A quick release purge valve and a substrate container using the same are provided. The substrate container has a base including a bottom plate, a cover plate, and a quick release purge valve. The quick release purge valve includes a snap plate, a gasket fitting, and a valve element. The snap plate detachably engages with the bottom plate and is at most evenly aligned with the bottom plate. The gasket fitting is disposed between the cover plate and the bottom plate and has an airflow conduit communicating the two plates. The valve element is disposed in the conduit for limiting a flow direction of the gas. The gasket fitting is fixed in the base when the snap plate and the bottom plate are in an engaged state and is removable from the base when the snap plate and the bottom plate are in a disengaged state.

Wafers are aligned with one another by reference to features formed on or in each wafer. A method includes forming a first pivot-notch, a first stop-notch, and a first bias-notch in a first wafer by reference to first features formed on or in the first wafer. Also formed is a second pivot-notch, a second stop-notch, and a second bias-notch in a second wafer by reference to second features formed on or in the second wafer. A first wafer is mounted in an aligning device, wherein a two-contact element enters into the first pivot-notch, and a single-contact element enters the first stop-notch. The second wafer is mounted in the aligning device, wherein the two-contact element enters into the second pivot-notch, and the single-contact element enters the second stop-notch. A biasing force is exerted onto surfaces of the first and second bias-notches to align the first features with the second features.

Wafers are aligned with one another by reference to features formed on or in each wafer. A method includes forming a first pivot-notch, a first stop-notch, and a first bias-notch in a first wafer by reference to first features formed on or in the first wafer. Also formed is a second pivot-notch, a second stop-notch, and a second bias-notch in a second wafer by reference to second features formed on or in the second wafer. A first wafer is mounted in an aligning device, wherein a two-contact element enters into the first pivot-notch, and a single-contact element enters the first stop-notch. The second wafer is mounted in the aligning device, wherein the two-contact element enters into the second pivot-notch, and the single-contact element enters the second stop-notch. A biasing force is exerted onto surfaces of the first and second bias-notches to align the first features with the second features.

Provided is a carriage system control method and carriage system control apparatus capable of preventing a transportation delay, the carriage system control method including (a) performing upper-level communication to receive bidirectional information by using wireless communication in a normal state from a track controller or a carriage moving along rails of a track and supplied with power through the track or power supply cables, (b) determining whether an abnormal state in which the upper-level communication is disabled has occurred, (c) determining whether current is being applied to the track or the power supply cables, when it is determined that the abnormal state has occurred, and (d) maintaining operation of the carriage or the track controller without closing a corresponding lane to prevent a transportation delay, when it is determined that current is being applied to the track or the power supply cables.

A quick release purge valve and a substrate container using the same are provided. The substrate container has a base including a bottom plate, a cover plate, and a quick release purge valve. The quick release purge valve includes a snap plate, a gasket fitting, and a valve element. The snap plate detachably engages with the bottom plate and is at most evenly aligned with the bottom plate. The gasket fitting is disposed between the cover plate and the bottom plate and has an airflow conduit communicating the two plates. The valve element is disposed in the conduit for limiting a flow direction of the gas. The gasket fitting is fixed in the base when the snap plate and the bottom plate are in an engaged state and is removable from the base when the snap plate and the bottom plate are in a disengaged state.

Wafers are aligned with one another by reference to features formed on or in each wafer. Notches are formed in each wafer, including a pivot-notch that allows for two-point contact, and a stop-notch that provides for single-point contact. A bias-notch is formed for pressing the wafers into engagement with the two-contact element when it is in the pivot-notch and with the single-contact element when it is in the stop-notch. The wafers may be bonded to one another to maintain the alignment of the referenced features.

A transport container, in which a stored object is taken in and out through an opening on a side surface, includes a positioner that projects upward from an outside of a placement surface of the stored object on a storage portion where the stored object is placed, and a regulator movable between an advanced position, in which the regulator is advanced to above the stored object placed on the placement surface to regulate upward movement of the stored object, and a retracted position, in which the regulator is retracted from above the stored object to allow upward movement of the stored object.

A storage apparatus includes a storage shelf that stores a container, a purge device that is provided to the storage shelf and is able to perform a purge process on the container, and a purge determiner that determines at least one of a necessity of the purge process and a condition of the purge process in accordance with at least one of a transport source of the container to the storage shelf and a transport destination of the container from the storage shelf.

Wafers are aligned with one another by reference to features formed on or in each wafer. Notches are formed in each wafer, including a pivot-notch that allows for two-point contact, and a stop-notch that provides for single-point contact. A bias-notch is formed for pressing the wafers into engagement with the two-contact element when it is in the pivot-notch and with the single-contact element when it is in the stop-notch. The wafers may be bonded to one another to maintain the alignment of the referenced features.

A device chip is shaped as an inverted frustum with a device formed on an upper surface thereof. An accommodating tray for accommodating a plurality of device chips each shaped as an inverted frustum with a device formed on an upper surface thereof, has a plurality of open recesses defined in an upper surface thereof, for accommodating device chips therein, each of the recesses having a bottom surface and a side surface which form an obtuse angle therebetween. A method of accommodating the device chips in the accommodating tray includes a supplying step of supplying the device chips onto the accommodating tray, and after the device chips supplying step is performed, an accommodating step of imparting vibrations to the accommodating tray to cause the device chips into the recesses thereby placing the device chips in the recesses.