A teaching jig includes: a first plate that determines a substrate loading position in a forward/backward direction with respect to a substrate holder which holds a substrate; a second plate that determines the substrate loading position in a leftward/rightward direction with respect to the substrate holder, the second plate being installed to be perpendicular to the first plate and movable in the forward/backward direction; and a positioning target pin installed in the first plate.

A micro device transferring method and a micro device transferring apparatus are provided. The micro device transferring method exemplarily includes: providing a carrier substrate including a transparent base, a light radiation activated adhesiveness-loss layer located on a first surface of the transparent base and multiple micro devices arranged in an array on the light radiation activated adhesiveness-loss layer; locally irradiating the light radiation activated adhesiveness-loss layer from a second surface of the transparent base to reduce adhesiveness of multiple target areas of the light radiation activated adhesiveness-loss layer to the micro devices respectively located in the multiple target areas, the multiple target areas being areas corresponding to the micro devices to be transferred; picking up the micro devices in the multiple target areas; and aligning the picked up micro devices with corresponding locations of a receiving substrate, and releasing them onto the receiving substrate.

Methods and systems for automatically aligning an overhead hoist transport (OHT) vehicle with a load port of a wafer fabrication tool during operation and at the installation phase of the equipment in a semiconductor fabrication facility are described herein. In one aspect, an alignment frame including a digital image capture device is mounted to a wafer-in-progress (WIP) carrying pod. An image captured by the image capture device is analyzed to determine a positioning error of the OHT vehicle relative to the alignment frame based on the location of the OHT vehicle within the image. In another aspect, an inertial measurement device is coupled to a gripper assembly of an OHT vehicle. Inertial measurement signals are collected when the gripper assembly docks with a WIP carrying pod. The inertial measurement signals are analyzed to determine an initial positioning error of the gripper assembly with respect to the WIP carrying pod.

A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.

In one embodiment, a chamber is provided that includes a chamber body and a lid defining an interior volume, a frame within the interior volume, the frame sized to receive a plurality of substrates in a first orientation, and a rotational drive assembly coupled to the frame for rotating the frame and flipping each of the plurality of substrates to a second orientation that is different than the first orientation.

A substrate processing apparatus includes a substrate loading device configured to load a substrate in a predetermined orientation relative to a grid, having a X-axis and an orthogonal Y-axis, associated with a layout of fields on the substrate; and corrective elements configured to enable local correction of a characteristic of a process performed on a substrate, wherein the corrective elements are arranged along at least one axis having a direction other than parallel to the X-axis or the Y-axis of the grid.

In a substrate arrangement apparatus, a holder elevating mechanism disposes each first substrate between each pair of second substrates, with the first and second substrates being alternately arranged front-to-front and back-to-back. Each substrate is curved in a first radial direction to one side in a thickness direction with a minimum curvature, and curved in a second radial direction orthogonal to the first radial direction to the one side in the thickness direction with a maximum curvature. The first radial direction of the first substrates, each arranged between each pair of the second substrates, is approximately orthogonal to the first radial direction of the second substrates. This improves uniformity in the up-down direction of the distance in the direction of arrangement between the first and second substrates that are alternately arranged adjacent to each other in the direction of arrangement.

A wafer picking and placing apparatus includes a platform and a hooking unit. The platform is adapted to support a wafer. The hooking unit includes a driving device and a hooking structure, and the hooking structure is connected to the driving device and has at least one hooking end. The driving device is adapted to drive the hooking structure to move between a first position and a second position in a horizontal direction. The driving device is adapted to drive the hooking structure to move between the second position and a third position above the second position in a vertical direction. When the hooking structure is located at the first position, the hooking end is away from the platform. When the hooking structure is located at the second position, the hooking end inserts between a lower side of an edge of the wafer and the platform to hook the wafer.

A substrate gripping hand includes: a base plate wherein a center line and gripping position are prescribed; at least one fixed claw capable of mating with a substrate edge in the gripping position and provided at a base plate distal end side; a movable claw having an acting portion acting on a substrate edge in gripping position and movable back-and-forth on center line; a pusher having an acting portion acting on an edge lower than the substrate center in a perpendicular orientation and movable back-and-forth parallel with the center line; and an actuator for moving the movable claw and pusher. The pusher acting portion is positioned more to the distal end side than the movable claw acting portion such that the substrate is grasped by the movable claw joint operation and the fixed claw after the substrate is brought to gripping position by the pusher moving forward toward the distal end side.

In a substrate inverting device, each lower guide has a downward inclined plane that comes in contact with a peripheral edge portion of a substrate held in a horizontal position to support the substrate from below. Each upper guide has an upward inclined plane that comes in contact with the peripheral edge portion of the substrate to catch and hold the substrate between the lower guides and the upper guides. Each lower guide includes first and second lower contact regions that are switched by a switching mechanism and selectively serve as the downward inclined plane. Each upper guide includes first and second upper contact regions that are switched by the switching mechanism and selectively serve as the upward inclined plane. This allows the regions of contact between the upper and lower guides and the substrate in accordance with the state of the substrate.