An ion implanter includes a beam generator that generates anion beam, a beam scanner that performs reciprocating scan with the ion beam in a first direction, a platen driving device that performs reciprocating motion of a wafer in a second direction perpendicular to the first direction, while holding the wafer so that a wafer processing surface is irradiated with the ion beam subject to the reciprocating scan, and a control device that changes a beam scan speed in the first direction and a wafer motion speed in the second direction in accordance with a beam irradiation position in the first direction and the second direction at which the wafer processing surface is irradiated with the ion beam so that ions having a desired two-dimensional non-uniform dose distribution are implanted into the wafer processing surface.

A surface processing apparatus is an apparatus which performs surface processing on an inspection object 20 by irradiating the inspection object with an electron beam. A surface processing apparatus includes: an electron source 10 (including lens system that controls beam shape of electron beam) which generates an electron beam; a stage 30 on which an inspection object 20 to be irradiated with the electron beam is set; and an optical microscope 110 for checking a position to be irradiated with the electron beam. The current value of the electron beam which irradiates the inspection object 20 is set at 10 nA to 100 A.

A method for forming reliefs on the surface of a substrate, including a first implantation of ions in the substrate according to a first direction; a second implantation of ions in the substrate according to a second direction that is different from the first direction; at least one of the first and second implantations is carried out through at least one mask having at least one pattern; an etching of areas of the substrate having received by implantation a dose greater than or equal to a threshold, selectively to the areas of the substrate that have not received via implantation a dose greater than said threshold; the parameters of the first and second implantations being adjusted in such a way that only areas of the substrate that have been implanted both during the first implantation and during the second implantation receive a dose greater than or equal to said threshold.

An x-ray breast imaging system includes a breast support platform including an x-ray receptor, and an x-ray tube head. The x-ray tube head includes an x-ray source configured to emit an x-ray beam in a direction towards the x-ray receptor, and a collimator. A filter assembly including a plurality of filter slots selectively positionable adjacent to the collimator, and a specimen imaging filter disposed within a slot of the plurality of filter slots. The specimen imaging filter includes at least one aperture defined therein. The specimen imaging filter also blocks a portion of the emitted x-ray beam so that the at least one aperture defines a path of the emitted x-ray beam towards the x-ray receptor.

A process control method is provided for ion implantation methods and apparatuses, to produce a high dosage area on a substrate such as may compensate for noted non-uniformities. In an ion implantation tool, separately controllable electrodes are provided as multiple sets of opposed electrodes disposed outside an ion beam. Beam blockers are positionable into the ion beam. Both the electrodes and beam blockers are controllable to reduce the area of the ion beam that is incident upon a substrate. The electrodes and beam blockers also change the position of the reduced-area ion beam incident upon the surface. The speed at which the substrate scans past the ion beam may be dynamically changed during the implantation process to produce various dosage concentrations in the substrate.

A multi charged particle beam writing method includes emitting each corresponding beam in an “on” state while starting and continuing tracking control, shifting a writing position by beam deflection of the multi beams, in addition to tracking control, while continuing tracking control, emitting each corresponding beam in the next “on” state to the next writing position having been shifted while continuing tracking control, and returning the tracking position by resetting tracking control, after emitting each next corresponding beam to the next writing position having been shifted at least once, wherein writing of a predetermined region is completed by repeating the number of preset times a group of performing emitting, shifting, emitting, and returning, wherein the tracking time from start to reset of tracking control in at least one of the repeated groups is longer than the others.

Disclosed is a method of diagnosing a conversion process for converting a format of image data including unit data corresponding to charged particle beams into a format suitable for an aperture array, the aperture array having a plurality of controllers provided to match a plurality of the charged particle beams to control the charged particle beams, and a driver configured to drive the controllers. The method includes: extracting the unit data having an identical first rank based on an arrangement of the unit data in the image data from the unit data of each block including a predetermined number of the unit data and calculating a first checksum of each of the first rank; extracting the unit data having an identical second rank after the conversion process from the unit data of each block and calculating a second checksum of each of the second rank; and comparing the first and second checksums.

In one embodiment, A charged particle beam drawing apparatus includes an irradiation amount resetting processing circuitry changing the irradiation amount in the shot data to the irradiation amount lower limit value when the irradiation amount defined in the shot data is less than the irradiation amount lower limit value, a shot size adjustment processing circuitry changing the shot size defined in the shot data, based on an amount of the change in the irradiation amount, a shot position adjustment processing circuitry changing the shot position defined in the shot data, based on an amount of the change in the shot size, and a drawing device drawing a pattern by irradiating the substrate with the charged particle beam, using the shot data in which the irradiation amount, the shot size, and the shot position have been changed.

A system for creating a substantially planar face in a substrate, the system including directing one or more beams at a first surface of a substrate to remove material from a first location, the beam being offset from a normal to the first surface by a curtaining angle; sweeping the one or more beams in a plane that is perpendicular to the first surface to mill one or more initial cuts, the initial cuts exposing a second surface that is substantially perpendicular to the first surface; rotating the substrate about an axis other than an axis normal to the first beam or parallel to the first beam; directing the first beam at the second surface to remove additional material from the substrate without changing the curtaining angle; and scanning the one or more beams in across the second surface to mill one or more finishing cuts.

A charged particle beam writing apparatus includes a circuitry to set, when a charged particle beam is deflected to move between plural small regions by a deflector, plural first mesh regions obtained by virtually dividing a chip region into regions by length and width sizes same as those of each of the plural small regions; determine whether a shot figure having been assigned exists in each of the plural first mesh regions; a circuitry to perform, for the plural first mesh regions, merging of two or more adjacent first mesh regions; a circuitry to measure, for each of plural second mesh regions each obtained by merging, the number of first mesh regions each having been determined that an assigned shot figure exists therein; and a circuitry to generate a map for each chip, where measured number of first mesh regions with the shot figure is defined as a map value.