A controller that processes a substrate by executing a process recipe for supplying at least a source gas to a process chamber to form a film on the substrate, and a pressure controller that controls the degree of opening of a pressure control valve on the basis of a pressure value detected by a pressure sensor that detects a pressure in a furnace during execution of the recipe and maintains the process chamber to a predetermined pressure. The pressure controller includes a memory that accumulates data acquired from the pressure sensor and pressure control valve, and measures a valve full close time to full close of the pressure control valve during execution of the process recipe and holds the valve full close time in the memory, and the controller acquires the stored valve full close time and confirms whether the acquired valve full close time falls within a threshold range.

Provided is a wafer container including a frame having a first sidewall and a second sidewall extending along a YZ plane; a plurality of first support structures disposed on the first sidewall and arranged along a Z direction; and a plurality of second support structures disposed on the second sidewall and arranged along the Z direction. One of the plurality of first support structures is horizontally aligned with a corresponding second support structure to constitute a wafer holder. The wafer holder includes a plurality of island structures to hold a wafer in a XY plane, and the plurality of island structures are separated to each other along a X direction. A method for holding at least one wafer is also provided.

There is provided a substrate storage container 1 capable of suppressing deformation of a functional member insert-molded and a method of manufacturing the container 1, and an device positioning member 4 as the functional member including: an attachment part 41 having a thick section 413 formed in thickness equal to a wall member of a container body 10 or a lid 20 and a thin section 410 decreasing in thickness as it approaches toward an outer edge from the thick section 413; and a body part 42 coupled to the attachment part 41, the device positioning member 4 being disposed on the container body 10 or the lid 20 so that a first surface 420 of the thick section 413 is flush with an inner surface of the wall member.

Provided is a wafer container including a frame and at least a pair of the stents. The frame has opposite sidewalls. The at least a pair of the stents is respectively disposed on the sidewalls of the frame, wherein the at least a pair of the stents is configured to provide at least three supporting points to support at least one wafer. A method for holding at least one wafer is also provided.

A wafer container with a latch mechanism that provides sealing for large wafer containers, such as for 450 mm wafers, accomplishes secure door closing and latching with reduced torque requirements for rotating the central rotatable cam plate. In various embodiments, a camming slot formed in the rotatable cammed plate is arcuate and defined by opposing cam surfaces which are selectively engaged by a cam follower, such as a roller, attached to a proximal end of a latch arm. The roller can include unitary axle portions that snap into the proximal end of the latch arm and is supported at both axial ends of the roller. The proximal end of the latch arm can include parallel extensions separated by a gap, and have guide in surfaces to deflect the extensions as the axle portions of the roller are forced into position thereby seating the roller at both axial ends.

Embodiments of three-dimensional (3D) memory devices and methods for forming the 3D memory devices are disclosed. In an example, a method for forming a 3D memory device is disclosed. A memory stack including interleaved sacrificial layers and dielectric layers is formed above a first substrate. A channel structure extending vertically through the memory stack is formed. A single-crystal silicon layer is formed in a second substrate. An interconnect layer including a bit line is formed on the single-crystal silicon layer above the second substrate. The single-crystal silicon layer and the interconnect layer formed thereon are transferred from the second substrate onto the memory stack above the first substrate, such that the bit line in the interconnect layer is electrically connected to the channel structure.

A supporting device includes a supporting member including a first positioning member positioning a bottom of a first article and inhibiting horizontal movement of the first article, and a second positioning member positioning a bottom of a second article and inhibiting horizontal movement of the second article. The first and second positioning members release the articles when elevated. The supporting device includes a first anti-drop member preventing the first article from being elevated and released and a second anti-drop member preventing the second article from being elevated and released. The first positioning member is higher than the second positioning member. The end of the first article closer to the first and second anti-drop members is nearer or equally distant to the first and second anti-drop members than a corresponding end of the second article. The second anti-drop member is retracted from the end of the first article when the first positioning member positions the first article.

A cover for a module tray includes a cover structure to cover a case of a semiconductor device, and a card accommodation portion on an upper surface of the cover structure to accommodate a card. The card accommodation portion includes a first bracket having a first accommodation guide extending in the first horizontal direction, a second bracket spaced apart from the first bracket and having second and third accommodation guides, the second accommodation guide extending in the first horizontal direction to face the first accommodation guide, and the third accommodation guide extending in the second horizontal direction, and a third bracket spaced apart from the first and second brackets, and having fourth and fifth accommodation guides, the fourth accommodation guide extending in the first horizontal direction to face the first accommodation guide, and the fifth accommodation guide extending in the second horizontal direction to face the third accommodation guide.

A controller that processes a substrate by executing a process recipe for supplying at least a source gas to a process chamber to form a film on the substrate, and a pressure controller that controls the degree of opening of a pressure control valve on the basis of a pressure value detected by a pressure sensor that detects a pressure in a furnace during execution of the recipe and maintains the process chamber to a predetermined pressure. The pressure controller includes a memory that accumulates data acquired from the pressure sensor and pressure control valve, and measures a valve full close time to full close of the pressure control valve during execution of the process recipe and holds the valve full close time in the memory, and the controller acquires the stored valve full close time and confirms whether the acquired valve full close time falls within a threshold range.

A wafer carrier including a case having an opening at one end, slots disposed in the case and receiving wafers, and a wireless communication circuitry disposed on an inner sidewall of the case and configured to detect humidity of a gas contained in the case may be provided. The wireless communication circuitry may be further configured to compare the detected humidity with a threshold humidity predetermined, and transmit a first warning signal to an external host via wireless communication when the detected humidity is greater than the threshold humidity.