Patent classifications
H01F41/12
THIN FILM INDUCTOR
A thin film inductor is provided. The thin film inductor includes a first coil assembly, a first magnetic layer, and a second magnetic layer. The first coil assembly includes a first substrate and two first electrically conductive circuits respectively arranged on two surfaces of the first substrate that are opposite to each other. The first magnetic layer and the second magnetic layer are respectively arranged on the two surfaces of the first substrate that are opposite to each other, and the two first electrically conductive circuits are respectively embedded in the first magnetic layer and the second magnetic layer. The first substrate has a first non-circuit layout, and the first electrically conductive circuit is arranged around the first non-circuit layout. A ratio between an area of the first non-circuit layout and an area of the first substrate is 0.1 or more.
Dry-type transformer
The present disclosure relates to electrical windings for a dry transformer which allows construction of a compact dry transformer even in relatively high voltage classes. For this purpose, the electrical winding has multiple windings of a winding conductor wound to form a coil. The coil has been embedded into a solid insulation body. In some embodiments, a coating of an electrically conductive material, comprising a resin matrix with at least 0.05% by weight of nanoscale filler, has been applied to at least one surface of the insulation body.
MULTILAYER COIL COMPONENT
A multilayer coil component includes a multilayer body in which a plurality of insulating layers are stacked in a stacking direction and a coil inside, and outer electrodes on surfaces of the multilayer body and electrically connected to the coil. The insulating layers have a magnetic phase having spinel structure containing at least Fe, Ni, Zn, and Cu and a non-magnetic phase containing at least Si. When grain sizes D50 and D90 of crystal grains constituting the magnetic phase are respectively defined as equivalent-area circle diameters of 50% and 90% on a cumulative sum basis in a cumulative distribution of equivalent-area circle diameters of the crystal grains, the grain size D50 is from 50 nm to 750 nm, and the grain size D90 is from 200 nm to 1500 nm.
Surface-mount inductor
A surface-mount inductor includes an element assembly having a core, a coil, and a magnetic material; and a pair of external terminals on a mounting surface of the element assembly. The core has a base portion and a columnar portion on an upper surface of the base portion. The coil is disposed on the base portion, and has a wound portion on the columnar portion, and a pair of extended portions extended from the wound portion. The base portion has at least one ridge portion at which the upper surface and a side surface are in linear contact with each other. The pair of extended portions are each disposed such that a flat surface portion connected to a flat surface portion disposed at an inner side portion of a conductive wire located at an outer peripheral portion of the wound portion is close to the ridge portion.
INDUCTOR COMPONENT
An inductor component comprising a base body; a coil on the base body and wound helically along an axis; and first and second external electrodes disposed on the base body and connected electrically to the coil. The base body includes a substrate having first and second main surfaces that face each other; and an insulating layer on the first main surface. The coil includes first and second coil wires respectively disposed on the first and second main surfaces and covered with the insulating layer; and first and second through wires extending through the substrate from the first main surface to the second main surface and opposite to each other with respect to the axis. The first coil wire, the first through wire, the second coil wire, and the second through wire are connected in the mentioned order, to make up at least a part of the helical.
MAGNETIC ELEMENT, METHOD FOR MANUFACTURING THE SAME AND SUBSTRATE
The present invention provides a magnetic element, a method for manufacturing the same and a substrate. The magnetic element includes: a first wiring region including a first conductive layer and a second conductive layer which are arranged along a first direction; a second wiring region including a third conductive layer and a fourth conductive layer which are arranged along a second direction perpendicular to the first direction and are disposed in opposite sides of the second wiring region, respectively; an accommodating space disposed between the third conductive layer and the fourth conductive layer, wherein the second conductive layer is disposed on one side of the first conductive layer away from the accommodating space; and a magnetic column disposed within the accommodating space, wherein the third conductive layer includes a first wiring region directly connected to the first conductive layer, to form a part of windings of the magnetic element.
MAGNETIC ELEMENT, METHOD FOR MANUFACTURING THE SAME AND SUBSTRATE
The present invention provides a magnetic element, a method for manufacturing the same and a substrate. The magnetic element includes: a first wiring region including a first conductive layer and a second conductive layer which are arranged along a first direction; a second wiring region including a third conductive layer and a fourth conductive layer which are arranged along a second direction perpendicular to the first direction and are disposed in opposite sides of the second wiring region, respectively; an accommodating space disposed between the third conductive layer and the fourth conductive layer, wherein the second conductive layer is disposed on one side of the first conductive layer away from the accommodating space; and a magnetic column disposed within the accommodating space, wherein the third conductive layer includes a first wiring region directly connected to the first conductive layer, to form a part of windings of the magnetic element.
Transformer, coil unit and electronic power apparatus
A transformer includes a primary coil unit including a primary winding, a first insulating portion and a shielding layer, wherein the first insulating portion wraps the primary winding, the shielding layer covers an outer surface of the first insulating portion, the shielding layer includes an opening, and a part of the first insulating portion is exposed at the opening; an outgoing wire terminal in the opening and having a first portion and a second portion connected with each other, the first portion coupled to the primary winding and wrapped by the first insulating portion, the second portion being exposed out of the first insulating portion; a connecting wire having a first end connected to the second portion of the outgoing wire terminal; and an insulating sleeve partially wrapping the connecting wire, and a second end of the connecting wire being exposed out of the insulating sleeve, (FIG. 17).
WINDING CONFIGURATION AS PART OF AN INTEGRATED STRUCTURE FOR A MEDIUM FREQUENCY TRANSFORMER
A method for producing a coil for a transformer, in particular for a medium frequency transformer for a resonant DC/DC converter or a dual active bridge DC/DC converter, is disclosed which: providing a plurality of M>1 conductive foil strips, each having a first ending and a second ending; stacking the plurality of conductive foil strips to obtain a foil strip stack having a first ending and a second ending, wherein an electrically insulating layer is provided between any two adjacent foil strips; electrically interconnecting the first endings of all conductive foil strips to a first terminal; for each of the conductive foil strips providing a connector at the second ending of the foil strip; and coiling up the foil strip stack from the first end.
Component Carrier With Inductive Element Included in Layer Build-up, and Manufacturing Method
A component carrier includes a stack with at least one electrically insulating layer structure, a structured electrically conductive layer assembled to the stack, where a part of the structured electrically conductive layer is configured as an inductive element, and a magnetic matrix embedded in the stack. The magnetic matrix at least partially surrounds the inductive element. Further, a manufacturing method is described.