An apparatus for a common cooling solution for multiple packages of a common height, including: a first die package; a second die package having a same height as the first die package; and a cooling element thermally coupled to the first die package and the second die package by a planar surface of the cooling element.

An illustrative example embodiment of an electronic device includes an integrated circuit component having a plurality of solder balls on one side. The substrate includes a first side adjacent the one side of the integrated circuit component. The substrate includes a plurality of openings. At least some of those openings are aligned with the solder balls. A cooling plate is situated toward a second side of the substrate. A thermally conductive material within the plurality of openings is thermally coupled with the cooling plate. At least some of the thermally conductive material is thermally coupled with the solder balls.

An electronic device includes a substrate which is provided in a housing and on which a heat generating member is mounted, a cooling member configured to cool the heat generating member, a first tube including one end connected to the cooling member and configured to supply a cooling medium to the cooling member or discharge the cooling medium from the cooling member, a joint member including a first connection portion extending in a tube axial direction of the first tube and connected to another end of the first tube, a support member fixed to the housing or the substrate, and a tube fixing portion configured to fix the first tube to the support member.

Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment a package substrate comprises a core with a first surface and a second surface opposite from the first surface. In an embodiment, a buildup layer is over the first surface of the core. In an embodiment, a channel is through the core, where the channel extends in a direction that is substantially parallel to the first surface.

Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment a package substrate comprises a core with a first surface and a second surface opposite from the first surface. In an embodiment, a buildup layer is over the first surface of the core. In an embodiment, a channel is through the core, where the channel extends in a direction that is substantially parallel to the first surface.

Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate has a first recess and a plurality of second recesses at the bottom of the first recess. In an embodiment a die is coupled to the substrate by a die attach film (DAF), where the die sits in the first recess. In an embodiment, a surface of the DAF seals the second recesses.

Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate has a first recess and a plurality of second recesses at the bottom of the first recess. In an embodiment a die is coupled to the substrate by a die attach film (DAF), where the die sits in the first recess. In an embodiment, a surface of the DAF seals the second recesses.

A mobile device case is described. The mobile device case includes a housing configured to retain a mobile device and an active cooling system integrated into the housing. The active cooling system configured to use vibrational motion to cool a surface of the mobile device.

A convector for cooling a microprocessor includes a volute-shaped housing, a stator, and a rotor, and can be mounted to a CPU board of a computing device for thermal coupling with the microprocessor. The volute-shaped housing of the convector encapsulates the stator and the rotor, and has a radially outer casing which defines a single exit port for guiding a fluid out of the housing. The stator has a plurality of plates configured to conduct heat. The rotor has a plurality of disks and a shaft extending longitudinally along the housing. Together, the housing, the stator, and the rotor define a spiral flow path through the volute-shaped housing, in both radially outward and longitudinal directions, to the single exit port. A motor may be provided to impart rotational motion to the rotor.

A convector for cooling a microprocessor includes a volute-shaped housing, a stator, and a rotor, and can be mounted to a CPU board of a computing device for thermal coupling with the microprocessor. The volute-shaped housing of the convector encapsulates the stator and the rotor, and has a radially outer casing which defines a single exit port for guiding a fluid out of the housing. The stator has a plurality of plates configured to conduct heat. The rotor has a plurality of disks and a shaft extending longitudinally along the housing. Together, the housing, the stator, and the rotor define a spiral flow path through the volute-shaped housing, in both radially outward and longitudinal directions, to the single exit port. A motor may be provided to impart rotational motion to the rotor.