Embodiments disclosed herein include carriers and methods of using the carriers to assemble electronic packages. In an embodiment, a carrier for electronic packaging assembly comprises a mold layer with a first surface and a second surface. In an embodiment, a plurality of glass substrates are embedded in the mold layer. In an embodiment, individual ones of the glass substrates comprise a third surface and a fourth surface, where the third surface of the glass substrate is substantially coplanar with the first surface of the mold layer.

A copper-ceramic composite: includes a ceramic substrate containing alumina and a copper or copper alloy coating on the ceramic substrate. The alumina has a mean grain shape factor R.sub.a(Al.sub.2O.sub.3), defined as the arithmetic mean of the shape factors R of the alumina grains, of at least 0.4.

A copper-ceramic composite: includes a ceramic substrate containing alumina and a copper or copper alloy coating on the ceramic substrate. The alumina has a mean grain shape factor R.sub.a(Al.sub.2O.sub.3), defined as the arithmetic mean of the shape factors R of the alumina grains, of at least 0.4.

A package carrier, including a first redistribution structure layer, multiple conductive connecting members, a connection structure layer, at least one stiffener, and a molding compound, is provided. The conductive connecting members are disposed on a first surface of the first redistribution structure layer and are electrically connected to the first redistribution structure layer. The connection structure layer is disposed on a second surface of the first redistribution structure layer and includes a substrate and multiple pads. A top surface and a bottom surface of each pad are respectively exposed to an upper surface and a lower surface of the substrate. The pads are electrically connected to the first redistribution structure layer. The stiffener is disposed on the first surface and is located at least between the conductive connecting members. The molding compound is disposed on the first surface and covers the conductive connecting members and the stiffener.

A package carrier, including a first redistribution structure layer, multiple conductive connecting members, a connection structure layer, at least one stiffener, and a molding compound, is provided. The conductive connecting members are disposed on a first surface of the first redistribution structure layer and are electrically connected to the first redistribution structure layer. The connection structure layer is disposed on a second surface of the first redistribution structure layer and includes a substrate and multiple pads. A top surface and a bottom surface of each pad are respectively exposed to an upper surface and a lower surface of the substrate. The pads are electrically connected to the first redistribution structure layer. The stiffener is disposed on the first surface and is located at least between the conductive connecting members. The molding compound is disposed on the first surface and covers the conductive connecting members and the stiffener.

A low temperature co-fired ceramic (LTCC) electronic device includes a template layer, a base layer and a conductor. The template layer and the base layer are ceramic layers. The template layer has an electrode pattern formed by a hollow groove. A depth of the hollow groove is between 10 μm and 120 μm, and a width of the hollow groove is above 80 μm. The base layer is closely overlapped with the template layer. An overlapping area range of the base layer and the template layer at least covers the electrode pattern. The conductor is filled in the hollow groove of the electrode pattern. A filling thickness of the conductor is above 10 μm.

A superconducting device according to an example embodiment includes: a superconducting chip; an interposer on which the superconducting chip is mounted; a socket that is arranged to face the interposer and includes a movable pin and a housing supporting the movable pin; and a board that is arranged to face the socket and includes a connector serving as an input/output with respect to the outside. In the board, one end of a terminal of a via hole is electrically connected to one end of a terminal of the movable pin, and a hole diameter of the via hole is smaller than a diameter of a tip portion of the movable pin connected to the via hole.

A semiconductor device including an insulating circuit board. The insulating circuit board has an insulating plate, a plurality of circuit patterns disposed on a front surface of the insulating plate, any adjacent two of the circuit patterns having a gap therebetween, each circuit pattern having at least one corner, each corner being in a corner area that covers the corner and a portion of each gap adjacent to the corner, and a buffer material containing resin, applied at a plurality of corner areas, to fill the gaps in the plurality of corner areas.

A semiconductor device including an insulating circuit board. The insulating circuit board has an insulating plate, a plurality of circuit patterns disposed on a front surface of the insulating plate, any adjacent two of the circuit patterns having a gap therebetween, each circuit pattern having at least one corner, each corner being in a corner area that covers the corner and a portion of each gap adjacent to the corner, and a buffer material containing resin, applied at a plurality of corner areas, to fill the gaps in the plurality of corner areas.

In examples, a semiconductor package comprises a ceramic substrate and first and second metal layers covered by the ceramic substrate. The first metal layer is configured to carry signals at least in a 20 GHz to 28 GHz frequency range. The package comprises a semiconductor die positioned above the first and second metal layers and coupled to the first metal layer. The package comprises a ground shield positioned in a horizontal plane between the semiconductor die and the first metal layer, the ground shield including an orifice above a portion of the first metal layer. The package includes a metal seal ring coupled to a top surface of the ceramic substrate, the metal seal ring having a segment that is vertically aligned with a segment of the ground shield. The segment of the ground shield is between the orifice of the ground shield and a horizontal center of the ground shield. The package comprises a metal lid coupled to a top surface of the metal seal ring.