This application is directed to cooling a semiconductor system. The semiconductor system includes a device substrate having a first surface and a second surface, an electronic component thermally coupled to the device substrate, and a cooling substrate coupled to the device substrate. The cooling substrate includes a third surface facing the second surface of the device substrate, a fourth surface opposite the third surface, and a plurality of vias between the third and fourth surfaces. The second surface and the third surface define a cavity therebetween, such that in use coolant flows from the fourth surface through the plurality of vias to exit at the third surface, enters the cavity between the second and third surfaces, and impinges on the second surface. At least a portion of one or more of the device substrate and the cooling substrate have similar coefficients of thermal expansion.

This application is directed to cooling a semiconductor system. The semiconductor system includes a device substrate having a first surface and a second surface, an electronic component thermally coupled to the device substrate, and a cooling substrate coupled to the device substrate. The cooling substrate includes a third surface facing the second surface of the device substrate, a fourth surface opposite the third surface, and a plurality of vias between the third and fourth surfaces. The second surface and the third surface define a cavity therebetween, such that in use coolant flows from the fourth surface through the plurality of vias to exit at the third surface, enters the cavity between the second and third surfaces, and impinges on the second surface. At least a portion of one or more of the device substrate and the cooling substrate have similar coefficients of thermal expansion.

An HVAC system includes a refrigerant liquid-gas separator. The liquid-gas separator is thermally coupled to electronics to transfer heat away from the electronics, and assist in vaporizing liquid refrigerant. The liquid-gas separator device includes a refrigeration section configured to couple to a refrigeration loop, and electronics thermally coupled to the refrigeration section. The refrigeration section includes: (a) a refrigerant inlet configured to receive refrigerant from the refrigeration loop; (b) a refrigerant outlet configured to release vapor refrigerant to the refrigeration loop; and (c) a cavity coupled to the refrigerant inlet and the refrigerant outlet, the cavity configured to separate liquid refrigerant from vapor refrigerant. During use of the HVAC system, heat from the electronics board is transferred to the refrigerant. The liquid-gas separator includes a check valve configured to inhibit flow of refrigerant into the liquid-gas separator device via the refrigerant outlet.

The present utility model relates to the technical field of heat dissipation devices, and in particular to an adjustable heat exchanger. The adjustable heat exchanger includes a fan assembly, a heatsink assembly, a semiconductor chilling plate and a conduction cooling unit connected in sequence, the conduction cooling unit includes a main conduction cooling plate and a conduction cooling fin, and the conduction cooling fin includes at least one conduction cooling sub-fin. The main conduction cooling plate is connected to the semiconductor chilling plate, the conduction cooling fin is movably connected to an outer peripheral wall of the main conduction cooling plate, the conduction cooling fin extends outward along the center of the main conduction cooling plate, and the conduction cooling fin and the main conduction cooling plate jointly form a contact surface for adapting to a heat-dispersing surface. The heat exchanger of the present utility model can adapt to hot surfaces with different curved surface radians, and form a surrounded fixed structure with the hot surface, thereby making the conduction cooling unit well contact surfaces with different radians.

The present utility model relates to the technical field of heat dissipation devices, and in particular to an adjustable heat exchanger. The adjustable heat exchanger includes a fan assembly, a heatsink assembly, a semiconductor chilling plate and a conduction cooling unit connected in sequence, the conduction cooling unit includes a main conduction cooling plate and a conduction cooling fin, and the conduction cooling fin includes at least one conduction cooling sub-fin. The main conduction cooling plate is connected to the semiconductor chilling plate, the conduction cooling fin is movably connected to an outer peripheral wall of the main conduction cooling plate, the conduction cooling fin extends outward along the center of the main conduction cooling plate, and the conduction cooling fin and the main conduction cooling plate jointly form a contact surface for adapting to a heat-dispersing surface. The heat exchanger of the present utility model can adapt to hot surfaces with different curved surface radians, and form a surrounded fixed structure with the hot surface, thereby making the conduction cooling unit well contact surfaces with different radians.

In a phase-change cooling apparatus including an indoor unit and an outdoor unit, a configuration to prevent dew condensation in the indoor unit causes the cooling performance to decrease; therefore, a refrigerant circulating apparatus according to an exemplary aspect of the present invention includes refrigerant-liquid thermal equilibrium means for mixing a first refrigerant liquid with a second refrigerant liquid and sending a reflux refrigerant liquid composed of the first refrigerant liquid and the second refrigerant liquid, the first refrigerant liquid being a liquid-phase refrigerant included in a gas-liquid two-phase refrigerant flowing in from heat receiving means, the second refrigerant liquid arising due to the gas-liquid two-phase refrigerant cooled by heat radiating means; a refrigerant passage configured for the gas-liquid two-phase refrigerant and the reflux refrigerant liquid to circulate between the heat receiving means and the refrigerant-liquid thermal equilibrium means; refrigerant-liquid reflux means for refluxing the reflux refrigerant liquid to the heat receiving means through the refrigerant passage; and refrigerant-liquid flow control means for controlling a flow rate of the reflux refrigerant liquid.

A solid state drive apparatus includes a casing including a top plate, a bottom plate, a first sidewall, and a second sidewall. A first substrate is disposed inside the casing. At least one first semiconductor chip is mounted on the first substrate. A second substrate is disposed inside the casing. At least one second semiconductor chip is mounted on the second substrate. A heat dissipation structure is disposed between the first substrate and the second substrate and includes a lower heat dissipation panel contacting the at least one first semiconductor chip. An upper heat dissipation panel contacts the at least one second semiconductor chip. An air passage is provided between the lower heat dissipation panel and the upper heat dissipation panel and extends from the first sidewall of the casing to the second sidewall.

A solid state drive apparatus includes a casing including a top plate, a bottom plate, a first sidewall, and a second sidewall. A first substrate is disposed inside the casing. At least one first semiconductor chip is mounted on the first substrate. A second substrate is disposed inside the casing. At least one second semiconductor chip is mounted on the second substrate. A heat dissipation structure is disposed between the first substrate and the second substrate and includes a lower heat dissipation panel contacting the at least one first semiconductor chip. An upper heat dissipation panel contacts the at least one second semiconductor chip. An air passage is provided between the lower heat dissipation panel and the upper heat dissipation panel and extends from the first sidewall of the casing to the second sidewall.

A thermal module includes a base seat, at least two heat pipes and multiple heat dissipation units. Each heat pipe has a heat absorption end and a heat dissipation end outward extending from the heat absorption end. The heat absorption ends are disposed on the base seat. The heat dissipation ends of the at least two heat pipes are positioned above the base seat at different heights and misaligned from each other. The multiple heat dissipation units are connected with the heat dissipation ends of the heat pipes and arranged at intervals. By means of arranging the multiple heat dissipation unit at intervals as multiple layers, the heat dissipation areas is enlarged to prevent the airflow from being interrupted so as to effectively greatly enhance the heat dissipation efficiency.

A cooling system for a built-in induction hob with an improved cooling efficiency, and a cooling method thereof. The cooling system comprises an air blower for generating an airflow according to a first direction, a heat-sink device through which air blown by the air blower is conveyed. The cooling system further comprises airflow deflecting means for deflecting said airflow from said first direction to a second direction which significantly deviates from said first direction.