Orthotic devices for providing arch support for the foot are disclosed. The orthotic device includes a base member, an arch support portion, and a covering for coupling the arch support portion to the base member. A method of providing continuous contact with the plantar surface of the foot during all phases of the gait cycle is also disclosed. In addition, methods of assembling and using the orthotic device are also disclosed.

Orthotic devices for providing arch support for the foot are disclosed. The orthotic device includes a base member, an arch support portion, and a covering for coupling the arch support portion to the base member. A method of providing continuous contact with the plantar surface of the foot during all phases of the gait cycle is also disclosed. In addition, methods of assembling and using the orthotic device are also disclosed.

A footbed comprises a cushion comprising a heel portion, a forefoot portion, and a lower surface. The heel and forefoot portions each comprise resilient balls located in a resilient matrix material. The balls have a first hardness measure, and the matrix material has a second hardness measure that is different than the first hardness measure. The balls in the forefoot portion are of a first diameter and the balls in the heel portion are of a second diameter, the first diameter being smaller than the second diameter. The heel portion is separated from the forefoot portion by a midfoot portion. Each of the balls in the cushion may be interconnected with adjacent respective balls by spacing pins, the spacing pins creating gaps between adjacent respective balls, the matrix material being located in the gaps. The matrix material substantially surrounds each of the balls in the cushion.

A footbed comprises a cushion comprising a heel portion, a forefoot portion, and a lower surface. The heel and forefoot portions each comprise resilient balls located in a resilient matrix material. The balls have a first hardness measure, and the matrix material has a second hardness measure that is different than the first hardness measure. The balls in the forefoot portion are of a first diameter and the balls in the heel portion are of a second diameter, the first diameter being smaller than the second diameter. The heel portion is separated from the forefoot portion by a midfoot portion. Each of the balls in the cushion may be interconnected with adjacent respective balls by spacing pins, the spacing pins creating gaps between adjacent respective balls, the matrix material being located in the gaps. The matrix material substantially surrounds each of the balls in the cushion.

Designs and compositions of insoles for footwear are described herein. The insoles may be customized for a given foot. In some examples, the insole (100) includes a base comprising a variable thickness component (205), a directional stiffness component, a stability component, and a reinforcement component. The base may be a single composition that is manufactured using additive manufacturing techniques.

Designs and compositions of insoles for footwear are described herein. The insoles may be customized for a given foot. In some examples, the insole (100) includes a base comprising a variable thickness component (205), a directional stiffness component, a stability component, and a reinforcement component. The base may be a single composition that is manufactured using additive manufacturing techniques.

Provided is an insole-type electronic device wherein the electronic module is not susceptible to impact and/or load due to walking or running. The insole-type electronic device is an electronic device wherein an electronic module has been incorporated in the insole that is laid on the midsole of a shoe and contacts the sole of the foot. The insole-type electronic device has an insole body with the shape of a normal insole. Said insole body has a heel-protecting part that extends upward from the back end of the heel section of the insole body along the perimeter of the back end of the heel section. Additionally, the insole-type electronic device has an electronic module that is housed in the heel-protecting part.

Provided is an insole-type electronic device wherein the electronic module is not susceptible to impact and/or load due to walking or running. The insole-type electronic device is an electronic device wherein an electronic module has been incorporated in the insole that is laid on the midsole of a shoe and contacts the sole of the foot. The insole-type electronic device has an insole body with the shape of a normal insole. Said insole body has a heel-protecting part that extends upward from the back end of the heel section of the insole body along the perimeter of the back end of the heel section. Additionally, the insole-type electronic device has an electronic module that is housed in the heel-protecting part.

A material that includes a polymer foam and at least one polar dopant molecule included in the polymer foam, wherein the material is a piezoelectric.

A material that includes a polymer foam and at least one polar dopant molecule included in the polymer foam, wherein the material is a piezoelectric.