A thermal chamber includes multiple sides, such as a back side, a front side, a first end, a second end, a top side, and a bottom side. The multiple sides form a cavity. The top side includes one or more ports. Each of the one or more ports includes a top side open area that exposes the cavity within the thermal chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy to and from an electrical device exposed via the cavity. The top side open area of the one or more ports has a corresponding bottom side open area of the bottom side located below the top side open area. The bottom side open area is configured to allow the temperature control component to contact the electrical device that is exposed via the bottom side open area.

Example implementations relate to a heat transfer adapter plate. For example, a heat transfer adapter plate can comprise a first retention mechanism to couple a heat transfer device to the heat transfer adapter plate and a second retention mechanism to couple the heat transfer adapter plate to an electronic component. The heat transfer adapter plate can accept a plurality of heat transfer device types, including but not limited to, a passive heat exchanger, an active heat exchanger, and a heat pipe.

In one embodiment, an apparatus for holding down a heat sink on a printed circuit board comprises a pair of hold down clips, each of the hold down clips comprising a first end for attachment to the heat sink, a resiliently compressible arm, and a retaining finger at a second end for insertion into an opening in the printed circuit board. The retaining finger is configured to exert a spring force against a lower surface of the printed circuit board when inserted into the opening to securely hold down the heat sink on an upper surface of the printed circuit board.

A semiconductor package comprises a first die thermally coupled to a first thermally conductive device. The first thermally conductive device has a first surface exposed to an exterior of the semiconductor package. The package comprises a second die thermally coupled to a second thermally conductive device, the second thermally conductive device having a second surface exposed to an exterior of the semiconductor package. The first and second dies are positioned in different horizontal planes.

An example thermal interface device to attach to and cool a memory module. The device includes two sides sections that cover and contact the side faces of the memory module when installed. The device includes an outer layer that is a thermally conductive and resilient material, and an inner layer that is a thermally conductive and malleable metal. The inner layer may be nested within the outer layer, and the inner layer contacts the memory circuits of the memory module when installed. The outer layer includes spring fingers extending outward so as to contact and be compressed by a heat transfer device, such as a heat pipe, that is positioned on a side of the memory module. A thermally conductive path is thereby provided between the memory module and the heat transfer device via the thermal interface device.

A system for cooling memory modules mounted in parallel on a printed circuit board may include a coolant tube installed in parallel between two of the memory modules, and a heat spreader disposed in parallel between the two memory modules. The heat spreader may include a base having an outer surface thermally coupled to the coolant tube and first and second fins. The first fin has a first spring force toward a first of the two memory modules. The first spring force causes the first fin to provide contact pressure to the first memory module to thermally couple the first fin and the first memory module. The second fin has a second spring force toward a second of the two memory modules. The second spring force causes the second fin to provide contact pressure to the second memory module to thermally couple the second fin and the second memory module.

A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

An electronic apparatus includes a printed circuit board (PCB); a circuit element mounted on the PCB; a heat sink contacting the circuit element and configured to receive heat generated by the circuit element; a bottom chassis configured to support the PCB and the heat sink; and a coupling member connecting the heat sink and the bottom chassis and configured to transfer heat received from the heat sink to the bottom chassis.

A solar cell module includes: an at least one solar cell disposed between a first cover and a second cover; a sealing material that fills a gap between the first cover and the second cover to join them together, and seals the solar cell; and a tab line as a conductor electrically connected to the solar cell and enclosed by the sealing material between the first cover and the second cover, the tab line having a plurality of bases, and an expansion and contraction portion that can expand and contract in a longitudinal direction and connects the plurality of bases, the plurality of bases each being provided with a through hole and a connection base electrically connected to the solar cell, at least one of the first cover and the second cover having a boss as a positioning unit that positions the tab line.

Examples described herein relate to a tool-less manner of forming an assembly with a circuit board carrier enclosure that provide leaf springs that provide a force against a circuit board to maintain a level surface of the circuit board. Multiple leaf springs can be used to apply a desired force to the circuit board. A heat sink can be mounted in the enclosure at a distance from the circuit board. The circuit board with carrier can be inserted without tools into an electrical connection for communications with other devices.