A dispensing system includes a dispense material supply that contains a dispense material and a dispensing pump connected downstream from the dispense material supply. The dispensing pump includes a body made of a first electrically conductive material, one or more first electrical contacts that are disposed on the body of the dispensing pump, and one or more first connection wires that are coupled between each one of the one or more first electrical contacts and ground. The dispensing system also includes a dispensing nozzle connected downstream from the dispensing pump and includes a tube made of a second electrically conductive material, one or more second electrical contacts that are disposed on an outer surface of the tube, and one or more second connection wires that are coupled between each one of the one or more second electrical contacts and the ground.

A substrate processing chamber includes a housing providing a process space; a spin apparatus provided in the housing; and a fluid spraying nozzle configured to spray fluid into the process space, wherein the spin apparatus includes: a spin chuck configured to support a substrate; a rotation driving part configured to rotate the spin chuck; and a weight sensor configured to measure a weight of the substrate supported on the spin chuck.

With respect to an accommodation container that accommodates a substrate-shaped sensor, the accommodation container includes a container body that has an opening, a support that is disposed inside the container body and configured to support the substrate-shaped sensor, a contact pin that is disposed inside the container body and configured to come into contact with a terminal portion of the substrate-shaped sensor, a driving mechanism that is disposed inside the container body and configured to drive the contact pin, a rotation shaft member that drives the driving mechanism from an outside of the container body, a jack that is disposed outside the container body and electrically connected to the contact pin, and a lid that is configured to close the opening of the container body.

A buffer unit for storing a substrate includes a housing having a buffer space inside, a substrate support unit that supports one or more substrates in the buffer space, a pressure adjustment unit that adjusts pressure in the buffer space, and a controller that controls the pressure adjustment unit. The pressure adjustment unit includes a gas supply line that supplies a gas for pressurizing the buffer space and a gas exhaust line that reduces the pressure in the buffer space. The controller controls the pressure adjustment unit to maintain the buffer space in a selected one of a filling mode in which the buffer space is filled with the gas and an exhaust mode in which the buffer space is evacuated.

A measurement device and method for a semiconductor structure are provided. The measurement device for the semiconductor structure includes a bearing platform, a clamping mechanism, and an image acquisition system. The clamping mechanism is installed on the bearing platform and includes a clamp disposed along a vertical direction. The clamp is configured to clamp the semiconductor structure such that the semiconductor structure is clamped with a to-be-measured surface facing a side. The image acquisition system is disposed by a side of the clamping mechanism, and is configured to acquire a three-dimensional morphology of the semiconductor structure from the side.

There is provided a technique that includes: high-frequency power sources supplying power to plasma generators; and matchers installed between the high-frequency power sources and the plasma generators and matching load impedances of the plasma generators with output impedances of the high-frequency power sources, wherein at least one of the high-frequency power sources includes: a high-frequency oscillator; a directional coupler at a subsequent stage of the high-frequency oscillator, which extracts a part of a traveling wave component from the high-frequency oscillator and a part of a reflected wave component from the matcher; a filter removing a noise signal in the reflected wave component extracted by the directional coupler; and a power monitor measuring the reflected wave component after passing through the filter and the traveling wave component extracted by the directional coupler and feedback-controlling the matcher to reduce a ratio between the reflected wave component and the traveling wave component.

The present application discloses a pressure drive system and method, and a semiconductor manufacture apparatus employing the system to perform pressure drive; by importing information of this wafer before a manufacture process initiates, a corresponding safe driving pressure and a corresponding safety threshold for each wafer are acquired and set for pressure control, and an abnormality judgment is performed based on data fed back by a pressure detection module in real time, thereby effectively avoiding a wafer breakage caused when an electrostatic release is abnormal, and the pressures for various wafers under different situations are controllable, and thus, an accuracy of the control is improved; with real-time feedback from the pressure detection module and a pressure regulation module, a wafer breakage, caused when an electrostatic release is abnormal, is effectively avoided.

An apparatus includes a substrate; circuit components disposed on the substrate; and a location identifier layer over the circuit, wherein the location identifier layer includes one or more section labels for representing physical locations of the circuit components within the apparatus.

The present disclosure provides an apparatus. The apparatus according to the present disclosure comprises: at least one first light source configured to irradiate illumination light to an object on a reference surface; at least one second light source configured to irradiate pattern light to the object, a plurality of cameras configured to capture one or more illumination images and one or more pattern images; and one or more processors configured to determine a plurality of outlines indicating edges of the object based on two or more images captured in different directions among the one or more illumination images and the one or more pattern images; determine a virtual plane corresponding to an upper surface of the object based on the plurality of outlines; and determine an angle between the virtual plane and the reference plane.

A probing apparatus includes a frame, a testing device, a rotatable testing platform, and a probe module. The testing device is disposed on the frame and is displaceable along an X direction and a Y direction perpendicular to the X direction. The rotatable testing platform is disposed on the frame and is rotatable around a rotating axis extending in the X direction. A direction perpendicular to the X direction and the Y direction is a Z direction, and the rotatable testing platform and the testing device are located at different positions of the Z direction. The probe module is disposed on the rotatable testing platform.