A semiconductor manufacturing apparatus configured to bond a substrate to a semiconductor chip includes a support configured to mount a substrate on a main surface of the support; and a bonding head configured to transfer the semiconductor chip to stack the semiconductor chip on the substrate and including an attachment pad configured to attach the semiconductor chip, wherein the attachment pad includes a bottom surface configured to attach the semiconductor chip; a vacuum channel extending from the bottom surface; and a cavity, and wherein the bonding head is configured to adjust a shape of the bottom surface of the attachment pad by adjusting a pressure of air in the cavity.

A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.

A substrate processing apparatus includes a process chamber including a reaction space in which at least one substrate is mounted, a transfer chamber for transferring the at least one substrate to the process chamber, and a buffer chamber including a rotating device for rotating the at least one substrate by a predetermined angle, wherein the rotating device includes a rotating plate, a rotating shaft for rotating the rotating plate by the predetermined angle, a drive unit for driving the rotating shaft, a controller for controlling the drive unit, and a plurality of substrate support members, which are disposed on the rotating plate and on which the at least one substrate is mounted.

A method includes disposing a wafer carrier onto a load port; detecting, by a first sensor in the wafer carrier, an elevation of a slot in the wafer carrier; adjusting an elevation of a wafer transferring device according to the detected elevation of the slot; and moving, at the adjusted elevation of the wafer transferring device, a wafer to the slot by the wafer transferring device.

A rotational indexer is provided that may be rotated to move semiconductor wafers or other items between various stations arranged in a circular array; the items being moved may be supported by arms of the indexer during such movement. The rotational indexer may be further configured to also cause the items being moved to rotate about other rotational axes to cause rotation of the items relative to the arms supporting them.

Discussed is a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part; and a controller for controlling a movement of the magnetic field forming part and the substrate chuck, wherein the controller controls a depth at which the substrate is submerged in the fluid based on a degree of warping of the substrate.

Disclosed is a substrate treating apparatus that performs treatment on a substrate. The apparatus includes a batch-type processing unit configured to perform treatment on a plurality of substrates, a single-wafer-type processing unit configured to perform treatment on one substrate of the substrates, a posture turning unit configured to turn a posture of the substrates on which the treatment is performed by the batch-type processing unit to horizontal, a first transport unit configured to transport the substrates from the batch-type processing unit to the posture turning unit, a second transport unit configured to transport the substrates, turned to horizontal by the posture turning unit, to the single-wafer-type processing unit, and an immersion tank in which the substrates are immersed in deionized water before the posture is turned by the posture turning unit.

A deform lead-retract removal track is provided which is configured to convey non-defective integrated circuit packages and remove integrated circuit packages having a lead-retract defect. The distance between the outside walls of the track is less than the distance between leads of the non-defective integrated circuit packages and greater than the distance between the leads of the integrated circuit packages having a lead-retract defect. The defective integrated circuit packages having a lead-retract defect are unable to enter the track or will become stuck on the track.

A micro device transferring method and a micro device transferring apparatus are provided. The micro device transferring method exemplarily includes: providing a carrier substrate including a transparent base, a light radiation activated adhesiveness-loss layer located on a first surface of the transparent base and multiple micro devices arranged in an array on the light radiation activated adhesiveness-loss layer; locally irradiating the light radiation activated adhesiveness-loss layer from a second surface of the transparent base to reduce adhesiveness of multiple target areas of the light radiation activated adhesiveness-loss layer to the micro devices respectively located in the multiple target areas, the multiple target areas being areas corresponding to the micro devices to be transferred; picking up the micro devices in the multiple target areas; and aligning the picked up micro devices with corresponding locations of a receiving substrate, and releasing them onto the receiving substrate.

A method includes disposing a wafer carrier onto a load port; detecting, by a first sensor in the wafer carrier, an elevation of a slot in the wafer carrier; adjusting an elevation of a wafer transferring device according to the detected elevation of the slot; and moving, at the adjusted elevation of the wafer transferring device, a wafer to the slot by the wafer transferring device.