An apparatus includes a substrate holder, a first actuator to rotate the substrate holder, a second actuator to move the substrate holder linearly, a first sensor to generate one or more first measurements or images of the substrate, a second sensor to generate one or more second measurements of target positions on the substrate, and a processing device. The processing device estimates a position of the substrate on the substrate holder and causes the first actuator to rotate the substrate holder about a first axis. The rotation causes an offset between a field of view of the second sensor and a target position on the substrate due to the substrate not being centered on the substrate holder. The processing device causes the second actuator to move the substrate holder linearly along a second axis to correct the offset. The processing device determines a profile across a surface of the substrate based on the one or more second measurements of the target positions.

A system includes a reflector attached to a liner of a processing chamber. A light coupling device is to transmit light, from a light source, through a window of the processing chamber directed at the reflector. The light coupling device focuses, into a spectrometer, light received reflected back from the reflector along an optical path through the processing chamber and the window. The spectrometer detects, within the focused light, a first spectrum representative of a deposited film layer on the reflector using reflectometry. An alignment device aligns, in two dimensions, the light coupling device with the reflector until maximization of the focused light received by the light coupling device.

A method for transferring objects and a transfer apparatus using the same are provided. The method includes the following steps: controlling, during a first period, the ejector at an ejecting working position to perform an ejecting process along with a first direction, to transfer the object from the first substrate to the second substrate; controlling, during a second period, the ejector to move to an ejecting standby position along with a second direction which is non-parallel to the first direction, to expose at least one of the object on the first substrate to a detection range of an image capturing device; detecting the position of the object in the detection range to obtain calibration information; and adjusting the position of the first substrate according to the calibration information.

Proposed is a die ejecting apparatus that uses a light-transmitting material and can prevent damage caused by pressure, and die bonding equipment including the same. The die ejecting apparatus includes an ejector body having a cylindrical shape, ejector pins provided inside the ejector body and configured to rise or fall, a hood coupled to an upper portion of the ejector body and made of a light-transmitting material in which through holes through which the ejector pins may pass are formed, and a reinforcement member disposed in a form of a mesh mounted on the hood and overlapping the through holes.

A method for calibrating the alignment of a wafer is provided. A plurality of alignment position deviation (APD) simulation results are obtained form a plurality of mark profiles. An alignment analysis is performed on a mark region of the wafer with a light beam. A measured APD of the mark region of the wafer is obtained in response to the light beam. The measured APD is compared with the APD simulation results to obtain alignment calibration data. An exposure process is performed on the wafer with a mask according to the alignment calibration data.

This disclosure teaches methods for making high-temperature superconducting striated tape combinations and the product high-temperature superconducting striated tape combinations. This disclosure describes an efficient and scalable method for aligning and bonding two superimposed high-temperature superconducting (HTS) filamentary tapes to form a single integrated tape structure. This invention aligns a bottom and top HTS tape with a thin intervening insulator layer with microscopic precision, and electrically connects the two sets of tape filaments with each other. The insulating layer also reinforces adhesion of the top and bottom tapes, mitigating mechanical stress at the electrical connections. The ability of this method to precisely align separate tapes to form a single tape structure makes it compatible with a reel-to-reel production process.

The invention provides a method for positioning a wafer and a semiconductor manufacturing apparatus, which are applied to thin film processes. The method includes: Step S1: Obtain the state distribution of the first surface of the first wafer after the thin film process is performed on the first wafer, wherein the first surface is the surface opposite to a surface that the thin film formed thereon in the thin film process; Step S2: Determine whether the first wafer is located at the ideal positioning center according to the state distribution of the first surface, when the first wafer is not located at the ideal positioning center, according to the state distribution of the first surface adjusts the positioning position of the second wafer to be subjected to the thin film process, so that the second wafer is positioned at the ideal positioning center during the thin film process. According to the present invention, the wafer is positioned at the ideal positioning center during the thin film process, thereby improving the quality of the thin film layer and the entire wafer (epitaxial wafer) after the thin film process, and improving the effect of the thin film process.

A device and a method for aligning substrates. The method includes the steps of detecting alignment marks and aligning substrates with respect to one another in dependence on the detection of the alignment marks. At least two alignment marks are arranged parallel to a direction of a linear movement of the substrates, wherein the alignment of the substrates takes place along a single alignment axis, the alignment axis running parallel to the loading and unloading direction of the substrates.

A substrate transfer system includes a load lock module, an atmospheric transfer module having a first sidewall adjacent to the load lock module and a second sidewall remote from the load lock module, the atmospheric transfer module being connected to the load lock module, and a substrate transfer robot disposed in the atmospheric transfer module. The substrate transfer robot includes a base configured to reciprocate along the first sidewall, a substrate transfer arm disposed on the base, and a flow rectifier surrounding the base, the flow rectifier being configured, upon movement of the base, to create an obliquely downward air flow in a direction opposite to a moving direction of the base.

The present disclosure provides a wafer locking mechanism configured to lock a wafer, the wafer locking mechanism comprising: a wafer base, constructed in a form of a frustum shape tapering from a bottom portion thereof towards a top portion thereof, and configured to be elevatable along a direction of an axis thereof; a plurality of rods, which are diametrically aligned in pairs perpendicular to the axis; and a plurality of compression springs, which are respectively sheathed on respective distal ends of the plurality of rods distal to the wafer base, in one-to-one correspondence and extend radially outwards. The plurality of rods are respectively provided with both a plurality of ball-head portions which are located at respective proximal ends thereof proximate to the wafer base and abut against the wafer base, in one-to-one correspondence, and a plurality of jaws which protrude from the respective distal ends along a direction of the axis on a same side of the top portion and are pressed radially inwards by the plurality of compression springs, in one-to-one correspondence.