A method of removing at least a portion of a layer of material from over a semiconductor substrate that can include dispensing an etching solution over the semiconductor substrate to form a pool of etching solution on the layer of material, wherein a footprint of the pool of etching solution is less than a footprint of the semiconductor substrate. The pool of etching solution and the semiconductor substrate can be moved with respect to each other. A pool boundary of the pool of etching solution can be defined on the semiconductor substrate with at least one air-knife such that the pool of etching solution etches the layer of material over the semiconductor substrate within the footprint of the pool of etching solution. The etching solution and at least a portion of the layer of material etched by the etching solution can be removed with the at least one air-knife.

The present invention relates to provide a hot air supplying head for transferring a micro LED and a micro LED transfer system using the same, the hot air supplying head effectively transferring micro LEDs.

The destacker apparatus (1), comprises: a succession of conveyors (10, 11, 12) arranged inclined relative to the horizon, each comprising a mobile surface (S) for receiving and supporting articles (J, K) carried upwards by the conveyors (10, 11, 12); and a device for varying the pressure of a fluid (2).

The surface (S) of the conveyors (10, 11, 12) has through holes and the pressure varying device (2) is fluid dynamically connected to this surface (S).

A coating can be provided on a substrate. Fabrication of the coating can include forming a solid layer in a specified region of the substrate while supporting the substrate in a coating system using a gas cushion. For example, a liquid coating can be printed over the specified region while the substrate is supported by the gas cushion. The substrate can be held for a specified duration after the printing the patterned liquid. The substrate can be conveyed to a treatment zone while supported using the gas cushion. The liquid coating can be treated to provide the solid layer including continuing to support the substrate using the gas cushion.

A substrate inspection system includes a floating unit that floats a substrate, an inspection unit disposed above the floating unit, a grip unit disposed below the inspection unit and including a first grip member that holds the substrate on the floating unit, a grip transfer unit that moves the grip unit in a first direction, and an illumination unit that generates light. The inspection unit inspects the substrate that floats on the floating unit, the illumination unit is disposed on a moving path of the grip unit, and the light generated by the illumination unit is irradiated onto the inspection unit. The first grip member includes a first adsorption pad that adsorbs the substrate, and a first support member that supports the first adsorption pad and that includes a first opening into which the illumination unit is inserted.

A method for providing a substrate coating comprises transferring a substrate to an enclosed ink jet printing system; printing organic material in a deposition region of the substrate using the enclosed ink jet printing system, the deposition region comprising at least a portion of an active region of a light-emitting device on the substrate; loading the substrate with the organic material deposited thereon to an enclosed curing module; supporting the substrate in the enclosed curing module, the supporting the substrate comprising floating the substrate on a gas cushion established by a floatation support apparatus; and while supporting the substrate in the enclosed curing module, curing the organic material deposited on the substrate to form an organic film layer.

A device for conveying and holding a sheet of glass, includes a conveyor and a holder configured to hold a sheet of glass in position, in particular in a horizontal position, wherein the conveyor comprises at least two spaced-apart and parallel lateral conveying systems extending longitudinally in the conveying direction and intended to be positioned in such a way as to support the lateral sides of the sheet of glass, and the holder comprises at least one holding system placed above the lateral conveying systems and above the sheet of glass and intended to limit the amplitude of the movements of the sheet of glass.

Apparatus and method for transferring a substrate are disclosed. The substrate transfer apparatus includes: a substrate conveyance assembly disposed between a mechanical arm and a wafer stage, the substrate conveyance assembly including a substrate loading conveyor and a substrate unloading conveyor parallelly arranged in a first direction, each of the substrate loading conveyor and the substrate unloading conveyor configured for transferring a substrate between the wafer stage and the mechanical arm along a second direction perpendicular to the first direction; an integral frame; and a transition air suspension assembly fixed to the integral frame at the end thereof proximal to the wafer stage, the transition air suspension assembly being able to engage with either of the substrate loading conveyor and the substrate unloading conveyor for producing an air film to levitate the substrate during the conveyance of the substrate by the substrate loading conveyor or the substrate unloading conveyor.

A laser irradiation apparatus includes a laser generation device, a levitation unit to levitate an object to which the laser light is applied, and a conveyance unit to convey the levitated object. The conveyance unit includes a holding mechanism for holding the object by absorption, and a moving mechanism for moving the holding mechanism in a conveyance direction. The holding mechanism includes a base including a plurality of through holes, a plurality of pipes respectively connected to the through holes, a vacuum generation device configured to evacuate air from the f pipes, and a plurality of absorption assistance valves each disposed in the middle of a respective one of the pipes, each of the plurality of absorption assistance valves being configured to be closed when a flow rate of a gas flowing into the pipe through the through hole becomes equal to or higher than a threshold.

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.