and the coil portion are embedded, a lead-out portion connected to the coil portion and exposed from a surface of the body, and a connection portion including a plurality of connecting conductors each having a bent portion to increase lengths of the plurality of connecting conductors embedded in the body, the plurality of connecting conductors being spaced apart from each other, the connection portion connecting an end of the coil portion to the lead-out portion to each other.

Wire wound inductor and manufacturing method thereof

There are provided a wire wound inductor and a manufacturing method thereof according to an exemplary embodiment in the present disclosure. The wire wound inductor according to an exemplary embodiment in the present disclosure includes a winding coil, a magnetic core embedding the winding coil, and an adhesive portion disposed between the magnetic core and the winding coil and enclosing the winding coil.

Coil electronic component

A coil electronic component includes a body, in which a coil portion is embedded, including a plurality of magnetic particles, and an external electrode connected to the coil portion. Among the plurality of magnetic particles, at least a portion of magnetic particles include a first layer, disposed on a surface of a magnetic particle among the magnetic particles, and a second layer disposed on a surface of the first layer. The first layer is an inorganic coating layer containing a phosphorus (P) component, and the second layer is an atomic layer deposition layer.

Coil electronic component

A coil electronic component includes a body, in which a coil portion is embedded, including a plurality of magnetic particles, and an external electrode connected to the coil portion. Among the plurality of magnetic particles, at least a portion of magnetic particles include a first layer, disposed on a surface of a magnetic particle among the magnetic particles, and a second layer disposed on a surface of the first layer. The first layer is an inorganic coating layer containing a phosphorus (P) component, and the second layer is an atomic layer deposition layer.