A connector, comprises: a cage having a chamber having a top wall; a radiator mounted on the top wall of the chamber; an elastic clip fixing the radiator on the top wall of the chamber and having a first side and a second side opposite to the first side in a lateral direction of the chamber; a first latch on the cage and having a slot; a second latch on the cage and having a slot; a first hook on the first side of the elastic clip engaged into the slot of the first latch from an outer side of the first latch; and a second hook on the second side of the elastic clip engaged into the slot of the second latch from an inner side of the second latch far away from the first latch and facing the first latch.

A socket for an electric component includes a socket body in which a contact pin is provided in a housing part and a cover member provided so as to be rotatable with respect to the socket body. The cover member has a cover member body and a heat slug in contact with an electric component. The heat slug is configured so as to move downward and press the electric component by being pressed from above by a cooling head in a state in which the cover member is closed. In a state in which the electric component is housed in the housing part, a restricting mechanism allows the downward movement of the heat slug, whereas in a state in which the electric component is not housed in the housing part, the restricting mechanism prevents the downward movement of the heat slug.

A memory module cooling system includes a liquid cooled manifold assembly and a heat spreader assembly rotateably attached to the liquid cooled manifold assembly about an axis perpendicular to the memory module. The liquid cooled manifold assembly includes a manifold, an liquid inlet, and a liquid outlet. The heat spreader assembly includes a base in thermal contact with a heat pipe, and a heat spreader in thermal contact with the heat pipe, the heat spreader configured to thermally engage the memory module. In certain embodiments, thermal bonds are maintained between a plurality of neighboring memory modules when a particular heat spreader assembly is rotated away from an associated memory module.

The technology relates to a cage configured to removably receive a module. The cage may include a frame comprising a plurality of panels joined to one another, a lever pivotably coupled to the frame, and a heatsink pivotably coupled to the lever. The panels together may extend around a longitudinal recess configured to receive the module therein. The longitudinal recess may define a longitudinal axis thereof. A first one of the panels may have an aperture defined therein in communication with the longitudinal recess. A first end of the lever may extend into the longitudinal recess. The heatsink may be pivotably coupled to a second end of the lever opposite the first end. The heatsink may be movable in a translation direction transverse to the longitudinal axis. The heatsink may be translatable between a first position outside of the longitudinal recess and a second position partially inside the longitudinal recess.

A member to be fastened on one side of which a member to be fixed is placed; a plate-shaped holding spring member which is disposed on the member to be fixed on one side thereof opposite to the member to be fastened; a support which extends outward of an end part of a longitudinal central part of the plate-shaped holding spring member and which has a through hole formed therein; a supporting column which is provided on the support and bends toward the member to be fastened; a fixing screw hole which is provided in the member to be fastened and disposed at a position corresponding to the through hole of the support so as to have the same axial center as the through hole; and a fixing screw which is inserted into the through hole of the support and screwed to the fixing screw hole.

Embodiments of the present invention provide efficient and cost-effective systems for a lidded electronic device. The lidded electronic device includes an electronic module including an integrated circuit chip built on a substrate. The lidded electronic device also includes a module lid having a heat transferring feature, which extends above the top surface of the module lid. A manifold structure can be placed over the top surface of the module lid using a variety of techniques.

An object of the present invention is to improve the reliability of a semiconductor device having an imaging function. A semiconductor device includes a package having a cavity and terminals (TE1), a semiconductor chip that has an imaging unit and is arranged in the cavity, and a cap material with which the cavity is sealed and which has translucency. In addition, the semiconductor device includes a mounting board that has a through-hole and terminals (TE2) and is arranged so as to electrically couple the terminals (TE1) to the terminals (TE2), a heat transfer member that is inserted into the through-hole and is coupled to the package, and a heat sink coupled to the heat transfer member.

A retainer for detachably coupling a heat absorbing/dissipating device to a heat source is disclosed. The retainer can include one or more cooling fins to enable the retainer to dissipate heat along with the heat dissipating device. The cooling fins on the retainer can be wedge-shaped or airfoil-shaped, among other things, to increase, direct, and smooth airflow over the retainer, the heat source, and the heat dissipating device. The heat dissipating device can include a heat sink with multiple cooling fins. The cooling fins on the retainer can have substantially the same geometric pattern as the cooling fins on the heat sink.

A power module includes a number of sub-modules connected via removable jumpers. The removable jumpers allow the connections between one or more power semiconductor die in the sub-modules to be reconfigured, such that when the removable jumpers are provided, the power module has a first function, and when the removable jumpers are removed, the power module has a second function. The removable jumpers may also allow for independent testing of the sub-modules. The power module may also include a multi-layer printed circuit board (PCB), which is used to connect one or more contacts of the power semiconductor die. The multi-layer PCB reduces stray inductance between the contacts and therefore improves the performance of the power module.

A connector includes a cage having a plurality of receiving chambers, a separation mechanism including a lower separation plate and an upper separation plate, a radiator disposed between the lower separation plate and the upper separation plate, and an elastic clip mounted on the radiator and elastically holding the radiator in the separation mechanism. The separation mechanism is located between and separates a pair of adjacent receiving chambers of the plurality of receiving chambers in a height direction of the connector. A pair of sides of the elastic clip opposite to each other in a lateral direction of the radiator are fixed between the lower separation plate and the upper separation plate.