A substrate gripping hand includes: a base plate on which a center line and a gripping position are defined; at least one fixed claw provided on the base plate at a distal end side, the fixed claw being engageable with an edge of a substrate positioned at the gripping position; a movable claw that includes an acting portion operable to act on the edge of the substrate positioned at the gripping position, the movable claw moving in a reciprocating manner on the center line at a position that is shifted from the gripping position to a proximal end side; a pusher that includes an acting portion operable to act on a lower edge of the substrate in a vertical orientation, the lower edge being lower than a center of the substrate, the pusher moving parallel to the center line in a reciprocating manner at a position that is shifted from the gripping position to the proximal end side; and an actuator configured to cause the movable claw and the pusher to move integrally in a reciprocating manner. A position of the acting portion of the pusher is shifted to the distal end side relative to a position of the acting portion of the movable claw, such that after the pusher moving forward to the distal end side lifts the substrate to the gripping position, the movable claw moving forward and the fixed claw grip the substrate in cooperation with each other.

A rotational indexer is provided that may be rotated to move semiconductor wafers or other items between various stations arranged in a circular array; the items being moved may be supported by arms of the indexer during such movement. The rotational indexer may be further configured to also cause the items being moved to rotate about other rotational axes to cause rotation of the items relative to the arms supporting them.

In one embodiment, a chamber is provided that includes a chamber body and a lid defining an interior volume, a frame within the interior volume, the frame sized to receive a plurality of substrates in a first orientation, and a rotational drive assembly coupled to the frame for rotating the frame and flipping each of the plurality of substrates to a second orientation that is different than the first orientation.

A semiconductor manufacturing apparatus configured to bond a substrate to a semiconductor chip includes a support configured to mount a substrate on a main surface of the support; and a bonding head configured to transfer the semiconductor chip to stack the semiconductor chip on the substrate and including an attachment pad configured to attach the semiconductor chip, wherein the attachment pad includes a bottom surface configured to attach the semiconductor chip; a vacuum channel extending from the bottom surface; and a cavity, and wherein the bonding head is configured to adjust a shape of the bottom surface of the attachment pad by adjusting a pressure of air in the cavity.

A table device including: a first member; a second member; a first guide device guiding the second member; a table supported by the second member; a first movable member connected to the table; a second movable member connected to the table; a first bearing member movably supporting the first movable member; a second bearing member movably supporting the second movable member; an actuator; and a gravity compensation device that includes a first supply portion supplying a gas to a first space facing the first movable member, a first adjustment portion adjusting an amount of the gas from the first supply portion, a second supply portion supplying a gas to a second space facing the second movable member, and a second adjustment portion adjusting an amount of the gas from the second supply portion, and can adjust a pressure in each of the first and second spaces.

In a substrate arrangement apparatus, a holder elevating mechanism disposes each first substrate between each pair of second substrates, with the first and second substrates being alternately arranged front-to-front and back-to-back. Each substrate is curved in a first radial direction to one side in a thickness direction with a minimum curvature, and curved in a second radial direction orthogonal to the first radial direction to the one side in the thickness direction with a maximum curvature. The first radial direction of the first substrates, each arranged between each pair of the second substrates, is approximately orthogonal to the first radial direction of the second substrates. This improves uniformity in the up-down direction of the distance in the direction of arrangement between the first and second substrates that are alternately arranged adjacent to each other in the direction of arrangement.

Discussed is a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part; and a controller for controlling a movement of the magnetic field forming part and the substrate chuck, wherein the controller controls a depth at which the substrate is submerged in the fluid based on a degree of warping of the substrate.

A teaching jig includes: a first plate that determines a substrate loading position in a forward/backward direction with respect to a substrate holder which holds a substrate; a second plate that determines the substrate loading position in a leftward/rightward direction with respect to the substrate holder, the second plate being installed to be perpendicular to the first plate and movable in the forward/backward direction; and a positioning target pin installed in the first plate.

The present invention provides a positioning device configured to position a glass substrate. The positioning device comprises a support base, a pair of first positioning mechanisms located on two neighboring sides of the glass substrate, a pair of second positioning mechanisms located on another two neighboring sides of the glass substrate, respectively, a pair of connecting bars, a driving member, a gear group and a conveying belt sleeved on the gear group. One end of the one of the pair of connecting bar is fixed with the conveying belt, and another end is fixed with one of the pair of first positioning mechanisms. One end of another one of the pair of connecting bar is fixed with the conveying belt, and another end is fixed with another one of the pair of first positioning mechanisms.

The present invention provides a positioning device configured to position a glass substrate. The positioning device comprises a support base, a pair of first positioning mechanisms located on two neighboring sides of the glass substrate, a pair of second positioning mechanisms located on another two neighboring sides of the glass substrate, respectively, a pair of connecting bars, a driving member, a gear group and a conveying belt sleeved on the gear group. One end of the one of the pair of connecting bar is fixed with the conveying belt, and another end is fixed with one of the pair of first positioning mechanisms. One end of another one of the pair of connecting bar is fixed with the conveying belt, and another end is fixed with another one of the pair of first positioning mechanisms.