An electronic device manufacturing system is disclosed. The system includes a processing tool having one or more processing chambers each adapted to perform an electronic device manufacturing process on one or more substrates; a substrate carrier adapted to couple to the system and carry one or more substrates; and a component adapted to create a sealed environment relative to at least a portion of the substrate carrier and to substantially equalize the sealed environment with an environment within the substrate carrier. Methods of the invention are described as are numerous other aspects.

The invention described relates generally to manufacturing management software and more specifically to substrate manufacturing management software. In one example embodiment, to methods, apparatus, and systems which provides for a software or management of substrates, substrate carriers, stockers and associated and other relates devices systems and methods such that improved efficiency can be realized in production, manufacturing and processing.

A semiconductor manufacturing apparatus includes an equipment front end module (EFEM) including a chamber having an inner space that accommodates a wafer container storing a plurality of wafers, the EFEM adjusting the inner space to first vacuum pressure or atmospheric pressure; and manufacturing process equipment configured to transfer a wafer in the wafer container to a process chamber that performs a manufacturing process of a wafer, and transfer a wafer, after the manufacturing process has been completed, in the process chamber to the wafer container.

A control device controls the semiconductor manufacturing apparatus having modules based on an operation from a user on an operation terminal displaying an operation screen of the semiconductor manufacturing apparatus. The semiconductor manufacturing apparatus includes: ports to which the operation terminal is to be connected; and detectors detecting the operation terminal connected to the ports, the ports serving as the detectors or the detectors being provided around the ports. The control device stores restriction information, the restriction information indicating controllable modules corresponding to the detectors in units of the detector; and when the operation terminal is connected to one of the ports and the operation terminal is detected via the corresponding detector, transmits screen information about the operation screen to the connected operation terminal based on the restriction information, the screen information including information indicating the controllable modules corresponding to the detector used for the detection.

An electronic device manufacturing system is disclosed. The system includes a processing tool having one or more processing chambers each adapted to perform an electronic device manufacturing process on one or more substrates; a substrate carrier adapted to couple to the system and carry one or more substrates; and a component adapted to create a sealed environment relative to at least a portion of the substrate carrier and to substantially equalize the sealed environment with an environment within the substrate carrier. Methods of the invention are described as are numerous other aspects.

A fabrication method of a semiconductor package includes the steps of: providing a carrier having a concave portion and a releasing layer formed on a surface thereof; disposing a chip on the releasing layer in the concave portion; forming an encapsulant on the chip and the releasing layer; removing the releasing layer and the carrier; and forming a circuit structure on the encapsulant and the chip. The design of the concave portion facilitates alignment of the chip to prevent it from displacement, thereby improving the product reliability. A semiconductor package fabricated by the fabrication method is also provided.

A substrate transport apparatus is provided. The apparatus has a casing and a door. The casing is adapted to form a controlled environment therein. The casing has supports therein for holding at least one substrate in the casing. The casing defines a substrate transfer opening through which a substrate transport system accesses the substrate in the casing. The door is connected to the casing for closing the substrate transfer opening in the casing. The casing has structure forming a fast swap element allowing replacement of the substrate from the apparatus with another substrate without retraction of the substrate transport system and independent of substrate loading in the casing.

Provided is a technique including: a first container mover capable of moving a container; a second container mover disposed at a position different from the first container mover and capable of moving the container; a plurality of process modules capable of processing a substrate in the container; a substrate carrier disposed between the first container mover and the second container mover, configured to be communicable with the plurality of process modules, and capable of carrying the substrate; a substrate carry robot provided in the substrate carrier and capable of carrying the substrate to the process module; a third container mover disposed between the first container mover and the second container mover, and capable of moving the container from the first container mover to the second container mover; and a controller.

A carrier substrate includes a circuit structure layer, a first solder resist layer, a second solder resist layer and conductive towers. The circuit structure layer includes a core structure layer, a first circuit layer and a second circuit layer. The first solder resist layer has first openings exposing a portion of the first circuit layer. The second solder resist layer has second openings exposing a portion of the second circuit layer. The conductive towers are disposed at the first openings, higher than a surface of the first solder resist layer and connected with the first openings exposed by the first circuit layer, wherein a diameter of each of the conductive towers gradually increases by a direction from away-from the first openings towards close-to the first openings. A diameter of the second conductive towers is greater than that of the first conductive towers.

A carrier substrate includes an insulation layer, conductive towers and a circuit structure layer. A diameter of each of the conductive towers is increased gradually from a top surface to a bottom surface, and the conductive towers include first conductive towers and second conductive towers surrounding the first conductive towers. The circuit structure layer is disposed on the insulation layer and includes at least one dielectric layer, at least two circuit layers and first conductive vias. Each of the second conductive towers correspondingly connects to at least two of the first conductive vias, and each of the first conductive towers correspondingly connects to one of the first conductive vias. An interface exists between the first conductive vias and the first and the second conductive towers.