A gas supply assembly is described for delivery of gas to a plasma flood gun which includes an inert gas and a fluorine-containing gas, wherein the assembly is configured to deliver a volume of the fluorine-containing gas to the flood gun that is not greater than 10% of a total volume of the fluorine-containing and inert gasses. The fluorine-containing gas can generate volatile reaction product gases from material deposits in the plasma flood gun, and to effect re-metallization of a plasma generation filament in the plasma flood gun. In combination with the gas amounts, the assembly and methods can use gas flow rates to optimize the cleaning effect and reduce filament material loss from the plasma flood gun during use.

Charging areas in electron microscopy are identified by comparing images obtained in different frames. A difference image or one or more optical flow parameters can be used for the comparison. If charging is detected, electron dose is adjusted, typically just in specimen areas associated with charging. Dose is conveniently adjusted by adjusting electron beam dwell time. Upon adjustment, a final image is obtained, with charging effects eliminated or reduced.

Systems and methods are provided for dynamically compensating position errors of a sample. The system can comprise one or more sensing units configured to generate a signal based on a position of a sample and a controller. The controller can be configured to determine the position of the sample based on the signal and in response to the determined position, provide information associated with the determined position for control of one of a first handling unit in a first chamber, a second handling unit in a second chamber, and a beam location unit in the second chamber.

A charged particle beam specimen inspection system is described. The system includes an emitter for emitting at least one charged particle beam, a specimen support table configured for supporting the specimen, an objective lens for focusing the at least one charged particle beam, a charge control electrode provided between the objective lens and the specimen support table, wherein the charge control electrode has at least one aperture opening for the at least one charged particle beam, and a flood gun configured to emit further charged particles for charging of the specimen, wherein the charge control electrode has a flood gun aperture opening.

Systems and methods for implementing charged particle flooding in a charged particle beam apparatus are disclosed. According to certain embodiments, a charged particle beam system includes a charged particle source and a controller which controls the charged particle beam system to emit a charged particle beam in a first mode where the beam is defocused and a second mode where the beam is focused on a surface of a sample.

The purpose of the present invention is to provide a charged particle beam device that can specify irradiation conditions for primary charged particles that can obtain a desired charged state without adjusting the acceleration voltage. The charged particle beam device according to the present invention specifies the irradiation conditions for a charged particle beam in which the charged state of a sample is switched between a positive charge and a negative charge, and adjusts the irradiation conditions according to the relationship between the specified irradiation conditions and the irradiation conditions when an observation image of the sample has been acquired (see FIG. 8).

A method of charge mitigation in additive layer manufacturing is provided, which uses a charged particle beam (103) to fuse metal powder (122) within a metal powder bed (123) to form a product layer-by-layer, the method comprising using a charged particle beam optical system to form a charged particle beam, to steer the charged particle beam to be incident on a powder bed of metal powder and to scan over the powder bed to fuse powder into a desired layer shape. While steering the charged particle beam, the method comprises using a neutralising particle source (160) to generate neutralising particles of an opposite charge to the charged particles in the vicinity of the charged particle beam such that the neutralising particles are attracted to the charged particles of powder in the powder bed. An additive layer manufacturing apparatus (100) is also provided.

A method for single or multiply charged ion implantation into a surface of a treated object, and a device for implementing the implantation method, the method including: directing towards the surface of the treated object an ion beam produced by an ion source of the electronic cyclotron resonance type; producing at least one primary electron beam and directing the primary electron beam so that it passes through the ion beam; and producing a secondary electron beam by reflecting the primary electron beam onto a target once the primary electron beam has traversed the ion beam, the target being oriented such that the secondary electron beam falls onto the surface of the treated object.

A charged particle beam system includes a charged particle source, a multi beam generator, an objective lens, a projection system, and a detector system. The projection system includes a first subcomponent configured to provide low frequency adjustments, and the projection system comprises a second subcomponent configured to provide a high frequency adjustments.

Provided is a scanning electron microscope. The scanning electron microscope is capable of removing a charge generated on a side wall of a deep hole or groove, and inspects and measures a bottom portion of the deep hole or groove with high accuracy. Therefore, in the scanning electron microscope that includes an electron source 201 that emits a primary electron, a sample stage 213 on which a sample is placed, a deflector 207 that causes the sample to be scanned with the primary electron, an objective lens 203 that focuses the primary electron on the sample, and a detector 206 that detects a secondary electron generated by irradiating the sample with the primary electron, a potential applied to the sample stage is controlled to have a negative polarity with respect to a potential applied to the objective lens during a first period in which the sample is irradiated with the primary electron, and the potential applied to the sample stage is controlled to have a positive polarity with respect to the potential applied to the objective lens during a second period in which the sample is not irradiated with the primary electron.