A substrate processing apparatus includes: a chamber that accommodates a boat; a transfer mechanism that is provided inside the chamber, and transfers a substrate; a first camera that captures an image of a support column of the boat and the substrate; a support member that is inserted through an opening formed in a wall surface of the chamber, and supports the first camera; and a driver that drives the support member in order to move the first camera between a standby position and a measurement position.

A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.

Embodiments of equipment front end modules (EFEMs) are provided herein. In some embodiments, an EFEM includes: two or more loadports for receiving two or more types of substrates; an overhead storage unit having a plurality of storage shelves disposed above the two or more loadports and configured to hold two or more types of front opening unified pods (FOUPs) of different sizes that store the two or more types of substrates, respectively, wherein a horizontal alley is disposed between the plurality of storage shelves and the two or more loadports to provide a horizontal passageway for the FOUPs during transport to the two or more loadports; and an overhead transport system having a pair of vertical actuators disposed on opposite sides of the overhead storage unit and configured to transport FOUPs from the overhead storage unit to the two or more loadports.

A batch processing oven comprising a processing chamber and a rack configured to be positioned in the processing chamber. The rack is configured to support a plurality of substrates and a plurality of panels in a stacked manner such that one or more substrates of the plurality of substrates are positioned between at least one pair of adjacent panels of the plurality panels. Vertical gaps separate each substrate of the one or more substrates from an adjacent substrate or panel on either side of the substrate.

A semiconductor processing station includes first and second chambers, and a cooling stage. The second chamber includes a cooling pipe disposed inside the second chamber, and an external pipe. The cooling pipe includes a first segment disposed along a sidewall of the second chamber, and a second segment disposed perpendicular to the first segment and located above a wafer carrier in the second chamber. An end of the second segment is connected to an end of the first segment. The external pipe is connected to the second segment distal from the end of the second segment to provide a fluid to flow through the cooling pipe from an exterior to an interior of the second chamber. The fluid discharges toward the wafer carrier through the first segment. The first chamber is surrounded by the second chamber and the cooling stage, and communicates between the cooling stage and the second chamber.

The present disclosure relates to a method for inspecting a container body adapted and configured to hold substrates, comprising the steps of directing light from a light source onto a reflector element positioned within an interior space of the container body, such that the light is reflected to illuminate at least one interior surface of the container body, wherein the light is reflected by the reflector element in a diffuse manner and generating at least one image of the at least one interior surface by means of at least one camera, and evaluating the state of the container body on the basis of the at least one image.

Described herein is a technique capable of reducing the time necessary for stabilizing the inner temperature of the processing furnace. A substrate processing apparatus may include: a wafer retainer configured to support a plurality of wafers; an upright cylindrical process vessel; a seal cap configured to cover an opening at a lower end of the process vessel; a first heater configured to heat an inside of the process vessel from a lateral side thereof; an insulating unit disposed between the seal cap and the wafer retainer; and a second heater facing at least one of the plurality of wafers and configured to heat the at least one of the plurality of wafers, the second heater including: a pillar penetrating centers of the seal cap and the insulating unit; an annular member connected to and concentric with the pillar; a pair of connecting parts connecting end portions of the annular member to the pillar; and a heating element disposed inside the annular member.

The present invention provides a quartz clip device and a manufacturing method thereof and an OLED high-temperature oven having the quartz clip device. The quartz clip device includes: a base (20), a plurality of quartz posts (30) mounted on the base (20), a quartz bottom board (40) arranged above the base (20), and a plurality of quartz plates (50) arranged above the quartz bottom board (40) and secured to the quartz posts (30). The quartz bottom board (40) includes a plurality of circular holes (42) formed therein to respectively correspond to the quartz posts (30). The circular holes (42) have a diameter that is slightly greater than a diameter of the quartz posts (30). The quartz posts (30) are received through he circular holes (42) and fastening members (60) are provided under the circular holes (42) to have the quartz bottom board (40) supported on the quartz posts (30). Slightly enlarging the diameter of the circular holes of the quartz bottom board ensures slight tipping of the quartz posts does not result in contact with the quartz bottom board so as to prevent cracking of the quartz bottom board from being caused by the contacts and affecting the production.

Described herein is a technique capable of detecting a substrate state without contacting the substrate. According to one aspect of the technique, there is provided (a) loading a substrate retainer, where a plurality of substrates is placed, into a reaction tube; (b) processing the plurality of the substrates by supplying a gas into the reaction tube; (c) unloading the substrate retainer out of the reaction tube after the plurality of the substrates is processed; and (d) detecting the plurality of the substrates placed on the substrate retainer after the substrate retainer is rotated by a first angle with respect to a transferable position, wherein the plurality of the substrates is transferable to/from the substrate retainer in the transferable position.

A system and method concurrently processes multiple wafers. A cassette structure includes multiple chucks and a drive spool for supporting and rotating the chucks. Each chuck holds a wafer in position while rotating. The cassette structure is loaded into a process chamber. Each chuck includes a self-locking mechanism that is activated by the centrifugal force generated from the rotation of the chuck. The self-locking mechanism centers and holds a wafer in position with respect to the chuck. A drive motor drives the drive spool, which causes the chucks to rotate. As the chucks are being rotated, a dispensing assembly delivers a processing chemical to the wafers.