The invention provides a portable electronic system. The portable electronic system includes a semiconductor package. The semiconductor package includes a substrate. A semiconductor die is coupled to the substrate. A thermoelectric device chip is disposed close to the semiconductor die, coupled to the substrate. The thermoelectric device chip is configured to detect a heat energy generated from the semiconductor die and to convert the heat energy into a recycled electrical energy. A power system is coupled to the semiconductor package, configured to store the recycled electrical energy.

A packaged integrated circuit is provided. The packaged integrated circuit includes a die, a package including a base, a lid, and a plurality of package leads, and die attach adhesive for securing the die to the package base. the die includes a plurality of die pads. The die is secured to the base with the die attach adhesive. After the die is secured to the base, at least one of the plurality of die pads is electrically connected to at least one of the plurality of package leads with a printed bond connection. After printing the bond connection, the lid is sealed to the base.

A packaged integrated circuit is provided. The packaged integrated circuit includes a die, a package including a base, a lid, and a plurality of package leads, and die attach adhesive for securing the die to the package base. the die includes a plurality of die pads. The die is secured to the base with the die attach adhesive. After the die is secured to the base, at least one of the plurality of die pads is electrically connected to at least one of the plurality of package leads with a printed bond connection. After printing the bond connection, the lid is sealed to the base.

An optical element module which can adsorb a foreign matter and absorb moisture remaining in the module with use of a simple structure which does not require a complicated production process is provided. An optical element module (101) includes a sealed housing (11, 12) and an optical element 1 mounted in the sealed housing (11, 12), said optical element module (101) further including polyurethane (13) having self-adherence and a desired shape, the polyurethane (13) being fixed inside said optical element module (101) with use of the self-adherence of the polyurethane (13).

Disclosed are a packaging cover plate, an organic light-emitting diode display and a manufacturing method therefor. The packaging cover plate comprises: a cover plate body, the cover plate body being provided with open slots; cover plugs for covering openings at two ends of the open slots; and water absorption layers for at least covering mouths of the open slots. By means of the arranged open slots, the packaging cover plate can conveniently introduce a dry gas. In addition, the water absorption layers absorb water vapour, the introduced dry gas dries the water absorption layers, and the water vapour and oxygen in the water absorption layers can be taken away by means of the circular flow of the dry gas, so that damage to a device by water vapour and oxygen can be reduced, and the packaging effect is better.

Disclosed are a packaging cover plate, an organic light-emitting diode display and a manufacturing method therefor. The packaging cover plate comprises: a cover plate body, the cover plate body being provided with open slots; cover plugs for covering openings at two ends of the open slots; and water absorption layers for at least covering mouths of the open slots. By means of the arranged open slots, the packaging cover plate can conveniently introduce a dry gas. In addition, the water absorption layers absorb water vapour, the introduced dry gas dries the water absorption layers, and the water vapour and oxygen in the water absorption layers can be taken away by means of the circular flow of the dry gas, so that damage to a device by water vapour and oxygen can be reduced, and the packaging effect is better.

An apparatus includes a first component layer. The component layer includes a first semiconductor device. The apparatus further includes a first hydrophilic layer and a first hydrophobic layer. The first hydrophobic layer is positioned between the first component layer and the first hydrophilic layer. The apparatus further includes a first contact extending through the first hydrophobic layer and the first hydrophilic layer.

An integrated device package is disclosed. The integrated device package can include a packaging structure defining a cavity. An integrated device die can be disposed at least partially within the cavity. A gel can be disposed within the cavity surrounding the integrated device. A portion of the gel can be disposed between a lower surface of the integrated device die and an upper surface of the packaging structure within the cavity.

An integrated device package is disclosed. The integrated device package can include a packaging structure defining a cavity. An integrated device die can be disposed at least partially within the cavity. A gel can be disposed within the cavity surrounding the integrated device. A portion of the gel can be disposed between a lower surface of the integrated device die and an upper surface of the packaging structure within the cavity.

An electronic element mounting substrate includes a substrate including, on a first upper surface, a mounting region in which an electronic element is mounted, a frame body located on the first upper surface of the substrate and surrounding the mounting region, a channel extending through the frame body outward from an inner wall of the frame body, and an electrode pad located on the first upper surface of the substrate or an inner surface of the frame body. The channel is located above or below the electrode pad.