A laser irradiation apparatus (1) according to an embodiment includes a laser generation device (14) configured to generate laser light, and a levitation unit (10) configured to levitate an object to be processed (16) to which the laser light is applied. The levitation unit (10) includes a first area and a second area, and the first and second areas are arranged so that, in a plane view, a focal point of the laser light overlaps the first area and the focal point of the laser light does not overlap the second area. A surface part of the second area is formed of a metal member.

A noncontact support platform includes pressure ports distributed on a surface of a table, each connected to a pressure source. Vacuum ports are distributed on the surface of the table, each connected to a vacuum source. Outward flow through the pressure ports and inward flow through the vacuum ports form a fluid cushion to support a workpiece at a nonzero distance from the table. A plurality of channels each connect at least two of the vacuum ports to enable flow of fluid between the connected vacuum ports. When one of the connected vacuum ports is covered by an edge of the workpiece and the other is not, a suction force that is exerted by the connected vacuum ports on the edge is weaker than the suction force that is exerted on a part of the workpiece where both of the connected vacuum ports are covered.

Method of depositing an atomic layer on a substrate. The method comprises supplying a precursor gas from a precursor-gas supply of a deposition head that may be part of a rotatable drum. The precursor gas is provided from the precursor-gas supply towards the substrate. The method further comprises moving the precursor-gas supply by rotating the deposition head along the substrate which in its turn is moved along the rotating drum.

There is provided a conveyance system that conveys a workpiece to each of plural processing apparatuses. The conveyance system includes a conveyance passage, an automated workpiece conveying vehicle that travels on the conveyance passage, a stock unit, and a control unit. The conveyance passage is set in a space directly above the processing apparatus across the plural processing apparatus. The stock unit includes a placement base on which a workpiece stocker capable of housing plural workpieces is placed, two temporary putting bases on which the workpiece carried out from the workpiece stocker on the placement base is temporarily put, a temporary putting base movement part that moves the two temporary putting bases in such a manner as to interchange the two temporary putting bases between a first position that faces the placement base and a second position adjacent to the first position.

A laser annealing apparatus (1) according to an embodiment includes a laser oscillator (4) configured to generate a laser beam (L), a floating-type conveying stage (3) configured to float and convey a workpiece (W) to be irradiated with the laser beam (L), and a beam profiler (7) configured to measure a beam profile of the laser beam (L). The floating-type conveying stage (3) includes a conveying surface (3a) opposed to the workpiece (W), and a bottom surface (3b) on the side opposite to the conveying surface (3a). The beam profiler (7) is positioned below the bottom surface (3b) of the floating-type conveying stage (3). The floating-type conveying stage (3) includes a detachable part (12) in a part of it. An opening (S) is formed by detaching the detachable part (12) from the floating-type conveying stage (3), the opening (3) extending from the conveying surface (3a) to the bottom surface (3b). The beam profiler (7) is configured to measure the beam profile of the laser beam (L) through the opening (S).

An atomic layer deposition apparatus, having a first series of high pressure gas injection openings and a first series of exhaust openings that are positioned such that they together create a first high pressure/suction zone within each purge gas zone, wherein each first high pressure/suction zone extends over substantially the entire width of the process tunnel and wherein the distribution of the gas injection openings that are connected to the second purge gas source and the distribution of the gas exhaust openings within the first high pressure/suction zone, as well as the pressure of the second purge gas source and the pressure at the gas exhaust openings are such that the average pressure within the first high pressure/suction zone deviates less than 30% from a reference pressure which is defined by the average pressure within process tunnel when no substrate is present.

Swirl flow-forming body includes main body, first end face that is formed at main body and faces a member to which suction is applied, hole that opens on first end face, jetting port that is formed on inner periphery of main body, inner periphery facing hole, and fluid passage that allows fluid to be discharged into hole via jetting port so as to form a swirl flow that generates negative pressure for applying suction to the member. Inner periphery is formed so as to guide fluid discharged via jetting port, in a direction away from the member, to be discharged from hole.

An air conditioner comprising a blower unit to blow air at a predetermined amount, a cooling unit arranged downstream of the blower unit in an air flowing direction, a compressor which is operated at a variable operating frequency so that a revolving speed thereof is adjustable, a condenser, and a cooling coil connected in this order by pipes to circulate a heating medium to cool blown air. A heating unit is arranged on a downstream side of said cooling unit in the air flowing direction in which the blown air is heated by a heater. A control unit controls the operating frequency of the compressor and includes a compressor control part which adjusts the revolving speed of the compressor in such a way that the operating frequency of the compressor is decreased by a predetermined frequency when an output of the heating unit exceeds a first threshold value.

System for transporting objects under controlled atmosphere comprising tubular sections connected together in a leak tight manner by their first ends, each tubular section, each section comprising a guide track for a trolley, each guide track comprising a first and a second end, the first ends of the guide tracks being opposite and separated from each other by a given distance. The transport system also comprises a spanning element rotationally hinged on a first end of the guide tracks around an axis orthogonal to a direction of displacement of said guide track. The spanning element is moveable between a raised position and a spanning position in which the guide tracks are connected enabling the passage of the trolley.

A semiconductor package sawing device is provided that includes a semiconductor package sawing unit, an automatic tool providing portion disposed adjacent to the semiconductor package sawing unit, and a semiconductor package alignment portion. The automatic tool providing portion includes a transfer unit for transferring a chuck unit to the semiconductor package sawing unit.