H01L23/467

Electronic device having heat dissipation function

An electronic device having heat dissipation function is proposed. The electronic device includes: a heating element (60) installed in a casing (C); a heat dissipation means (70) causing an ionic wind to flow into an inner space (S) of the casing (C); and a heat dissipation bridge (95). The heat dissipation bridge (95) exchanges heat with the ionic wind flowing in the inner space (S) by protruding in a direction of the heating element (60) and at least a portion of the heat dissipation bridge is connected to a heat sink and transfers heat received from the heating element (60) to the heat sink. Accordingly, two means of the heat dissipation means (70) and the heat dissipation bridge (95) simultaneously cool the heating element (60), so cooling efficiency is improved.

DEVICE FOR TRANSFERRING HEAT

The invention relates to a device (2) for transferring heat from a thermally conductive plate (3) capable of capturing the heat from a zone placed on a first side (32) of the plate, the device comprising at least one fin (35) placed on a second side (34) of the plate (30) opposite the first side (32) and having a duct (36) extending in a longitudinal direction (L) between a first end (38) connected to the plate and a second end (4) opposite the first end and which opens out, the duct (36) being connected to at least one Venturi-effect neck (42) bringing cooling air into the duct, the neck (42) being formed in the vicinity of the first end of the duct and the plate (30).

DEVICE FOR TRANSFERRING HEAT

The invention relates to a device (2) for transferring heat from a thermally conductive plate (3) capable of capturing the heat from a zone placed on a first side (32) of the plate, the device comprising at least one fin (35) placed on a second side (34) of the plate (30) opposite the first side (32) and having a duct (36) extending in a longitudinal direction (L) between a first end (38) connected to the plate and a second end (4) opposite the first end and which opens out, the duct (36) being connected to at least one Venturi-effect neck (42) bringing cooling air into the duct, the neck (42) being formed in the vicinity of the first end of the duct and the plate (30).

HEATSINK AND COOLING DEVICE

A heatsink, which is used with a fluid flow generator that rotates about a central axis extending vertically to generate a flow of fluid, includes a main body section having a top surface facing the fluid flow generator in a vertical direction, and fins that extend upward from the top surface so as to define a plurality of flow passages. Four regions defined by an X axis and a Y axis, which cross each other at an intersection between the central axis and the top surface and extend in an extending direction of the top surface, are referred to as a first region, a second region, a third region, and a fourth region, in order in a direction opposite to a rotation direction of the fluid flow generator. In a plan view from above, the plurality of flow passages form a plurality of fluid paths, each of which has an inlet disposed in at least one of the four regions for the fluid discharged from the fluid flow generator to flow in and an outlet disposed in the first region, and a fluid flow direction changes at an acute angle in the middle in at least one of the fluid paths having the inlet in the fourth region.

HEATSINK AND COOLING DEVICE

A heatsink, which is used with a fluid flow generator that rotates about a central axis extending vertically to generate a flow of fluid, includes a main body section having a top surface facing the fluid flow generator in a vertical direction, and fins that extend upward from the top surface so as to define a plurality of flow passages. Four regions defined by an X axis and a Y axis, which cross each other at an intersection between the central axis and the top surface and extend in an extending direction of the top surface, are referred to as a first region, a second region, a third region, and a fourth region, in order in a direction opposite to a rotation direction of the fluid flow generator. In a plan view from above, the plurality of flow passages form a plurality of fluid paths, each of which has an inlet disposed in at least one of the four regions for the fluid discharged from the fluid flow generator to flow in and an outlet disposed in the first region, and a fluid flow direction changes at an acute angle in the middle in at least one of the fluid paths having the inlet in the fourth region.

COOLING DEVICE FOR DISSIPATING HEAT

A cooling device for dissipating heat from articles to be cooled, such as power electronic modules, having at least one preferably rigid heat sink which consists in particular of solid material, preferably composed of metal, for example composed of aluminium, and which is intended to absorb heat from one or more articles to be cooled, and having a cooling fluid chamber for accommodating cooling fluid, in particular cooling liquid, to which the heat absorbed by the heat sink can be transferred. The cooling device has at least two preferably rigid heat sinks which consist in particular of solid material and which are connected to one another in an articulated manner, in particular by way of a heat sink joint, in such a way that the two heat sinks are movable relative to one another in different, in particular parallel planes.

ARRANGEMENT MADE UP OF COOLING DEVICE AND COOLING ARTICLE

An arrangement having a cooling device for dissipating heat from articles to be cooled which has at least one heat sink that has a heat absorption surface composed of metal and that is intended to absorb heat from one or more articles to be cooled, and also a cooling fluid chamber for accommodating cooling fluid to which the heat absorbed by the heat sink can be transferred, and having at least one article to be cooled which has a preferably planar heat emission surface composed of metal. To optimize the heat conduction between the heat sink and the article to be cooled, the heat absorption surface of the heat sink bears directly against the heat emission surface of the article to be cooled without an intermediate layer composed of air-displacing material, or, if necessary, with the use of an intermediate layer composed of air-displacing material that is thin.

Charging plug for a charging station for transferring electric energy and a charging system therefor
11584246 · 2023-02-21 · ·

A system for transferring electrical energy from a charging station to an electrical consumer including a charging plug connected to the charging station by a charging cable and a charging socket corresponding to the charging plug of the electrical consumer designed as a motor vehicle, wherein the motor vehicle is designed to receive a battery voltage at the charging socket and relay it, unchanged, to a vehicle battery, wherein the charging station is configured to receive a network voltage from a power grid and to relay it via a charging cable to the charging plug, and the charging plug is configured to convert the network voltage into the battery voltage by means of power electronics.

Charging plug for a charging station for transferring electric energy and a charging system therefor
11584246 · 2023-02-21 · ·

A system for transferring electrical energy from a charging station to an electrical consumer including a charging plug connected to the charging station by a charging cable and a charging socket corresponding to the charging plug of the electrical consumer designed as a motor vehicle, wherein the motor vehicle is designed to receive a battery voltage at the charging socket and relay it, unchanged, to a vehicle battery, wherein the charging station is configured to receive a network voltage from a power grid and to relay it via a charging cable to the charging plug, and the charging plug is configured to convert the network voltage into the battery voltage by means of power electronics.

Tubular heat spreaders for memory modules and memory modules incorporating the same

Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. An apparatus may have a printed circuit board (PCB) having an edge connector. At least one integrated circuit device may be disposed on a surface of the PCB. A tubular heat spreader may be disposed along an edge of the PCB opposite the edge connector.