A method comprises transferring a wafer carrier to or from an overhead hoist transfer (OHT) system using a conveyor. The method also comprises transferring the wafer carrier between the conveyor and an overhead shuttle (OHS) system using a cross-system transport apparatus. The method further comprises generating control signals using a controller to control at least one of the cross-system transport apparatus, the conveyor, or the loading or unloading of the wafer carrier at the OHT or the OHS. The cross-system transport apparatus comprises a lifting device configured to raise or lower the wafer carrier. The transferring of the wafer carrier between the conveyor and the OHS system comprises one or more of lifting or lowering the wafer carrier.

Provided are a container transporting apparatus for storing items such as FOUPs and reticle pods by utilizing the dead zone space located in an upper portion of the semiconductor manufacturing facility built in the FAB, and a container storage system having the same. The container storage system may include a first storage unit installed on a side of a movement path of a transporting device for transporting a container accommodating a substrate and for storing the container; a second storage unit installed on a side of the first storage unit and for storing the container; and a transporting unit moving between the first storage unit and the second storage unit and for transporting the container stored in the first storage unit to the second storage unit.

A front semiconductor opening wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.

A processing equipment including a supply unit, a receiving unit, and a motion unit is provided. The supply unit has multiple supply sequences. Each of the supply sequences is provided with at least a first supply subset and a second supply subset. At least part of a first receiving subset is distributed in one receiving sequence. The motion unit is used to control a relative movement between the supply unit and the receiving unit, so that the first receiving subset and the second receiving subset are sequentially aligned with the first supply subset and the second supply subset of a supply sequence, and respectively define a first distribution pattern and a second distribution pattern on a supply surface of the supply unit. At least part of the first distribution pattern and at least part of the second distribution pattern are overlapped with each other in a direction.

An information processing apparatus of a substrate processing apparatus including a transport device includes an image data acquisition unit that acquires image data of a disposing position of a processing target substrate, a first image processing unit that digitizes a positional relationship among the transport source object, the transport device, and the substrate, a second image processing unit that digitizes a positional relationship among the transport destination object, the transport device, and the substrate, a first transfer teaching unit that outputs first correction data of the moving operation of the transport device of receiving the substrate from the transport source object, and a second transfer teaching unit that outputs second correction data of the moving operation of the transport device of disposing the substrate in the transport destination object.

A transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet includes a carrier in which a semiconductor wafer or a substrate is seated and accommodated and which is transferred, an armature which is provided to be accommodated in a permanent magnet plate under the carrier, a stator which is disposed to be spaced apart from the armature, is fixedly installed on a guide rail, a sensor unit which is installed at each of two ends of each motor coil, detects whether the armature approaches, senses a variation of the magnetic field, and measures a position of the armature from speed information of the armature, and a carrier monitoring unit which is provided on the carrier and monitors the carrier to detect an abrasion degree, a damage state, or an alignment/misalignment of the carrier in real time.

A method of processing a wafer includes preparing a ring-shaped frame having an opening for accommodating a wafer therein, preparing a wafer having a protrusive ring-shaped stiffener on a reverse side thereof in an outer circumferential excess region thereof, producing a frame unit by affixing a tape to the frame and the reverse side of the wafer, capturing an image of the ring-shaped stiffener and setting a center of an inner circumferential circle of the ring-shaped stiffener on the basis of the captured image, rotating the frame unit around the center of the inner circumferential circle of the ring-shaped stiffener to cut the wafer along the inner circumferential circle of the ring-shaped stiffener, and removing the ring-shaped stiffener severed from the frame unit.