A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.

A stretchable display panel, a preparation method therefor, and a display apparatus, relating to the technical field of display. Wherein the stretchable display panel includes an island region (01) disposed with a display apparatus (A), a bridge region (02) disposed with wiring (B), and a hole-region (03). A separation region (10) is disposed at an edge of the island region (01) and/or an edge of the bridge region (02). The separation region (10) includes a slope layer (11) and a plurality of isolation columns (12) disposed along a slope plane of the slope layer (11).

An electronic device is provided. The electronic device includes a display panel, a first connection member on which a display driver integrated circuit (DDIC) configured to control the display panel is disposed, a first contact point part disposed on the first connection member, a second contact point part spaced apart from the first contact point part in a second direction perpendicular to the first direction and disposed on the first contact point part, a second connection member disposed adjacent to the first connection member, a third contact point part arranged in the first direction and is disposed on the first layer of the second connection member to be connected to the first contact point part, and a fourth contact point part arranged in the first direction and is arranged on the second layer of the second connection member to be connected to the second contact point part.

Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.

An electronic device stretchable from a first state to a second state includes a substrate, a plurality of light emitting groups, and a plurality of signal pads. The substrate has a first region and a second region. The light emitting groups are disposed on the first region. The signal pads are disposed on the second region. When the electronic device is stretched from the first state to the second state, the first region has a first stretching ratio (R1) and the second region has a second stretching ratio (R2), and the first stretching ratio (R1) is greater than the second stretching ratio (R2).

An antenna substrate includes: a first substrate including an antenna pattern disposed on an upper surface of the first substrate; a second substrate having a first planar surface, an area of which is smaller than an area of a planar surface of the first substrate; and a flexible substrate connecting the first and second substrates to each other and bent to allow the first planar surface of the second substrate to face a side surface of the first substrate, which is perpendicular to the upper surface of the first substrate.

According to one embodiment, a flexible substrate includes a support plate including a first surface, a line portion including a flexible insulating base located on the first surface and a wiring layer disposed on the insulating base, and a protective member covering the line portion, and the wiring layer includes a first metal layer and a second metal layer stacked on the first metal layer, the second metal layer has a first film thickness in a first area and a second film thickness in a second area, and the second film thickness is greater than the first film thickness.

A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.

A light emitting device filament includes a substrate, a plurality of light emitting diodes, two electrode pads, and a plurality of connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extending in a first direction and having a width in a second direction. The plurality of light emitting diodes is disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The plurality of connection lines electrically connects the plurality of light emitting diodes and the two electrode pads. The plurality of connection lines includes a first connection line and a second connection line. The first connection line, the second connection line, or both are formed in a direction inclined or curved with respect to the first direction or the second direction.

A display module is described that has two or more front-facing camera modules at opposing edges of a computing device. Using images acquired by both camera modules, when a user is looking directly at the display, it is possible to generate an image of the user as though he/she was looking directly toward the lens of a camera module.