A semiconductor device may include a semiconductor module, a busbar, and a connection member. The semiconductor module may include a semiconductor element and a power terminal connected to the semiconductor element. The power terminal of the semiconductor module may be connected to the busbar via the connection member. A fusing current of the connection member may be smaller than each of fusing currents of the power terminal and the busbar.

Methods and systems for protection/disconnect of airborne high-power/energy high-voltage modular multi-string battery packs (such as battery packs for airborne electric propulsion systems). The methods and systems are based on a dissimilar/redundant distributed battery pack protection architecture and use a smart mid-point battery disconnect in conjunction with centralized battery management system. The resulting battery disconnect/protection system is configured to detect bus faults, load faults and string faults and then take appropriate action to isolate the detected fault. For example, in response to a short circuit in one battery string, the faulty battery string may be disconnected from the positive and negative busbars while the remaining battery strings continue to provide power.

Fuse programming circuits, devices and methods. In some embodiments, a fuse circuit can include a fuse pad configured to receive a voltage, a fuse having a first end coupled to the fuse pad and a second end coupled to a switching element configured to enable a current to pass from the fuse pad to a ground potential.

An electronic device includes: a control terminal, which extends on a first face of a substrate; a first conduction terminal, which extends in the substrate at the first face of the substrate; a first insulating layer interposed between the control terminal and the first conduction terminal; a conductive path, which can be biased at a biasing voltage; and a protection element, coupled to the control terminal and to the conductive path, which forms an electrical connection between the control terminal and the conductive path and is designed to melt, and thus interrupt electrical connection, in the presence of a leakage current higher than a critical threshold between the control terminal and the first conduction terminal through the first insulating layer.

A semiconductor wafer includes first zones containing integrated circuits, each first zone including a substrate and a sealing ring at a periphery of the substrate. The first zones are separated from each other by second zones defining cutting lines or paths. The integrated circuit includes an electrically conductive fuse that extends between a first location inside the integrated circuit and a second location situated outside the integrated circuit beyond one of the cutting lines. This electrically conductive fuse includes a portion that passes through the sealing ring and another portion that straddles the adjacent cutting line. The portion of the fuse that passes through is electrically isolated from the sealing ring and from the substrate. The straddling portion is configured to be sliced, when cutting the wafer along the cutting line, so as to cause the fuse to change from an electrical on state to an electrical off state.

Embodiments include a vehicle power distribution system comprising a vehicle battery having a nominal voltage; a plurality of electric loads, each load being associated with a rated voltage; and an integrated circuit coupled to the vehicle battery and comprising a plurality of solid-state circuitry blocks respectively coupled to the electric loads, each block including a circuit protection system and configured to supply the rated voltage associated with the electric load coupled to the block. Embodiments also includes a vehicle power distribution module comprising an integrated circuit configured to receive a first voltage from a vehicle battery and to supply respective rated voltages to a plurality of electric loads, the integrated circuit comprising a plurality of solid-state circuitry blocks, and each circuitry block including a circuit protection system and being coupled to a respective one of the electric loads.

An isolation disconnect assembly for an insulated gate bipolar transistor assembly is provided. The isolation disconnect assembly includes a conductor assembly and a clinch joint magnetic actuator.

The present disclosure provides an overvoltage and overcurrent protection circuit and a mobile terminal. The overvoltage and overcurrent protection circuit comprises a primary protection circuit and a secondary protection circuit. The primary protection circuit comprises a power end coupled to an anode of a cell, a detection end coupled to a cathode of the cell, and a low potential interface end coupled to a ground end of a charging and discharging interface. The secondary protection circuit comprises a high potential cell end, a low potential cell end, and a high potential interface end, in which the high potential cell end is externally coupled to the anode of the cell, the low potential cell end is externally coupled to the cathode of the cell, and the high potential interface end is externally coupled to a power end of the charging and discharging interface.

The present disclosure provides an overvoltage and overcurrent protection circuit and a mobile terminal. The overvoltage and overcurrent protection circuit comprises a primary protection circuit and a secondary protection circuit. The primary protection circuit comprises a power end coupled to an anode of a cell, a detection end coupled to a cathode of the cell, and a low potential interface end coupled to a ground end of a charging and discharging interface. The secondary protection circuit comprises a high potential cell end, a low potential cell end, and a high potential interface end, in which the high potential cell end is externally coupled to the anode of the cell, the low potential cell end is externally coupled to the cathode of the cell, and the high potential interface end is externally coupled to a power end of the charging and discharging interface.

Fuse programming circuits, devices and methods. In some embodiments, a fuse circuit can include a fuse pad configured to receive a voltage, a fuse having a first end coupled to the fuse pad and a second end coupled to a switching element configured to enable a current to pass from the fuse pad to a ground potential.