An organic light emitting diode (OLED) display includes: a substrate; an organic light emitting diode formed on the substrate; a metal oxide layer formed on the substrate and covering the organic light emitting diode; a first inorganic layer formed on the metal oxide layer and covering a relatively larger area than the metal oxide layer; a first organic layer formed on the first inorganic layer and covering a relatively smaller area than the first inorganic layer; and a second inorganic layer formed on the first organic layer, covering a relatively larger area than the first organic layer, and contacting the first inorganic layer at an edge of the second inorganic layer.

A radiation-sensitive resin composition comprises: a polymer, and a radiation-sensitive acid generator. The polymer comprises a structural unit comprising: an acid-labile group; and an oxoacid group or phenolic hydroxyl group protected by the acid-labile group. The acid-labile group is represented by formula (1). R.sup.1 and R.sup.2 each independently represent a divalent organic group having 1 to 20 carbon atoms. R.sup.3 represents a monovalent group having 1 to 40 atoms and having at least one selected from the group consisting of an oxygen atom, a sulfur atom and a nitrogen atom. * denotes a binding site to the oxy group in the oxoacid group or phenolic hydroxyl group protected.

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A display device which can display a clear image and can display an image with low power consumption is provided. The display device includes an arithmetic circuit having a function of generating first to third display data, a first display portion, and a second display portion. The arithmetic circuit has a function of detecting a color region and a gray-scale region of the generated first display data and generating the second display data corresponding to an image to be displayed on the first display portion and the third display data corresponding to an image to be displayed on the second display portion, on the basis of the detection results.

In one embodiment, a method of manufacturing a semiconductor device includes forming a first film on a substrate. The method further includes performing a first process of forming a concave portion in the first film and forming a second film on a surface of the first film that is exposed in the concave portion by using a first gas containing a carbon element and a fluorine element. The method further includes performing a second process of exposing the second film to a second gas containing a hydrogen element or a fluid generated from the second gas.

A method includes providing a first plate including a first surface, a second surface opposite to the first surface, and a first recess indented from the first surface towards the second surface; providing a semiconductor structure including a third surface, a fourth surface opposite to the third surface, and a first sidewall extending between the third surface and the fourth surface; placing the semiconductor structure over the first plate; and disposing a priming material over the third surface of the semiconductor structure, wherein a peripheral portion of the fourth surface of the semiconductor structure is in contact with the first surface of the first plate upon the disposing of the priming material.

A method of forming a vertical fin field effect transistor (vertical finFET) with a self-aligned shallow trench isolation region, including forming a pinch-off layer on one or more vertical fin segments, wherein the pinch-off layer has a thickness on the sidewalls of the one or more vertical fin segments, forming a trench mask layer on predetermined portions of the pinch-off layer, removing portions of the pinch-off layer not covered by the trench mask layer, where the removed portions of the pinch-off layer exposes underlying portions of the substrate, and removing at least a portion of the substrate to form one or more isolation region trenches, where the distance of the sidewall of one of the one or more isolation region trenches to an adjacent vertical fin segment is determined by the thickness of the pinch-off layer.

A photocurable composition for imprint at least has a polymerizable compound (A) and a photopolymerization initiator (B), in which the polymerizable compound (A) contains 20% by weight or more of a multifunctional (meth)acrylic monomer and the glass transition temperature of a photocured substance of the photocurable composition is 90° C. or more.

A semiconductor device includes: a first conductive plate and a second conductive plate disposed adjacent to the first conductive plate; a first insulating plate disposed over the first conductive plate and the second conductive plate; a third conductive plate disposed over the first insulating plate; a second insulating plate disposed over the third conductive plate; a fourth conductive plate disposed over the second insulating plate; a first conductive via penetrating the fourth conductive plate, the second insulating plate, the first insulating plate, and the first conductive plate, wherein the first conductive via is electrically coupled to the fourth conductive plate and the first conductive plate; and a second conductive via penetrating the second insulating plate, the third conductive plate, the first insulating plate, and the second conductive plate, wherein the second conductive via is electrically coupled to the third conductive plate and the second conductive plate.

A pattern-forming method includes forming a base pattern including a first polymer on a front face side. A composition is applied on at least a lateral face of the base pattern. The composition includes at least one polymer that is capable of interacting with the first polymer. The composition is heated such that a portion of the at least one polymer interacts with the first polymer and that a coating film is formed on the lateral face of the base pattern. Another portion of the at least one polymer not having interacted with the first polymer is removed to form a resist pattern. The base pattern in a planar view has a shape with a long axis and a short axis, and a ratio of lengths of the long axis to the short axis is no less than 1.5 and no greater than 10.

A composition for protective film formation can form a flat film that satisfactorily functions as a mask (protection) against wet etchants during semiconductor substrate processing and has a low dry etching rate, the composition having satisfactory covering and recess-filling properties when applied to rugged substrates and having a small thickness difference after the recess filling. A protective film, a resist underlayer film, and a resist-pattern-coated substrate each produced using the composition; and a method for producing a semiconductor device. The composition, which is for forming films for protection against wet etchants for semiconductors, includes an organic solvent and a compound that has a molecular end having a structure including at least one pair of adjoining hydroxyl groups and has a molecular weight of 1,500 or less, wherein particles present therein have an average particle diameter, as determined by a dynamic light scattering method, of 3 nm or smaller.