A processing apparatus for an electronic component includes a component holder configured to hold the electronic component, a turning unit configured to hold the component holder toward an outside of a predetermined circular track, a turning drive unit configured to turn the turning unit around a first axis along a central axis of the circular track, and a rotation drive unit provided on the turning unit and configured to rotate the component holder around a second axis along a radial direction of the circular track.

A substrate analysis apparatus is provided. The substrate analysis includes: an interlayer conveying module configured to transport a first FOUP; an exchange module which is connected to the interlayer conveying module, and configured to transfer a wafer from the first FOUP to a second FOUP; a pre-processing module configured to form a test wafer piece using the wafer inside the second FOUP; an analysis module configured to analyze the test wafer piece; and a transfer rail configured to transport the second FOUP containing the wafer and a tray containing the test wafer piece. The wafer includes a first identifier indicating information corresponding to the wafer, the test wafer piece includes a second identifier indicating information generated by the pre-processing module which corresponds to the test wafer piece, and the analysis module is configured to analyze the first identifier and the second identifier in connection with each other.

A robotic manipulator for handling a cassette and an automated cassette transport device are disclosed, the device including a mechanical arm (1), an end actuator (2) at an end of the mechanical arm (1) and a vision-based locating assembly (3) on the end actuator (2). On the one hand, the vision-based locating assembly (3) can determine the position of a flange of the cassette, thereby identifying the cassette. In other words, the cassette can be identified based on a feature of the cassette itself. This dispense with a separate locating marker while improving cassette measuring and handling accuracy. On the other hand, transportation of the cassette is allowed by complementary retention of its flange on a recessed surface of the end actuator (2).

Provided is a wafer container including a frame and at least a pair of the stents. The frame has opposite sidewalls. The at least a pair of the stents is respectively disposed on the sidewalls of the frame, wherein the at least a pair of the stents is configured to provide at least three supporting points to support at least one wafer. A method for holding at least one wafer is also provided.

A wafer container with a latch mechanism that provides sealing for large wafer containers, such as for 450 mm wafers, accomplishes secure door closing and latching with reduced torque requirements for rotating the central rotatable cam plate. In various embodiments, a camming slot formed in the rotatable cammed plate is arcuate and defined by opposing cam surfaces which are selectively engaged by a cam follower, such as a roller, attached to a proximal end of a latch arm. The roller can include unitary axle portions that snap into the proximal end of the latch arm and is supported at both axial ends of the roller. The proximal end of the latch arm can include parallel extensions separated by a gap, and have guide in surfaces to deflect the extensions as the axle portions of the roller are forced into position thereby seating the roller at both axial ends.

A wafer container with a latch mechanism that provides sealing for large wafer containers, such as for 450 mm wafers, accomplishes secure door closing and latching with reduced torque requirements for rotating the central rotatable cam plate. In various embodiments, a camming slot formed in the rotatable cammed plate is arcuate and defined by opposing cam surfaces which are selectively engaged by a cam follower, such as a roller, attached to a proximal end of a latch arm. The roller can include unitary axle portions that snap into the proximal end of the latch arm and is supported at both axial ends of the roller. The proximal end of the latch arm can include parallel extensions separated by a gap, and have guide in surfaces to deflect the extensions as the axle portions of the roller are forced into position thereby seating the roller at both axial ends.

An autoteach system includes an autoteach pin that is a scannable feature having a fixed position within the autoteach system. The autoteach pin enables an autoteach operation of a robot arm of the wafer processing system. The autoteach operation is an operation to automatically teach the fixed position within the autoteach system to the robot arm of the wafer processing system. The autoteach pin includes a first portion including a cylindrical sidewall. The robot arm is to use the first portion to locate the fixed position within the autoteach system. The autoteach portion further includes a second portion including planar sidewalls that are configured to enable calibration of robot arm error.

A wafer carrier including a case having an opening at one end, slots disposed in the case and receiving wafers, and a wireless communication circuitry disposed on an inner sidewall of the case and configured to detect humidity of a gas contained in the case may be provided. The wireless communication circuitry may be further configured to compare the detected humidity with a threshold humidity predetermined, and transmit a first warning signal to an external host via wireless communication when the detected humidity is greater than the threshold humidity.

A vertical furnace processing system for processing semiconductor substrates, comprising the following modules: a processing module including a vertical furnace; an I/O-station module including at least one load port to which a substrate cassette is dockable; a wafer handling module configured to transfer semiconductor substrates between the processing module and a substrate cassette docked to the load port of the I/O-station module; and a gas supply module including at least one gas supply or gas supply connection for providing the vertical furnace of the processing module with process gas, wherein at least two of the said modules are mutually decouplably coupled, such that said at least two modules are decouplable from one another to facilitate servicing of the system, and in particular the vertical furnace thereof.

A supporting device includes a supporting member including a first positioning member positioning a bottom of a first article and inhibiting horizontal movement of the first article, and a second positioning member positioning a bottom of a second article and inhibiting horizontal movement of the second article. The first and second positioning members release the articles when elevated. The supporting device includes a first anti-drop member preventing the first article from being elevated and released and a second anti-drop member preventing the second article from being elevated and released. The first positioning member is higher than the second positioning member. The end of the first article closer to the first and second anti-drop members is nearer or equally distant to the first and second anti-drop members than a corresponding end of the second article. The second anti-drop member is retracted from the end of the first article when the first positioning member positions the first article.