A wafer processing apparatus includes a reaction tube extending in a vertical direction, a door plate configured to load a boat into the reaction tube and positioned under the reaction tube to seal the reaction tube, the boat supporting a plurality of wafers thereon, a gas injector extending in the vertical direction along the boat within the reaction tube and including a plurality of ejection holes formed therein, a rotary mechanism configured to rotate the gas injector about its center axis to adjust an angle of the ejection hole toward the wafer, and a lift mechanism configured to move the gas injector upward and downward to adjust a height of the ejection hole on the wafer.

A wafer boat configured to be placed on a pedestal of a vertical batch furnace, the pedestal having a substantially flat support surface. The wafer boat comprises a support ring defining a substantially flat bottom end surface of the wafer boat, and an alignment ring substantially concentric with the support ring. Either the support surface of the pedestal, or a bottom side of the alignment ring is provided with a plurality of alignment elements respectively protruding upwards from the support surface or downwards from the alignment ring, while the other one is provided with a plurality of alignment openings configured to accommodate therein the plurality of alignment elements. The support ring downwardly protrudes beyond the alignment ring so that, when the wafer boat is placed on the pedestal, the support ring is supported on the support surface while the alignment ring is spaced from the support surface of the pedestal.

There is provided a technique that includes a substrate holder configured to arrange and hold substrates; and a reaction tube in which the substrate holder is accommodated. The substrate holder includes a plurality of pillars installed around the arranged substrates and extending in a direction substantially perpendicular to the substrates, a top plate configured to fix one ends of the pillars to each other and having an opening at a center of the top plate, and a bottom plate configured to fix other ends of the pillars to each other. The reaction tube includes a protrusion protruding inward. The protrusion is installed to be inserted into the opening of the top plate in a state where the substrate holder is accommodated in the reaction tube, and is configured to be closer to a substrate arranged closest to the top plate of the substrate holder than the top plate.

Described herein is a substrate processing technique of preventing particle generation while lowering an inner pressure of a nozzle and improving a film thickness uniformity. According to one aspect thereof, a substrate processing apparatus includes a boat for supporting substrates; an inner tube surrounding the boat and provided with an exhaust hole through which a gas is exhausted along a direction orthogonal to an arrangement direction of the substrates; a mixing structure for generating a mixed gas for processing the substrates; and a nozzle installed apart from an inner lateral surface of the inner tube and through which the mixed gas supplied from the mixing structure is discharged into the inner tube via discharge holes arranged at the nozzle along the arrangement direction of the substrates. A discharge direction of each of the discharge holes is not toward the boat but toward the inner lateral surface of the inner tube.

A semiconductor wafer cassette roller type transportation structure system includes a roller type transportation structure body, a rotating transportation structure body, and a lateral movement transportation structure body. The roller type transportation structure system includes connected left and right supporting frames. A plurality of large rollers are provided on an inner surface end of each of the right and left supporting frames. A plurality of small rollers are provided under the large rollers. A plurality of driving wheels are provided under the large rollers. The large and small rollers are driven by a driving belt. The driving wheels can linearly move a wafer cassette. In response to the roller type transportation structure body vertically transporting the wafer cassette, the rotating transportation structure body rotates to change a movement direction of the wafer cassette, and the lateral movement transportation structure body transports the wafer cassette along a lateral movement direction.

A substrate processing apparatus includes a substrate transfer device that transfers a substrate accommodated in a substrate transfer container to a substrate holder; a substrate holder transfer stage that introduces the substrate holder into a reaction container; a substrate transfer controller that obtains a film thickness measurement result of the substrate, and determines a placing position of the substrate in the substrate holder by a model created in advance from the film thickness measurement result and a transfer position setting circuit; an information processing circuit that analyzes an eccentricity state from a film thickness variation state when a film thickness measurement result is newly obtained; a learning function circuit that updates the model from the eccentricity state; and an optimization function circuit that updates the placing position of the substrate by an updated model and the transfer position setting circuit.

There is provided a technique that includes: a boat including plural slots to hold at least one substrate; a process furnace that processes the at least one substrate held in the boat; a boat elevator that raises and lowers the boat; a transfer device that transfers the at least one substrate between plural carriers where the at least one substrate is stored and the boat; and a controller capable of controlling the boat elevator and the transfer device, wherein the controller sets plural positions where the transfer device transfers the at least one substrate to the boat elevator, and select the positions to minimize a number of shifts among the positions of the boat elevator or total time taken during the shifts.

Fully automated batch production thin film deposition systems configured to deliver uniformity combined with high throughput at a low cost-per-wafer. In some examples, systems of the present disclosure include automated safe wafer handling via low-impact batch transfer via transportable wafer racks loaded with a plurality of wafers. In some examples, systems include a modular pre-heat & cool-down architecture that enables a flexible thermal management solution tailored around particular specifications.

A robot system includes a robot arm and an end effector coupled to the robot arm for receiving an item, the end effector having an aperture defined therein that is partially covered by an item when the item is received by the end effector. The system may include data processors in communication with the robot arm and an input to receive data from a sensor that can detect obstruction thereof as the end effector is moved past the sensor with the aperture aligned with the sensor. The robot system is able to determine a center of the item from positional information captured during sensor transitions. The robot system can then place the item such that the determined center of the item is received at an intended center location. Also disclosed is an end effector coupled to the robot arm for receiving an item, the end effector having sensor regions that are obscured when an item is received by the end effector, and a sensor module directed at the sensor regions on the end effector, the sensor module and the sensor regions in combination being operable to detect when the item obscures the sensor regions.

A heater and/or cooler chamber includes a heat storage block or chunk. In the block a multitude of parallel, stacked slit pockets each dimensioned to accommodate a single plate shaped workpiece. Workpiece handling openings of the slit pockets are freed and respectively covered by a door arrangement. The slit pockets are tailored to snuggly surround the plate shaped workpieces therein so as to establish an efficient heat transfer between the heat storage block or chunk and the workpieces to be cooled or heated.