The present disclosure provides a support device for conveying at least one solar cell element in a transport direction, wherein the support device comprises a support element configured for supporting the at least one solar cell element and an electric arrangement configured for providing an electrostatic force for holding the at least one solar cell element on the support element.

The present disclosure provides a support device for conveying at least one solar cell element in a transport direction, wherein the support device comprises a support element configured for supporting the at least one solar cell element and an electric arrangement configured for providing an electrostatic force for holding the at least one solar cell element on the support element.

A loading plate structure and a carrier are provided. The loading plate structure applied to a panel carrier for transporting panels. The loading plate structure comprises of a main body, the main body including at least one recess for receiving a panel therein, wherein a size of any side of the at least one recess is larger than a size of a corresponding side of the panel received therein, and a taking/disposing location formed on the main body with an opening for taking or disposing the panel, wherein through the taking/disposing location the panel is disposed in one recess corresponding to a size of the panel, or is taken out from the recess. The loading plate structure and the carrier can prevent effectively the panels from falling in transport process, promote transport efficiency and product yields, and increase the convenience of late maintenance and cost control.

A load port for loading wafers to and unloading wafers from a front opening unified pod (FOUP) includes a shield member that covers and provides a seal over an opening of the FOUP. The shield member includes a narrow wafer slot that is sized to allow a single wafer to be loaded to or unloaded from the FOUP but otherwise minimize loss of the purge environment within the FOUP. The shield member is movable so that the wafer slot may be moved vertically to provide a wafer transfer robot access to any desired wafer position within the FOUP. The shield member, for example, may be a flexible sheet that is held taut and is rolled onto and off of at least one roller to vertically position the wafer slot. The shield member may alternatively be one or more rigid members that slide on rails to vertically position the wafer slot.

This application provides a substrate carrier apparatus and a liquid crystal display (LCD) manufacturing device. The substrate carrier apparatus includes: a carrier platform, configured to carry a substrate; and a conductor, including a power receiving terminal and a ground terminal, where the power receiving terminal is electrically connected to the substrate, and the ground terminal is grounded.

The present disclosure provides an apparatus for manufacture of at least two solar cell arrangements. The apparatus includes a separation device configured for separating a first solar cell into two or more first solar cell solar cell pieces, and at least one positioning device configured for positioning at least one first solar cell piece of the two or more first solar cell pieces on a support device for forming a first solar cell arrangement of the at least two solar cell arrangements and for positioning at least one other first solar cell piece of the two or more first solar cell pieces on the support device for forming a second solar cell arrangement of the at least two solar cell arrangements.

A substrate processing system includes a substrate loading unit which loads a plurality of substrates, a substrate transfer unit which transfers N (where N is natural number) substrates at the same time from the substrate loading unit, and a substrate processing unit including a plurality of process chambers which receives the N substrates at the same time from the substrate transfer unit and processes the received substrates where each of the process chambers includes a stage on which the N substrates are disposed and an insulation layer disposed between the N substrates.

A semiconductor wafer is as wide as the industry standard width A (presently 156 mm+/1 mm) and is longer than the industry standard A by at least 1 mm and as much as the standard equipment can reasonably accommodate, presently approximately 3-20 mm and potentially longer, thus, gaining significant additional surface area for sunlight absorption. Modules may be composed of a plurality of such larger wafers. Such wafers can be processed in conventional processing equipment that has a wafer retaining portion of industry standard size A and a configuration that also accommodates a wafer with a perpendicular second edge longer than A by at least 1 and typically 3-20 mm. Wet bench carriers and transport and inspection stations can be so used.

A substrate processing system includes a substrate loading unit which loads a plurality of substrates, a substrate transfer unit which transfers N (where N is natural number) substrates at the same time from the substrate loading unit, and a substrate processing unit including a plurality of process chambers which receives the N substrates at the same time from the substrate transfer unit and processes the received substrates where each of the process chambers includes a stage on which the N substrates are disposed and an insulation layer disposed between the N substrates.

A system for processing wafers in a vacuum processing chamber. Carrier comprising a frame having a plurality of openings, each opening configured to accommodate one wafer. A transport mechanism configured to transport the plurality of carriers throughout the system. A plurality of wafer plates configured for supporting wafers. An attachment mechanism for attaching a plurality of wafer plates to each of the carriers, wherein each of the wafer plates is attached to a corresponding position at an underside of a corresponding carrier, such that each of the wafers positioned on one of the wafer carriers is positioned within one of the plurality of opening in the carrier. Mask attached over front side of one of the plurality of opening in the carrier. Alignment stage supports wafer plate under the opening in the carrier. A camera positioned to simultaneously image the mask and the wafer.