The purpose of the present disclosure is to propose a charged particle beam device capable of allowing specifying of a distance between irradiation points for a pulsed beam and a time between irradiation points. Proposed is a charged particle beam device equipped with a beam column which has a scanning deflector for sweeping a beam and directs the beam swept by the scanning deflector onto a sample in pulses, wherein: the distance between irradiation points of the pulsed beam is set such that feature quantities of one or more specific regions of an image obtained on the basis of an output of a detector satisfy a predetermined state; the duration of time between irradiation points for the pulsed beam is changed when in a state in which the set distance between irradiation points is set or in a state in which multiple distances between irradiation points determined on the basis of the specified distance between irradiation points are set; and the beam emission is carried out according to the duration of time between irradiation points whereby the feature quantities of the multiple specific regions of the image obtained on the basis of the output of the detector satisfy the predetermined state.

A device for observing a specimen, such as a charged particle beam device exemplified by a scanning electron microscope and a transmission electron microscope in which an operator can specify minute bubbles with high contrast in a charged particle beam image of a liquid subjected to processing of generating bubbles, using a phenomenon in which contrast as high as an operator can specify minute bubbles is provided in a charged particle beam image of a specimen including an ionic liquid and a liquid subjected to processing of generating bubbles, thus making it possible to recognize minute bubbles in a liquid.

A scanning electron microscope of the present invention performs scanning by changing a scanning line density in accordance with a sample when an image of a scanned region is formed by scanning a two-dimensional region on the sample with an electron beam or is provided with a GUI having sample information input means which inputs information relating to the sample and display means which displays a recommended scanning condition according to the input and performs scanning with a scanning line density according to the sample by selecting the recommended scanning condition. As a result, in observation using a scanning electron microscope, a suitable scanning device which can improve contrast of a profile of a two-dimensional pattern and suppress shading by suppressing the influence of charging caused by primary charged particle radiation and by improving a detection rate of secondary electrons and a scanning method are provided.

The scanning charged particle beam microscope according to the present application is characterized in that, in acquiring an image of the FOV (field of view), interspaced beam irradiation points are set, and then, a deflector is controlled so that a charged particle beam scan is performed faster when the charged particle beam irradiates a position on the sample between each of the irradiation points than when the charged particle beam irradiates a position on the sample corresponding to each of the irradiation points (a position on the sample corresponding to each pixel detecting a signal). This allows the effects from a micro-domain electrification occurring within the FOV to be mitigated or controlled.

A charged particle beam apparatus includes: an electromagnetic wave generation source 16 that generates an electromagnetic wave with which a sample is irradiated; a charged particle optical system that includes a pulsing mechanism 3 and irradiates the sample with a focused charged particle beam; a detector 10 that detects an emitted electron emitted by an interaction between the charged particle beam and the sample; a first irradiation control unit 15 that controls the electromagnetic wave generation source and irradiates the sample with a pulsed electromagnetic wave to generate an excited carrier; a second irradiation control unit 14 that controls the pulsing mechanism and irradiates an electromagnetic wave irradiation region of the sample with a pulsed charged particle beam; and a timing control unit 13. While the emitted electrons are detected by the detector in synchronization with irradiation of the pulsed charged particle beam, the timing control unit controls the first irradiation control unit and the second irradiation control unit, and controls an interval time between the pulsed electromagnetic wave and the pulsed charged particle beam to the electromagnetic wave irradiation region. As a result, based on a transient change in an electron emission amount, it is possible to detect sample information with nano spatial resolution.

An electron microscope includes: a display control unit which sequentially acquires electron microscope images of a sample and causes a display unit to display the electron microscope images as a live image; an analysis area setting unit which sets an analysis area on the sample based on a designated position on the live image designated by pointing means; and an analysis control unit which performs control for executing elemental analysis of the set analysis area. The analysis area setting unit sets, as the analysis area, an area on the sample which corresponds to a continuous area including the designated position and having brightness comparable to brightness of the designated position.

The scanning charged particle beam microscope according to the present application is characterized in that, in acquiring an image of the FOV (field of view), interspaced beam irradiation points are set, and then, a deflector is controlled so that a charged particle beam scan is performed faster when the charged particle beam irradiates a position on the sample between each of the irradiation points than when the charged particle beam irradiates a position on the sample corresponding to each of the irradiation points (a position on the sample corresponding to each pixel detecting a signal). This allows the effects from a micro-domain electrification occurring within the FOV to be mitigated or controlled.

A system and method is provided for of characterizing nanostructured surfaces. A nanostructure sample is placed in an SEM chamber and imaged. The system and method locates one of the nanostructures using images from the SEM imaging, excises a top portion of the nanostructure, places said top portion on a substrate such that the nanostructures are perpendicular to the substrate and a base of the top portion contacts the substrate, performs high energy ion beam assisted deposition of metal at the base to attach the top portion to the substrate, SEM imaging the top portions in the SEM chamber, determining coordinates of the top portions relative to the substrate from the SEM imaging of the top portions, placing the substrate in an AFM chamber, and performing AFM imaging of the top portions using the coordinates previously determined.

A charged particle beam device capable of easily discriminating the energy of secondary charged particles is realized. The charged particle beam device includes a charged particle source, a sample stage on which a sample is placed, an objective lens that irradiates the sample with a charged particle beam from the charged particle source, a deflector that deflects secondary charged particles released by irradiating the sample with the charged particle beam, a detector that detects the secondary charged particles deflected by the deflector, a sample voltage control unit that applies a positive voltage to the sample or the sample stage, and a deflection intensity control unit that controls the intensity with which the deflector deflects the secondary charged particles.

A semiconductor pattern detecting apparatus is provided. The semiconductor pattern detecting apparatus includes a stage configured to position a wafer formed with a semiconductor pattern, the stage extending in a first direction and a second direction perpendicular to the first direction, an electron emitter configured to irradiate first electrons on the semiconductor pattern, an electrode configured to generate an electric field to induce an electric potential on a surface of the semiconductor pattern, a detector configured to detect second electrons emitted from the semiconductor pattern, an imager configured to obtain a plurality of first images by using the second electrons detected by the detector, and at least one controller configured to apply a first voltage and a second voltage different from the first voltage to the electrode alternately and repeatedly and to generate a second image by combining the plurality of first images, wherein the imager is so configured that each of the plurality of first images are obtained when the first voltage is applied to the electrode.