H01F41/26

CORE STRUCTURE OF INDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME

Provided is a core structure of an inductor element. The manufacturing method thereof is to embed a magnetic conductor including at least one magnetic conductive layer in a core body and to from a plurality of apertures for passing coils around the magnetic conductor in the core body. Accordingly, the magnetic conductor is designed in the core body by using the integrated circuit carrier board manufacturing process, such that the overall size and thickness of the inductor element can be greatly reduced, thereby facilitating product miniaturization using the inductor element.

High-Aspect Ratio Electroplated Structures And Anisotropic Electroplating Processes

A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.

High-Aspect Ratio Electroplated Structures And Anisotropic Electroplating Processes

A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.

IMPURITY REMOVAL IN AN IRON CONVERSION SYSTEM

Methods and systems for producing iron from an iron-containing ore and removing impurities found in the iron-containing ore are disclosed. For example, a method for producing iron comprises providing a feedstock having an iron-containing ore and one or more impurities to a dissolution subsystem comprising a first electrochemical cell; producing an iron-rich solution, in the dissolution subsystem; treating the iron-rich solution to remove at least a portion of one or more impurities by raising a pH of the iron-rich solution from an initial pH to an adjusted pH thereby precipitating at least a portion of the one or more impurities in the treated iron-rich solution; delivering the treated iron-rich solution to an iron-plating subsystem having a second electrochemical cell; second electrochemically reducing at least a first portion of the transferred formed Fe.sup.2+ ions to Fe metal; and removing the Fe metal from the second electrochemical cell thereby producing iron.

INDUCTOR, MANUFACTURING METHOD FOR INDUCTOR, ENCAPSULATION MODULE, AND MANUFACTURING METHOD FOR ENCAPSULATION MODULE
20240161958 · 2024-05-16 ·

An inductor can include at least one winding, where each winding comprises a coil body and at least two lead-out terminals being in contact with the coil body; a first encapsulation body configured to at least encapsulate part of the lead-out terminals and part of the coil body, and to expose the lead-out terminals; and where the first encapsulation body includes an insulating main material and magnetic particles dispersed in the insulating main material.

INDUCTOR, MANUFACTURING METHOD FOR INDUCTOR, ENCAPSULATION MODULE, AND MANUFACTURING METHOD FOR ENCAPSULATION MODULE
20240161958 · 2024-05-16 ·

An inductor can include at least one winding, where each winding comprises a coil body and at least two lead-out terminals being in contact with the coil body; a first encapsulation body configured to at least encapsulate part of the lead-out terminals and part of the coil body, and to expose the lead-out terminals; and where the first encapsulation body includes an insulating main material and magnetic particles dispersed in the insulating main material.

MODULE STRUCTURE AND ITS MANUFACTURING METHOD
20240161959 · 2024-05-16 ·

A module structure can include a first type structure including a first encapsulation body having a magnetic property, and at least one inductive element, where at least part of the inductive element is encapsulated in the first encapsulation body; a second type structure including a second encapsulation body having a non-magnetic property, and at least one non-inductive element, where the non-inductive element is encapsulated in the second encapsulation body; and pin structures located on exposed surfaces of the first type structure and/or the second type structure, in order to lead out corresponding electrodes.

Hybrid magnetic material structures for electronic devices and circuits

Embodiments are generally directed to hybrid magnetic material structures for electronic devices and circuits. An embodiment of an inductor includes a first layer of magnetic film material applied on a substrate, one or more conductors placed on the first layer of magnetic film material, and a second layer of magnetic particles, wherein the magnetic particles are suspended in an insulating medium.

Methods of manufacturing integrated magnetic core inductors with vertical laminations
10347709 · 2019-07-09 · ·

Methods of manufacturing are disclosed for an inductor that includes a magnetic core lying in a core plane. The magnetic core includes a vertical laminated structure with respect to the core plane of alternating ferromagnetic vertical layers and insulator vertical layers. An easy axis of magnetization can be permanently or semi-permanently fixed in the ferromagnetic vertical layers along a first axis orthogonal to the core plane. A hard axis of magnetization can be permanently or semi-permanently induced in the ferromagnetic vertical layers, the hard axis of magnetization lying in a plane that is orthogonal to the first axis.

Methods of manufacturing integrated magnetic core inductors with vertical laminations
10347709 · 2019-07-09 · ·

Methods of manufacturing are disclosed for an inductor that includes a magnetic core lying in a core plane. The magnetic core includes a vertical laminated structure with respect to the core plane of alternating ferromagnetic vertical layers and insulator vertical layers. An easy axis of magnetization can be permanently or semi-permanently fixed in the ferromagnetic vertical layers along a first axis orthogonal to the core plane. A hard axis of magnetization can be permanently or semi-permanently induced in the ferromagnetic vertical layers, the hard axis of magnetization lying in a plane that is orthogonal to the first axis.