An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.

Disclosed is a pressure balancing clamp for a press-pack insulated gate bipolar transistor (IGBT) module. The pressure balancing clamp for a press-pack IGBT module includes a bracket, where the bracket is provided with two longitudinally arranged pressure equalizing plates in a sliding way; the pressure equalizing plates are connected through pressure sensors; the upper and lower ends inside the bracket are respectively connected with the pressure equalizing plates through hydraulic devices and a displacement compensation device; opposite surfaces of the two pressure equalizing plates are respectively provided with heat dissipation and confluence devices. The pressure sensors are in one-to-one correspondence with the hydraulic devices and are electrically connected. The hydraulic devices adjust the pressure according to the readings of the pressure sensors in corresponding directions, so that the pressure of the press-pack IGBT module is balanced.

A stacking system is disclosed and includes a circuit board, an integrated circuit, a voltage regulation module and a heat dissipation module. The integrated circuit and the voltage regulation module are opposite disposed on a first side and a second side of the circuit board. The heat dissipation module includes a first heat dissipation component and a second heat dissipation component located at a top surface of the integrated circuit and the bottom surface of the voltage regulation module. The second heat dissipation component includes a base and an extended arm. The base is in thermal contact with bottom surface of the voltage regulation module. The extended arm is extended from the base to the first heat dissipation component and in thermal contact with the first heat dissipation component.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

A semiconductor device includes: an insulating substrate; a semiconductor chip; a base plate; a first heat dissipating material; and a case. The semiconductor chip and a sealing material for sealing the semiconductor chip are housed in the case. The insulating substrate includes an insulating layer and a conductor pattern provided on an upper surface of the insulating layer. The semiconductor chip is joined onto the conductor pattern by a joining material. A lower surface of the insulating substrate and an upper surface of the base plate are in contact with each other with interposition of the first heat dissipating material. The insulating substrate and the base plate are not fixed to each other.

A heat dissipation base includes a fixing plate and a metal heat conduction block. The fixing plate includes a plurality of heat pipe partitions and a plurality of heat pipe fixing openings, and the heat pipe fixing openings are formed between the heat pipe partitions. The metal heat conduction block is fixed to the fixing plate, and the fixing plate further includes a plurality of supporting portions to support shear surfaces at two ends of the heat conduction block.

A semiconductor device includes a chip package comprising a semiconductor die laterally encapsulated by an insulating encapsulant, the semiconductor die having an active surface, a back surface opposite to the active surface, and a thermal enhancement pattern on the back surface; and a heat dissipation structure connected to the chip package, the heat dissipation structure comprising a heat spreader having a flow channel for a cooling liquid, and the cooling liquid in the flow channel being in contact with the thermal enhancement pattern.

Memory on Package (MOP) apparatus with reverse CAMM (Compression Attached Memory Module) and compression mount technology (CMT) connector(s). The MOP includes a first (MOP) substrate to which one or more CPUs, SoC, and XPUs that is operatively coupled to one or more CAMMs with a CMT connector(s) disposed between an array of CMT contact pads on the CAMM substrate and an array of CMT contact pad on the substrate. The one or more CAMMs are include multiple memory chips or packages such as LP DDR chips or DDR (S)DRAM chips/packages mounted to an underside of the CAMM substrate via signal coupling means such as a ball grid array (BGA), where the CAMM orientation is inverted such that the memory chips/packages are disposed downward, resulting in a reduced Z-height of the MOP. A MOP may include two CAMMs with a respective CMT connector disposed between the CAMM substrates and the MOP substrate.

A system connects a board to a substrate through an interposer board having compressible connectors through the interposer board. The connectors through the interposer board are compression-based connector pins that extends above and below the interposer board to make electrical contact between the board and the substrate. The system can include a plate to secure the board to the substrate and compress the compression-based connectors of the interposer board.

Integrated Thermal Interface Detachment Mechanism for Inaccessible Interfaces are disclosed. According to an aspect, an exemplary device for an electronic component having a thermal interface material, comprising a heat sink configured to contact the thermal interface material and configured to heat transfer interface with the electronic component while the thermal interface material is in contiguous contact with both the heat sink and the electronic component, and a separator mechanism configured to advance a separator ram with respect to the heat sink and effect a force upon the thermal interface material, such that advancing the ram breaks the contiguous contact of the thermal interface material with at least one of the heat sink and the electronic component.