A power semiconductor module arrangement includes at least one substrate comprising a dielectric insulation layer and a first metallization layer attached to the dielectric insulation layer; at least one semiconductor body arranged on the first metallization layer; a housing at least partly enclosing the substrate, the housing comprising sidewalls; and at least one press-on pin, wherein each press-on pin is arranged either on the substrate or on one of the at least one semiconductor body and extends from the substrate or the respective semiconductor body in a vertical direction that is perpendicular to a top surface of the substrate, and each press-on pin is mechanically coupled to at least one sidewall of the housing by means of a bar, each bar extending horizontally between the respective press-on pin and sidewall, and parallel to the top surface of the substrate.

A chip module includes a circuit board (2), a slot (21) disposed on a surface of one side of the circuit board (2), a lidless packaged chip (5), a heat radiator (4), and a substrate fixing assembly (6). The lidless packaged chip (5) includes a substrate (51) and a die (52) packaged on the substrate (51). The slot (21) is electrically connected to the circuit board (2), the lidless packaged chip (5) has a connecting part on one side of the substrate (51) facing away from the die (52), and the connecting part is inserted into the slot (21). The heat radiator (4) is press-fitted on one side of the die (52) facing away from the circuit board (2). The substrate fixing assembly (6) is press-fitted at a periphery of one side of the substrate (51) facing away from the circuit board (2) and avoids the die (52).

A holder has a holding body, a spring member, and a tensioning member. The holding body forms a cavity to receive the electronic component. A connecting section has a thermally conductive heat conductive section adjacent to the cavity. The tensioning member tensions the spring member. The spring member supports itself in a tensioned state on a counter-holding member. The spring member moves a connecting surface of the holding body to the cooling body and/or presses it against the cooling body.

A method includes disposing a series of protrusions on a rectangular side panel of an open four-sided box-like structure in a frame, and attaching an electronic substrate to the frame. The electronic substrate carries one or more circuit components. The series of protrusions acts as a spring-like compensator to compensate plastic deformation, twisting or warping of the frame, and to limit propagation of stress to the electronic substrate via the frame.

The present disclosure concerns a mounting device for semiconductor packages, and a heat dissipation assembly with such a mounting device. The mounting device includes a bottom side comprising one or more cavities to house semiconductor packages, and a top side comprising a plurality of holes extending from the bottom side to the top side for accommodating contact pins of the semiconductor packages. A fixation mechanism fixes the mounting device to a heat dissipation structure.

A fluid delivery module that produces direct fluid-contact cooling of a computer processor, while mating with common processor accessory mounting specifications. Computer processors are commonly packaged and installed on printed circuit boards. The fluid module delivers cooling fluid directly to at least a surface of the processor package. The fluid module forms a fluid-tight seal against the surface of the processor package. By delivering fluid to the surface of the processor package, the module cools the computer processor. The module does not mechanically fasten to the processor. Instead, the module fastens to a variety of processor accessory mounting patterns commonly found on printed circuit boards. The printed circuit board typically carries the processor. This minimizes stress on the processor package, and allows greater modularity between different processors. In one embodiment, the fluid delivery is done with integral microjets, producing very high heat transfer cooling of the computer processor.

An electrical connector assembly includes: a printed circuit board; an electrical connector seated upon the printed circuit board; an electronic package coupled to the electrical connector; a frame structure affixed to the printed circuit board; a metallic securing seat affixed to the frame structure and having plural securing posts; a heat sink positioned upon the electronic package and having plural through holes aligned with the securing posts; plural fasteners each extending through a corresponding through hole to engage a corresponding securing post and plural springs each compressed between an associated fastener and the heat sink; and a retention member mounted to a corresponding securing post for engaging the heat sink, wherein the retention member has a mounting part and a latching part pivoted to the mounting part.

A semiconductor package includes a lead frame that includes a die pad and a plurality of leads, a semiconductor die mounted on a die attach surface of the die pad, an encapsulant body of electrically insulating material that covers semiconductor die and portions of the lead frame, and a fastener receptacle that includes a blind hole in the encapsulant body or the die pad, wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body.

An electronic apparatus, a semiconductor package module and a method for manufacturing the semiconductor package module are provided. The semiconductor package module includes: an encapsulated structure, including a device die and an encapsulant laterally enclosing the device die; a package substrate, attached to a first side of the encapsulated structure; a composite thermal interfacial structure, disposed on a second side of the encapsulated structure, and including thermally conductive elements arranged side by side or stacked along a vertical direction; a ring structure, attached to the package substrate and laterally surrounding the encapsulated structure; and a heat spreader, attached to the second side of the encapsulated structure through the composite thermal interfacial structure, and supported by the ring structure.

An electric power-steering control device has a substrate, a heat-generating component, and a heat-storing body. The heat-generating component is disposed on one surface of the substrate and generates heat when activated. The heat-storing body is capable of storing the heat from the heat-generating components. The heat-storing body has a main body having a rectangular plate shape and disposed on the one surface of the substrate. The heat-storing body has a notch section or a recess section.