Embodiments of the present disclosure relate to apparatus, systems and methods for substrate processing. A detachable substrate support is disposed within a processing volume of a processing chamber and the substrate support includes a substrate interfacing surface and a back surface. The pedestal hub has a supporting surface removably coupled to the substrate support. A hub volume of the pedestal hub includes temperature measuring assembly disposed therein positioned to receive electromagnetic energy emitted from the back surface of the substrate support. The temperature measuring assembly measures an intensity of the electromagnetic energy entering the assembly and generates intensity signals. An apparent temperature of the substrate is determined based on the intensity signals.

A carrier FOUP and a method of placing a carrier are provided. The carrier FOUP includes a body and a door. The body includes a plurality of chamfers, and one or more carriers are placed on, and supported by, the plurality of chamfers. The method of placing a carrier includes placing the carrier in the carrier FOUP and closing the door of the carrier FOUP. When the door is closed, the door pushes against the carrier and aligns the carrier with the alignment feature. The alignment features align the carrier, removing the need to be aligned by the factory interface robot when placing or removing the carrier from the carrier FOUP.

Embodiments of the present disclosure relate to apparatus, systems and methods for substrate processing. A detachable substrate support is disposed within a processing volume of a processing chamber and the substrate support includes a substrate interfacing surface and a back surface. The pedestal hub has a supporting surface removably coupled to the substrate support. A hub volume of the pedestal hub includes temperature measuring assembly disposed therein positioned to receive electromagnetic energy emitted from the back surface of the substrate support. The temperature measuring assembly measures an intensity of the electromagnetic energy entering the assembly and generates intensity signals. An apparent temperature of the substrate is determined based on the intensity signals.

A wafer carrier assembly comprising a wafer carrier having a first and second side, the first side including: a circular recess configured to receive a semiconductor device wafer, and at least one cut-out arranged along the circumference of the circular recess. The first side also includes a carrier cover having a top and bottom side, the top side including: a plurality of gridlines extending to edges of the carrier cover, and a plurality of reticles extending from the top side to the bottom side where subsets of reticles are arranged to have a common center and each subset of reticles is arranged at each intersection of the plurality of gridlines.

A wafer carrier that exhibits a thin, low-profile includes a bottom support plate upon which a thinned semiconductor wafer may be positioned, with a holding ring disposed to surround the periphery of the wafer and engage with the bottom support plate to hold the wafer in a fixed position between the two components. The bottom support plate is formed to include a plurality of apertures for pulling a vacuum through the carrier, as well as features that engage with the holding ring and alignment fiducials for properly registering the orientation of the wafer's surface with respect to the wafer carrier and other testing equipment using the wafer carrier.

A technique for handling an integrated circuit tape assembly having a plurality of integrated circuits supported by underlying dicing tape involves placing the integrated circuit tape assembly on a film frame carrier (FFC) frame, stretching the dicing tape while on the FFC frame, and securing the stretched dicing tape by engaging a spring ring with the dicing tape and FFC frame. Adjacent integrated circuits are thereby inhibited from colliding during shipment or storage for subsequent processing.

A tray module capable of discharging static electricity to safely transfer display device members (e.g., components) includes: a tray configured to accommodate at least two members of a display device, at least two conductive protection films alternatingly stacked with the members of the display device, and a conductive pattern on the tray to provide a discharge path with the conductive protection films to ground.

A method of forming dice includes the following steps. First, a wafer structure is provides, which includes a substrate and a stack of semiconductor layers disposed in die regions and a scribe line region. Then, the substrate and the stack of the semiconductor layers in the scribe line region are removed to form a groove in the substrate. After the formation of the groove, the substrate is further thinned to obtain the substrate with a reduced thickness. Finally, a separation process is performed on the substrate with the reduced thickness.

A shutter disc for use in a cluster tool assembly having a processing chamber and a transfer arm includes an inner disc and an outer disc configured to be disposed on the inner disc. The inner disc includes a plurality of locating features configured to mate with locating pins of a transfer arm of a cluster tool assembly and a plurality of centering features configured to mate with alignment elements of a substrate support disposed in the processing chamber of the cluster tool assembly.

Exemplary semiconductor substrate carrier frames may include a frame body defining a central aperture. The frames may include a plurality of fingers that are coupled with the frame body. Each of the plurality of fingers may extend into the central aperture. Each of the plurality of fingers may include a substrate receiving interface. At least one of the plurality of fingers may include an actuator that manipulates a respective one of the at least one of the plurality of fingers between a substrate holding position and an open position.