A paint hardening device is a device for hardening paint applied to a workpiece and includes an electron beam emission portion configured to emit an electron beam to harden the paint, and a storage chamber in which the electron beam emission portion is accommodated. The paint hardening device is configured to move the workpiece and the electron beam emission portion relative to each other while the electron beam is being applied to the paint from the electron beam emission portion in a state where an inert gas atmosphere is formed at least in an electron-beam passing region where the electron beam passes in the storage chamber, the electron beam being applied to the paint from the electron beam emission portion.

The present invention provides an apparatus of charged-particle beam such as an electron microscope including a specimen table that can slide on a planar surface around the lower pole piece of the objective lens. The specimen table is confined in a specimen stage having one elastic protrusion and one or more elastic force receiving parts (e.g three permanent protrusions) that contact and press the table. When the specimen is under microscopic examination, disturbing vibration cannot generate a force sufficient to overcome the limiting friction between the specimen table and the planar surface of the objective lens. The invention exhibits numerous technical merits such as minimal or zero vibration noise, and improved image quality, among others.

Introduced here is a plasma polymerization apparatus and process. Example embodiments include a vacuum chamber in a substantially symmetrical shape to a central axis. A rotation rack may be operable to rotate about the central axis of the vacuum chamber. Additionally, reactive species discharge mechanisms positioned around a perimeter of the vacuum chamber in a substantially symmetrical manner from the outer perimeter of the vacuum chamber may be configured to disperse reactive species into the vacuum chamber. The reactive species may form a polymeric multi-layer coating on surfaces of the one or more devices. Each layer may have a different composition of atoms to enhance the water resistance, corrosion resistance, and fiction resistance of the polymeric multi-layer coating.

The invention relates to a method for operating a particle beam apparatus and/or a light microscope, to a computer program product and to a particle beam apparatus and a light microscope, by means of which this method is able to be carried out. The method includes a change in a first temperature of an object, wherein the object is arranged on an object receiving device rendered movable by a motor operated by a supply current. Changing the first temperature of the object alters a second temperature of the object receiving device from a first temperature value to a second temperature value. Further, the method includes changing the supply current of the motor from a first current value to a second current value, wherein the supply current is designed to hold the object receiving device in position, and changing a temperature of the object receiving device from the second temperature value to a third temperature value on account of heat generated by the motor, which is obtained by the second current value of the supply current and fed to the object receiving device. TOT1−15° C.≤TOT3≤TOT1+15° C. applies, where TOT1 is the first temperature value of the object receiving device and where TOT3 is the third temperature value of the object receiving device.

An actuator has: a motor section; a ball spline having a finite stroke and equipped with a shaft capable of moving along its axis; an external screw thread formed on the shaft; a nut section having an internal screw thread engaging the external screw thread and operating to transmit the rotary force of the motor section to the shaft; and a case housing the motor section and the ball spline. The shaft has a contact section at its front end, the contact section being designed to make contact with the driven object. The contact section is lower than the shaft in thermal conductivity. Due to heat generated by the motor section, the shaft elongates along the axis of the shaft in a first direction, and the case elongates along the axis of the shaft in a second direction opposite to the first direction.

A method of producing a compensation signal to compensate for misalignment of a drive unit clamp element can include applying a clamp element drive signal to a drive unit clamp element to engage a mover element. A first displacement of the mover element can be determined. A first compensation signal to be applied to one or more drive unit shear elements can be determined based at least in part on the first displacement. The first compensation signal can be applied to the one or more drive unit shear elements and the clamp element drive signal can be applied to the drive unit clamp element. A second displacement can be determined in response to the application of the first compensation signal and the clamp element drive signal. The second displacement can then be compared to a preselected threshold. For a second displacement less than the preselected threshold, combining the first compensation signal with an initial shear element drive signal to produce a modified shear element drive signal, and for a second displacement greater than the preselected threshold, determining a second compensation signal to be applied to the one or more drive unit shear elements.

Introduced here is a plasma polymerization apparatus and process. Example embodiments include a vacuum chamber in a substantially symmetrical shape to a central axis. A rotation rack may be operable to rotate about the central axis of the vacuum chamber. Additionally, reactive species discharge mechanisms positioned around a perimeter of the vacuum chamber in a substantially symmetrical manner from the outer perimeter of the vacuum chamber may be configured to disperse reactive species into the vacuum chamber. The reactive species may form a polymeric multi-layer coating on surfaces of the one or more devices. Each layer may have a different composition of atoms to enhance the water resistance, corrosion resistance, and fiction resistance of the polymeric multi-layer coating.

Introduced here is a plasma polymerization apparatus and process. Example embodiments include a vacuum chamber in a substantially symmetrical shape to a central axis. A rotation rack may be operable to rotate about the central axis of the vacuum chamber. Additionally, reactive species discharge mechanisms positioned around a perimeter of the vacuum chamber in a substantially symmetrical manner from the outer perimeter of the vacuum chamber may be configured to disperse reactive species into the vacuum chamber. The reactive species may form a polymeric multi-layer coating on surfaces of the one or more devices. Each layer may have a different composition of atoms to enhance the water resistance, corrosion resistance, and fiction resistance of the polymeric multi-layer coating.

Introduced here is a plasma polymerization apparatus and process. Example embodiments include a vacuum chamber in a substantially symmetrical shape to a central axis. A rotation rack may be operable to rotate about the central axis of the vacuum chamber. Additionally, reactive species discharge mechanisms positioned around a perimeter of the vacuum chamber in a substantially symmetrical manner from the outer perimeter of the vacuum chamber may be configured to disperse reactive species into the vacuum chamber. The reactive species may form a polymeric multi-layer coating on surfaces of the one or more devices. Each layer may have a different composition of atoms to enhance the water resistance, corrosion resistance, and fiction resistance of the polymeric multi-layer coating.

Methods of manufacturing memory devices are provided. The method comprises pre-cleaning a top surface of a film stack, the film stack comprising alternating layers of a first material layer and a second material layer and having one or more of a memory hole and a slit pattern opening extending through the film stack; exposing the top surface of the film stack to a growth inhibitor; selectively depositing a silicon-containing dielectric layer in a region of the film stack; and densifying the silicon-containing dielectric layer. The processing method is performed in a processing tool without breaking vacuum.