An electronic assembly contains a circuit board having a current-conducting current path with two mutually spaced-apart current path ends that form an interruption point and a contact clip bridging the interruption point. The contact clip is manufactured without a preload, as a thermal fuse. The contact clip has a multiple bent, open clip loop and a contact limb making contact with both mutually spaced-apart current path ends using solder. The contact clip further has a fixing limb with a limb end seated in a circuit board opening. The limb end of the fixing limb is oversized relative to a circuit board opening, and a deformation being imparted to the contact clip, with an internal preload being generated.

A method of manufacturing a fuse includes stacking a base plate, an at least partially conductive fabric over the base plate and a cover layer over the fabric, each with an intervening bonding layer. At least one cavity is provided on both sides of the fabric, adjoining the fabric, between the respective edge regions. In addition, the fabric includes at least one first fiber which is electrically conductive and second fibers which are non-conductive and which have a lower melting temperature than the first fiber. The method further includes heating the stacked elements to a temperature below the melting temperature of the first fiber and above the melting temperature of the second fibers.

The invention relates to a melting conductor (1) provided for use for a fuse (2), preferably for a miniature fuse, with an electrically conductive melting wire (3). According to the invention an electrically insulating and/or electrically non-conductive covering (5) surrounding the outer shell surface (4) of the melting wire (3) at least in certain areas, preferably completely, is provided.

A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.

A surface mount device chip fuse including a dielectric substrate, electrically conductive first and second upper terminals disposed on a top surface of the dielectric substrate and defining a gap therebetween, a fusible element formed of solder disposed on the top surface of the dielectric substrate, within the gap, bridging the first and second upper terminals, and electrically conductive first and second lower terminals disposed on a bottom surface of the dielectric substrate and electrically connected to the first and second upper terminals, respectively, wherein a material of the dielectric substrate exhibits a de-wetting characteristic relative to the solder from which the fusible element is formed.

A surface mount fuse has a housing, a conductive fuse and a cover. The housing has an opening and a non-airtight interior space. The conductive fuse is disposed inside the non-airtight interior space. The cover covers the opening. Because the interior space of the housing is a non-airtight interior space and the conductive fuse is disposed inside the non-airtight interior space. The conductive fuse is not encapsulated by the materials with low thermal conductivity to avoid heat accumulation, so the conductive fuse may avoid the aging. Further, the internal atmospheric pressure and the external atmospheric pressure of the housing may be balanced. Therefore, the conductive fuse is not suffered from the pressure caused by the pressure difference between internal and external of the housing so that the reliability of the surface mount fuse is enhanced.

A method of manufacturing a fuse includes stacking a base plate, an at least partially conductive fabric over the base plate and a cover layer over the fabric, each with an intervening bonding layer. At least one cavity is provided on both sides of the fabric, adjoining the fabric, between the respective edge regions. In addition, the fabric includes at least one first fiber which is electrically conductive and second fibers which are non-conductive and which have a lower melting temperature than the first fiber. The method further includes heating the stacked elements to a temperature below the melting temperature of the first fiber and above the melting temperature of the second fibers.

A fuse module including a mounting block formed of an electrically insulating material, the mounting block having a rear wall extending from a base, a fuse plate including an electrically conductive bus bar disposed adjacent a rear surface of the rear wall, a fusible element electrically connected to the bus bar and disposed adjacent a front surface of the rear wall, and a fuse terminal electrically connected to the fusible element and extending onto a top of the base. The fuse module may further include an electrically conductive terminal post extending from the top of the base through the fuse terminal for facilitating connection to an electrical component.

A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.

A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.