A method for manufacturing a fin-integrated semiconductor module includes: clamping a fin-integrated heat-dissipation base using a level different jig while making the heat-dissipation base vary in height; and soldering a semiconductor assembly onto the heat-dissipation base. A semiconductor module includes a fin-integrated heat-dissipation base and a semiconductor assembly provided on the heat-dissipation base. A bending width of the heat-dissipation base is 200 μm or less.

In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.

In an embodiment, a device includes: a package component including integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure over the encapsulant and the integrated circuit dies, and sockets over the redistribution structure; a mechanical brace physically coupled to the sockets, the mechanical brace having openings, each one of the openings exposing a respective one of the sockets; a thermal module physically and thermally coupled to the encapsulant and the integrated circuit dies; and bolts extending through the thermal module, the mechanical brace, and the package component.

The disclosure relates to an arrangement with a power module including power semiconductor components. The arrangement further includes a component having a curved surface. The power module is arranged on the curved surface of the component and is non-positively detachably connected to the component. The disclosure also relates to a power converter with the arrangement and to a vehicle with a power converter.

An assembly (110) for dissipating heat generated by a heat generating electrical component (16) which is surface mounted on a circuit board (11) in a surface mounting process. The assembly comprises a heat buffer (120) made of a thermally and electrically conducing material, and being surface mounted on the circuit board (11) so as to be soldered to a thermal flag (18) of the heat generating electrical component (16). The assembly further comprises a heat sink (12) in thermal contact with the heat buffer, and a galvanic separation (13) between the heat buffer and heat sink. The heat capacitance of the heat buffer can absorb short term increases in heat dissipation from the electrical component, before the heat is further dissipated to the galvanically separated heat sink. This may drastically improve performance of the surface mounted component.

An electronic card includes a substrate, an electronic device bonded to the substrate via a solder bump, and configured to include a first ceiling, and a cover fixed to the substrate, provided over the electronic device, and configured to include a second ceiling that faces the first ceiling, wherein the first ceiling or the second ceiling is provided with an annular member extending in a facing direction of the first ceiling and the second ceiling, the annular member forming an annular shape along a circumferential direction of the first ceiling, wherein the first ceiling and the second ceiling form a gap between the first ceiling and the second ceiling filled with a filling material inside the annular member, and wherein the second ceiling includes a through hole at a position that overlaps the filling material when viewed in a plan view of the second ceiling.

Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.

Thermal management for modular electronic devices is provided. In one embodiment, a modular electronic device comprises: a primary electronics assembly comprising a least one module bay configured to receive a pluggable electronics module, wherein the pluggable electronics module comprises at least one heat conduction riser that protrudes from the pluggable electronics module; a heat management mechanism coupled to the primary electronics assembly, wherein the heat management mechanism includes at least one floating heat sink thermally coupled to the heat conduction riser of the pluggable electronic module by a heat pipe that defines a direct thermal conductive heat path between the pluggable electronics module and the floating heat sink. The heat pipe is mounted to the primary electronics assembly by a spring loaded floating heat pipe interface that applies a clamping force against the heat pipe, and maintains contact between the interface and the heat conduction riser.

A semiconductor device including a substrate, a semiconductor package, a thermal conductive bonding layer, and a lid is provided. The semiconductor package is disposed on the substrate. The thermal conductive bonding layer is disposed on the semiconductor package. The lid is attached to the thermal conductive bonding layer and covers the semiconductor package to prevent coolant from contacting the semiconductor package.

A thermal chamber includes multiple sides, such as a back side, a front side, a first end, a second end, a top side, and a bottom side. An electronic circuit board is adjustably mounted to the bottom side and positioned above the bottom side of the thermal chamber. In the closed position the multiple sides form an enclosed chamber. The top side includes one or more ports orientated along the horizontal axis. Each of the one or more ports includes a top side open area that exposes the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from multiple electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.