A component mounting device head unit includes a head main body, a nozzle being provided on the head main body, a drive source, a cover, and a heat transfer member. The nozzle is configured to pick up a component. The drive source is configured to transfer moving power to at least one of the head main body and the nozzle. The cover covers the drive source. The heat transfer member connects the cover to the drive source or a frame of the drive source, and the heat transfer member is configured to allow heat generated by the drive source to escape to the cover.

A piezoelectric cooling system and method for driving the cooling system are described. The piezoelectric cooling system includes a first piezoelectric cooling element and a second piezoelectric cooling element. The first piezoelectric cooling element is configured to direct a fluid toward a surface of a heat-generating structure. The second piezoelectric cooling element is configured to direct the fluid to an outlet area after heat has been transferred to the fluid by the heat-generating structure.

A piezoelectric cooling system and method for driving the cooling system are described. The piezoelectric cooling system includes a first piezoelectric cooling element and a second piezoelectric cooling element. The first piezoelectric cooling element is configured to direct a fluid toward a surface of a heat-generating structure. The second piezoelectric cooling element is configured to direct the fluid to an outlet area after heat has been transferred to the fluid by the heat-generating structure.

A sheet-shaped heat pipe includes a sheet-shaped container, a wick sealed in the container, and a working fluid sealed in the container, the sheet-shaped container including a first metal sheet and a second metal sheet, the first metal sheet and the second metal sheet being superposed in direct contact with each other at a peripheral edge portion, and the sheet-shaped container having a thickness of about 0.5 mm or less, and a thin heat dissipating plate that includes the sheet-shaped heat pipe.

A sheet-shaped heat pipe includes a sheet-shaped container, a wick sealed in the container, and a working fluid sealed in the container, the sheet-shaped container including a first metal sheet and a second metal sheet, the first metal sheet and the second metal sheet being superposed in direct contact with each other at a peripheral edge portion, and the sheet-shaped container having a thickness of about 0.5 mm or less, and a thin heat dissipating plate that includes the sheet-shaped heat pipe.

A micro heat pipe includes a pipe body, a second capillary structure disposed inside the pipe body, and a working fluid injected into the pipe body. The pipe body has two enclosed ends and is defined with a heat absorbing section, a heat isolating section and a condensing section. The pipe body is provided on an inner pipe wall thereof with etched patterns serving as a first capillary structure and fully distributed in the aforementioned sections. The heat absorbing section is filled up with the second capillary structure. The micro heat pipe is manufactured in a way that the inner pipe wall of the pipe body is etched to form the first capillary structure, the second capillary structure is filled in the heat absorbing section and then sintered, the working fluid is injected into the pipe body, and the pipe body is vacuumed and sealed.

A micro heat pipe includes a pipe body, a second capillary structure disposed inside the pipe body, and a working fluid injected into the pipe body. The pipe body has two enclosed ends and is defined with a heat absorbing section, a heat isolating section and a condensing section. The pipe body is provided on an inner pipe wall thereof with etched patterns serving as a first capillary structure and fully distributed in the aforementioned sections. The heat absorbing section is filled up with the second capillary structure. The micro heat pipe is manufactured in a way that the inner pipe wall of the pipe body is etched to form the first capillary structure, the second capillary structure is filled in the heat absorbing section and then sintered, the working fluid is injected into the pipe body, and the pipe body is vacuumed and sealed.

A method of reducing heat flow between IC chips and the resulting device are provided. Embodiments include attaching plural IC chips to an upper surface of a substrate; forming a lid over the IC chips; and forming a slit through the lid at a boundary between adjacent IC chips.

A method of reducing heat flow between IC chips and the resulting device are provided. Embodiments include attaching plural IC chips to an upper surface of a substrate; forming a lid over the IC chips; and forming a slit through the lid at a boundary between adjacent IC chips.

A power overlay (POL) module includes a semiconductor device having a body, including a first side and an opposing second side. A first contact pad defined on the semiconductor device first side and a dielectric layer, having a first side and an opposing second side defining a set of first apertures therethrough, is disposed facing the semiconductor device first side. The POL module, includes a metal interconnect layer, having a first side and an opposing second side, the metal interconnect layer second side is disposed on the dielectric layer first side) and extends through the set of first apertures to define a set of vias electrically coupled to the first contact pad. An enclosure defining an interior portion is coupled to the metal interconnect layer first side, and a phase change material (PCM) is disposed in the enclosure interior portion.