Implementations of semiconductor packages may include a first substrate having two or more die coupled to a first side, a clip coupled to each of the two or more die on the first substrate and a second substrate having two or more die coupled to a first side of the second substrate. A clip may be coupled to each of the two or more die on the second substrate. The package may include a lead frame between the first substrate and the second substrate and a molding compound. A second side of each of the first substrate and the second substrate may be exposed through the molding compound. A perimeter of the first substrate and a perimeter of the second substrate may not fully overlap when coupled through the lead frame.

A locking push pin and methods of using the locking push pin to assemble a heatsink assembly, are described. The locking push pin includes a body lumen extending through a pin body, and several prongs radially outward from the body lumen. Peripheral surfaces of the prongs are separated by a body slot radially outward from the body lumen. The locking push pin includes a pin lock having a branch that extends through the body lumen and into the body slot between the peripheral surfaces. The pin lock advances from an unlocked configuration in which the branch is in the body slot proximal to a distal end of the prongs, allowing the prongs to deflect radially inward, to a locked configuration in which the branch is in the body slot at the distal end of the prongs, blocking deflection of the prongs. Other embodiments are also described and claimed.

A clamp assembly is operable to engage at least three heat-generating electrical components arranged side-by-side and clamp the electrical components relative to a heat sink. The clamp assembly includes a clamp bar and a fastener to secure the clamp bar to the heat sink. The clamp bar includes at least three spaced apart projections configured to be located in engagement with the respective electrical components. The clamp bar presents a slot positioned between a spaced apart pair of the projections and defines respective clamp bar sections on opposite sides thereof. The slot permits the clamp bar sections to shift relative to one another and thereby facilitate clamping engagement of the projections with the electrical components.

An improved heat dissipation apparatus for limiting the temperature of multiple power semiconductors featuring flow balancers to manipulate the hydrodynamic pressure of the coolant fluid to regulate the coolant fluid flow distribution across the heat exchange fins to either create uniform flow distribution or purposefully disproportionate or custom coolant fluid flow distribution for the purpose of achieving higher heat transfer efficiency.

A clamp assembly is operable to engage at least three heat-generating electrical components arranged side-by-side and clamp the electrical components relative to a heat sink. The clamp assembly includes a clamp bar and a fastener to secure the clamp bar to the heat sink. The clamp bar includes at least three spaced apart projections configured to be located in engagement with the respective electrical components. The clamp bar presents a slot positioned between a spaced apart pair of the projections and defines respective clamp bar sections on opposite sides thereof. The slot permits the clamp bar sections to shift relative to one another and thereby facilitate clamping engagement of the projections with the electrical components.

A semiconductor package system comprises a semiconductor package and a cap. The semiconductor package comprises a die pad, a chip mounted or arranged to a first main face of the die pad and an encapsulation body encapsulating the chip and the die pad. The cap covers at least partly an exposed second main face of the die pad. The cap comprises a cap body of an electrically insulating and thermally conductive material and a fastening system fastening the cap to the semiconductor package. The fastening system extends from the cap body towards the encapsulation body or along a side surface of the semiconductor package.

Examples described herein include an assembly. The assembly may be a heatsink assembly or some other cooling assembly (for example, a liquid cooling assembly). The heatsink or cooling assembly may include a heatsink or some other cooling means, such as a liquid cooling device. The heatsink or cooling assembly may include a base. The heatsink itself may connect to a base or the bottom of the heatsink may form the base. The base may interface or connect to a bolster plate. The base may interface or connect to a bolster plate via apertures in the base and fasteners included on the base and the bolster plate. The heatsink or cooling assembly may include one or more apertures to accept one or more guide pins and/or retention pins on the bolster plate. The base may include retention mechanisms positioned over the apertures to attach to retention pins on the bolster plate. The retention pins may be the guide pins with retention features.

Particular embodiments described herein provide for an electronic device that can be configured to enable an active loading mechanism. The electronic device can include a printed circuit board, a heat source located on the printed circuit board, and an active loading mechanism secured to the printed circuit board. The active loading mechanism is over the heat source and includes shape memory material. When the shape memory material is not activated, the active loading mechanism applies a first load on the heat source and when the shape memory material is activated, the active loading mechanism applies a second load on the heat source.

A locating unit with a base seat locating structure. The base seat locating structure includes a base seat and a locating unit. The base seat has a pair of locating holes each having a first locating hole section and a second locating hole section and a connection section connected therebetween. The second locating hole section has a locating recess. The locating unit has a main body having a first side and a second side and a through hole passing through the main body between the first and second sides. A first protruding key and a second protruding key protrude from the second side beside the through hole. The first and second protruding keys are displaceably assembled and connected with the locating holes. Free ends of the first and second protruding keys respectively have a first end section and a second end section connected and assembled with the locating recesses.

Aspects of the embodiments are directed to a printed circuit board (PCB) that includes a conductive layer extending from the printed circuit board to act as a heat sink for circuit components electrically and mechanically attached to the PCB. The conductive layer can be a copper ground layer of a multi-layered PCB. The PCB can include one or more circuit components, such as dynamic random access memory elements. In embodiments, the PCB is part of a dual inline memory module. The conductive layer can be fashioned such that it extends out from the PCB and returns over the circuit elements to define an air gap between the conductive layer and the surface of the PCB and/or the surface of the circuit elements. In embodiments, a connection adaptor can be used to accommodate various PCB thicknesses so that the PCB can be electrically connected to an edge connector.