An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

A power module includes a number of sub-modules connected via removable jumpers. The removable jumpers allow the connections between one or more power semiconductor die in the sub-modules to be reconfigured, such that when the removable jumpers are provided, the power module has a first function, and when the removable jumpers are removed, the power module has a second function. The removable jumpers may also allow for independent testing of the sub-modules. The power module may also include a multi-layer printed circuit board (PCB), which is used to connect one or more contacts of the power semiconductor die. The multi-layer PCB reduces stray inductance between the contacts and therefore improves the performance of the power module.

A mounting structure of the present disclosure includes a package on whose upper surface an electronic component is mounted, a voltage regulator module, a mother board for mounting the package on an upper surface of the mother board, a driver, a plurality of connectors for electrically connecting a conductor layer of the mother board and a conductor layer of the package to each other, and a heat sink.

A first supporting element, e.g. a PCB, may have opposed sides. A heat sink body is mounted on one side of the first supporting element, and having peripheral surface(s) for heat dissipating electrical device. A first circuit includes the heat dissipating electrical device(s) mounted and operates at a first voltage level. At least one circuit board assembly is mounted on the other side of the first supporting element, and extends from a first end to a second end. It has a first end connector at the first end, for connecting the first end of the circuit board assembly to the first circuit, and providing a signal interface between the first circuit operating at the first voltage level and a second circuit operating at a second voltage level different or equal to the first voltage level.

The load force bolster assembly includes a metallic stiffener. A carrier associated with a CPU (Central Processing Unit) is located upon the load force bolster assembly and positioned upon the electrical connector. A heat sink is located upon both the carrier and the load force bolster assembly wherein a torsioned wire of the bolster assembly provides a downward force upon an up-and-down movable stud which is secured to a screw of the heat sink so as to downwardly push the heat sink, thus enhancing the normal forces among the heat sink, the CPU and the contacts of the electrical connector. To efficiently hold the torsioned wire in position around a bottom corner of the stiffener, a retention groove is formed around the top portion of the restricting pole, and a pressing ring is downwardly snapped into the retention groove so as to restrain the torsioned wire in position.

A thermal interface for discrete semiconductor devices (such as IGBT's) having a thermally conductive structure, a PCB populated with discrete electronic components, and each of the discrete semiconductor devices having a housing extending beyond the edge of the PCB and in a direction substantially parallel to a plane of the PCB, and a clamp bar secured to the thermally conductive structure adapted to compressively secure each housing to the thermally conductive structure and adapted to maintain thermal contact between a surface of each housing and the surface of the thermally conductive structure. A thermally conductive and electrically insulative pad is positioned between the semiconductor device housing and the thermally conductive structure. A casing enclosing the interface and PCB includes the thermally conductive structure formed on a backwall of the casing.

A power module includes: a power chip; a control chip controlling the power chip; a power terminal connected to the power chip; a control terminal connected to the control chip; and a package covering the power chip, the control chip, the power terminal, and the control terminal with mold resin, wherein first and second recesses for attaching a fin are respectively provided on side faces facing each other of the package from which neither the power terminal nor the control terminal protrudes, and the first and second recesses are arranged not at positions opposite to each other but alternately.

A heatsink retainer assembly, and components of the heatsink retainer assembly, are described. The heatsink retainer assembly includes one or more heatsink anchors mounted on a heatsink retention wire between several stops. The anchors include channels to receive the retention wire such that the anchors can slide over the retention wire between the stops. The stops retain the anchors on the retention wire. The anchors can be inserted into respective mounting holes of a carrier substrate by pressing the anchors into the mounting holes on a side of the carrier substrate carrying a heat source. A heatsink can be mounted on the heat source and the retention wire can extend over the heatsink to retain the heatsink against the heat source when the anchors are secured to the carrier substrate. Other embodiments are described and claimed.

A connector includes a cage having a plurality of receiving chambers, a separation mechanism including a lower separation plate and an upper separation plate, a radiator disposed between the lower separation plate and the upper separation plate, and an elastic clip mounted on the radiator and elastically holding the radiator in the separation mechanism. The separation mechanism is located between and separates a pair of adjacent receiving chambers of the plurality of receiving chambers in a height direction of the connector. A pair of sides of the elastic clip opposite to each other in a lateral direction of the radiator are fixed between the lower separation plate and the upper separation plate.

A packaging technology in which power switching elements, such as field-effect transistors (FETs), can be oriented in a vertical position relative to the printed circuit board (PCB) on which the product is mounted. The power die including the switching element(s) can essentially stand on end so that they take up very little PCB area. Multiple dies can be positioned this way, and the dies can be attached to a heat sink structure, which is designed to take the heat generated by the dies onto the top of the package. The heat sink structure can be attached to a structure to route the power and analog signals properly to the desired pins/leads/balls of the finished product. Using these techniques can result in a significant increase in the power density (both PCB space and solution volume) of power switching elements, e.g., FETs.